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    Ceramic lid for sealing semiconductor element and method of manufacturing the same
    1.
    发明授权
    Ceramic lid for sealing semiconductor element and method of manufacturing the same 失效
    用于密封半导体元件的陶瓷芯及其制造方法

    公开(公告)号：US5122862A

    公开(公告)日：1992-06-16

    申请号：US493399

    申请日：1990-03-14

    申请人： Takehiro Kajihara ,  Koichiro Maekawa ,  Toshio Ohashi

    发明人： Takehiro Kajihara ,  Koichiro Maekawa ,  Toshio Ohashi

    IPC分类号： H01L21/50 ,  H01L23/10

    CPC分类号： H01L23/10 ,  H01L21/50 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/09701 ,  H01L2924/16195

    摘要： A ceramic lid for sealing a semiconductor element and having a sealing surface which is to seal a semiconductor element within a recess of a ceramic package, by heating the recess with glass sealant and hermetically sealing the semiconductor element. The ceramic lid is made of alumina of high purity and to the sealing surface of the ceramic lid is applied a glass sealing aid which is pretreated at a higher temperature than the heating temperature for sealing the semiconductor element, before hermetically sealing the semiconductor element in the ceramic package. A method of manufacturing a ceramic lid for sealing a semiconductor element includes the steps of manufacturing the ceramic lid with alumina of high purity having a sealing surface with the recess of the ceramic package, wherein to the sealing surface of the ceramic lid is applied a glass sealing aid of 5-30 .mu.m in thickness onto a sealing surface of the ceramic lid with the ceramic package. The ceramic lid is heat-treated at a higher temperature than the sealing temperature of the semiconductor element. Thereafter a glass sealant is applied and dried on the glass sealing aid layer, and then calcined at a temperature lower than the airtight sealing temperature of the semiconductor element, thereby removing an organic binder contained in the glass sealant. A semiconductor element is then housed within a recess of the ceramic package and the ceramic lid and a glass sealant are heated to hermetically seal the ceramic lid with the semiconductor element in the recess to the ceramic package.

    Optical fiber connector
    6.
    发明授权
    Optical fiber connector 失效
    光纤连接器

    公开(公告)号：US5315678A

    公开(公告)日：1994-05-24

    申请号：US037007

    申请日：1993-03-25

    申请人： Koichiro Maekawa ,  Takashi Ota ,  Masashi Fukuyama ,  Shinji Nagasawa

    发明人： Koichiro Maekawa ,  Takashi Ota ,  Masashi Fukuyama ,  Shinji Nagasawa

    IPC分类号： G02B6/38 ,  G02B6/40

    CPC分类号： G02B6/3839

    摘要： Disclosed is an optical fiber connector for a plurality of covered optical fibers, including (a) a lower ceramics plate with a top plane surface having a plurality of V-grooves, each groove for respectively holding one fiber, (b) an upper plate, in spaced apart combination with the lower plate, for firmly holding the optical fibers in the lower plate grooves, and (c) a holder having two opposed end portions in which (i) a first cavity is profiled in the first end portion to accommodate the combination of the upper and lower plates, and (ii) a second cavity is profiled in the second end portion to accommodate the covered fibers, and wherein the first cavity has a connection portion proximate to an inner end of the second cavity, which connects the first and second cavities to provide a through passage for the fibers.

    摘要翻译： 公开了一种用于多个覆盖光纤的光纤连接器，其包括：（a）具有多个V形槽的顶面的下陶瓷板，用于分别保持一个光纤的每个槽，（b）上板， 与下板间隔开的组合，用于将光纤牢固地保持在下板槽中，以及（c）具有两个相对端部的保持器，其中（i）在第一端部中形成第一腔，以容纳 所述上板和下板的组合和（ii）第二腔在第二端部分成型以容纳被覆纤维，并且其中第一腔具有靠近第二腔的内端的连接部分， 第一和第二腔以提供用于纤维的通道。

    Method for producing polycrystalline translucent alumina having an excellent in-line transmission
    7.
    发明授权
    Method for producing polycrystalline translucent alumina having an excellent in-line transmission 失效
    具有优异的在线透射率的多晶半透明氧化铝的制造方法

    公开(公告)号：US4222978A

    公开(公告)日：1980-09-16

    申请号：US38771

    申请日：1979-05-14

    申请人： Isao Oda ,  Koichiro Maekawa

    发明人： Isao Oda ,  Koichiro Maekawa

    IPC分类号： H01J9/24 ,  C04B35/115 ,  H01J61/30 ,  C04B35/10

    CPC分类号： C04B35/115 ,  H01J61/302 ,  Y10S264/91

    摘要： Polycrystalline translucent alumina having an average grain size of alumina crystal grain being not smaller than 20.mu. and an average surface roughness of the fired body being not larger than 1/10 of the maximum grain size of alumina crystal grain and capable of being used for an envelope of a high pressure vapor discharge lamp, which is produced by shaping alumina composition powders consisting mainly of alumina into a given shape, primarily firing the shaped body under vacuum or in an atmosphere of hydrogen gas or dissociated ammonia gas at a temperature within 1,500.degree. C. and then secondarily firing the primarily fired body at a temperature of 1,650.degree.-1,900.degree. C., at least the temperature from 1,400.degree. C. to 1,700.degree. C. being raised at a rate of not lower than 200.degree. C./hr.

    摘要翻译： 具有氧化铝晶粒平均粒径的多晶半透明氧化铝不小于20微米，烧制体的平均表面粗糙度不大于氧化铝晶粒的最大晶粒尺寸的1/10，并且可用于 通过将主要由氧化铝组成的氧化铝组合物粉末成形为给定形状，主要是在真空下或在氢气或离解的氨气气氛中在1500℃以内的温度下焙烧成形体而制成的高压蒸气放电灯的外壳 C.然后在1,650℃-100℃的温度下二次焙烧主要烧制体，至少1400℃至1700℃的温度以不低于200℃的速度升高。 小时