摘要:
A dust core is prepared from an iron powder with a particle size of 75-200 .mu.m having added thereto 0.015-0.15 wt % of silica sol, 0.05-0.5 wt % of a silicone resin, and 10-50 wt % based on the silicone resin of an organic titanium compound. By subjecting the iron powder to a curing treatment at 50.degree.-250.degree. C., compacting the powder, and annealing in an inert atmosphere at 550.degree.-650.degree. C., there is obtained a dust core consisting essentially of iron powder particles with a particle size of 75-200 .mu.m, 0.03-0.1% by weight of Si, 15-210 ppm of Ti, and 300-2,500 ppm of oxygen.
摘要:
A ferromagnetic powder composition for dust cores contains a ferromagnetic metal powder and 0.1-15% by volume based on the powder of titania sol and/or zirconia sol. The composition is pressure molded and desirably annealed into a dust core which exhibits a high magnetic flux density, low coercivity, low loss and high mechanical strength.
摘要:
A printing and drying method comprising laying a support sheet 20 elongated in the long direction so as to bridge both a printing zone 42 and a drying zone 44, in the printing zone 42, giving the support sheet 20 a first tension F1, in that state, printing the support sheet 20 with predetermined patterns, then feeding the support sheet 20 toward the drying zone 44, in the drying zone 44, giving the support sheet 20 on which the predetermined patterns were printed a second tension F2, and in that state, drying it in a drying chamber 62. The first tension F1 and the second tension F2 are given by separate tension giving means, and the second tension F2 is tension given along the support sheet 20 in the long direction and able to prevent shrinkage of the support sheet 20 in the long direction while passing through the drying zone 44.
摘要:
It is an object of the present invention is to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can prevent a ceramic green sheet from being deformed and destroyed and prevent a solvent contained in an electrode paste from sinking into a ceramic green sheet, thereby enabling manufacture of a multi-layered unit including a ceramic green sheet and an electrode layer laminated to each other in a desired manner. The method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component according to the present invention includes a step of forming a ceramic green sheet on the surface of a first carrier film including a surface-treated region and non-surface-treated regions on which no surface treatment is performed on both sides of the surface-treated region, a step of forming a release layer on the surface of a second carrier film having a width substantially equal to that of the first carrier film, a step of forming an electrode layer in a predetermined pattern and a spacer layer in a complementary pattern to that of the electrode layer on the surface of the release layer, thereby forming an inner electrode layer, a step of forming an adhesive layer on the surface of a third carrier film having a width substantially equal to that of the first carrier film, a step of transferring the adhesive layer formed on the surface of the third carrier film onto the surface of the ceramic green sheet, and a step of transferring the inner electrode layer formed on the surface of the second carrier film onto the adhesive layer formed on the surface of the ceramic green sheet, thereby fabricating a multi-layered unit including the ceramic green sheet and the inner electrode layer laminated onto each other, wherein the adhesive layer is formed by coating the surface of the third carrier film with an adhesive agent solution so that the width of the adhesive layer is narrower than that of the third carrier film by at least 2a where α is a positive value, wider than the width of the ceramic green sheet formed on the surface of the first carrier film and the widths of the release layer and the inner electrode layer formed on the surface of the second carrier film by at least 2a and wider than the width of the surface-treated region of the first carrier film at least 2a.
摘要:
A printing and drying method comprising laying a support sheet 20 elongated in the long direction so as to bridge both a printing zone 42 and a drying zone 44, in the printing zone 42, giving the support sheet 20 a first tension F1, in that state, printing the support sheet 20 with predetermined patterns, then feeding the support sheet 20 toward the drying zone 44, in the drying zone 44, giving the support sheet 20 on which the predetermined patterns were printed a second tension F2, and in that state, drying it in a drying chamber 62. The first tension F1 and the second tension F2 are given by separate tension giving means, and the second tension F2 is tension given along the support sheet 20 in the long direction and able to prevent shrinkage of the support sheet 20 in the long direction while passing through the drying zone 44.
摘要:
It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component. The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of laminating a plurality of multi-layered units each formed by laminating a ceramic green sheet, an electrode layer and a release layer on a support sheet in this order, the method further including steps of positioning the multi-layered unit on a base substrate so that the surface of the release layer is contact with an agglutinant layer formed on the surface of the base substrate in such a manner that the bonding strength between itself and the support substrate is higher than the bonding strength between the support sheet and the ceramic green sheet and lower than the bonding strength between itself and the release layer, pressing it and laminating multi-layered units on the base substrate.
摘要:
It is an object of the present invention is to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can prevent a ceramic green sheet from being deformed and destroyed and prevent a solvent contained in an electrode paste from sinking into a ceramic green sheet, thereby enabling manufacture of a multi-layered unit including a ceramic green sheet and an electrode layer laminated to each other in a desired manner.
摘要:
A method for manufacturing a multi-layered ceramic electronic component includes positioning a multi-layered unit including a release layer, an electrode layer and a ceramic green sheet formed on a support sheet in such a manner that the surface of the multi-layered unit is located on a base substrate and a step of pressing the multi-layered unit toward the base substrate, thereby laminating the multi-layered unit on the base substrate, and employs as the base substrate a base substrate having such surface roughness as to include per 0.01 mm2 thereof not more than one protrusion that can penetrate the ceramic green sheet of the multi-layered unit laminated on the base substrate to half or more the thickness of the ceramic green sheet and include per 100 mm2 thereof not more than one protrusion that can completely penetrate the ceramic green sheet.
摘要:
It is an object of the present invention is to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can prevent a ceramic green sheet from being deformed and destroyed and prevent a solvent contained in an electrode paste from sinking into a ceramic green sheet, thereby enabling manufacture of a multi-layered unit including a ceramic green sheet and an electrode layer laminated to each other in a desired manner. The method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component according to the present invention includes a step of forming a ceramic green sheet on the surface of a first carrier film, a step of forming a release layer on the surface of a second carrier film including a surface-treated region on which a surface treatment is performed for improving releasability and non-surface-treated regions on which no surface treatment is performed on both sides of the surface-treated region and having a width substantially equal to that of the first carrier film, a step of forming an electrode layer in a predetermined pattern and a spacer layer in a complementary pattern to that of the electrode layer on the surface of the release layer, thereby forming an inner electrode layer, a step of forming an adhesive layer on the surface of a third carrier film having a width substantially equal to that of the second carrier film, a step of transferring the adhesive layer formed on the third carrier film onto the surface of the inner electrode layer, and a step of transferring the ceramic green sheet formed on the surface of the first carrier film onto the adhesive layer transferred on the surface of the inner electrode layer formed on the surface of the second carrier film, thereby fabricating a multi-layered unit including the ceramic green sheet and the inner electrode layer laminated onto each other, wherein the adhesive layer is formed by coating the surface of the third carrier film with an adhesive agent solution so that the width of the adhesive layer is narrower than the width of the third carrier film by at least 2α where α is a positive value, wider than the width of the ceramic green sheet formed on the surface of the first carrier film and the widths of the release layer and the inner electrode layer formed on the surface of the second carrier film by at least 2α and wider than the width of the surface-treated region of the second carrier film by at least 2α.
摘要:
It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component.The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of laminating a plurality of multi-layered units each formed by laminating a release layer, an electrode layer and a ceramic green sheet on a support sheet in this order, the method further including steps of positioning the multi-layered unit on a base substrate so that the surface of the ceramic green sheet is contact with an agglutinant layer formed on the surface of the base substrate in such a manner that the bonding strength between itself and the support substrate is higher than the bonding strength between the support sheet and the release layer and lower than the bonding strength between itself and the ceramic green sheet, pressing it and laminating multi-layered units on the base substrate.