公开(公告)号：US20050004303A1

公开(公告)日：2005-01-06

申请号：US10495656

申请日：2002-12-19

申请人： Takeshi Miyakawa ,  Katsuhisa Ogita ,  Masafumi Hiura ,  Minoru Oda

发明人： Takeshi Miyakawa ,  Katsuhisa Ogita ,  Masafumi Hiura ,  Minoru Oda

IPC分类号： C08K3/04 ,  C08L23/04 ,  C08L25/06 ,  C08L53/02 ,  C08L55/02 ,  C08L71/12 ,  H01L23/29 ,  C08L25/00

CPC分类号： H01L23/293 ,  C08K3/04 ,  C08L23/04 ,  C08L25/06 ,  C08L53/02 ,  C08L55/02 ,  C08L71/123 ,  H01L2924/0002 ,  Y10S428/922 ,  C08L2666/02 ,  C08L2666/04 ,  C08L2666/24 ,  H01L2924/00

摘要： An electroconductive resin composition useful for packaging an electronic device, is provided, whereby a drawback that carbon black is likely to fall off from the surface of a molded product by abrasion, has been overcome. It is an electroconductive resin composition which comprises at least one thermoplastic resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin and an ABS resin, and carbon black and which contains a styrene/butadiene/butylene/styrene block copolymer or a mixture of such a copolymer with an olefinic resin, and has a surface resistivity of from 102 to 1010 Ω. Contamination of IC, etc., to be caused by falling off of carbon black, etc. by abrasion when contacted with IC, etc., can be substantially reduced.

摘要翻译： 提供了一种用于封装电子器件的导电树脂组合物，其中炭黑很可能通过磨损从模制产品的表面脱落的缺点。 它是一种导电树脂组合物，其包含至少一种选自聚苯醚树脂，聚苯乙烯树脂和ABS树脂的热塑性树脂和炭黑，并含有苯乙烯/丁二烯/丁烯/苯乙烯嵌段共聚物或 这种共聚物与烯烃树脂的混合物，其表面电阻率为10 -2 10 -10Ω。 可以显着地降低与IC等接触时通过磨损而脱落的炭黑等导致的IC等的污染。

公开(公告)号：US07261840B2

公开(公告)日：2007-08-28

申请号：US10495656

申请日：2002-12-19

申请人： Takeshi Miyakawa ,  Katsuhisa Ogita ,  Masafumi Hiura ,  Minoru Oda

发明人： Takeshi Miyakawa ,  Katsuhisa Ogita ,  Masafumi Hiura ,  Minoru Oda

IPC分类号： H01B1/24

CPC分类号： H01L23/293 ,  C08K3/04 ,  C08L23/04 ,  C08L25/06 ,  C08L53/02 ,  C08L55/02 ,  C08L71/123 ,  H01L2924/0002 ,  Y10S428/922 ,  C08L2666/02 ,  C08L2666/04 ,  C08L2666/24 ,  H01L2924/00

摘要： An electroconductive resin composition useful for packaging an electronic device, is provided, whereby a drawback that carbon black is likely to fall off from the surface of a molded product by abrasion, has been overcome. It is an electroconductive resin composition which comprises at least one thermoplastic resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin and an ABS resin, and carbon black and which contains a styrene/butadiene/butylene/styrene block copolymer or a mixture of such a copolymer with an olefinic resin, and has a surface resistivity of from 102 to 1010 Ω. Contamination of IC, etc., to be caused by falling off of carbon black, etc. by abrasion when contacted with IC, etc., can be substantially reduced.

摘要翻译： 提供了一种用于封装电子器件的导电树脂组合物，其中炭黑很可能通过磨损从模制产品的表面脱落的缺点。 它是一种导电树脂组合物，其包含至少一种选自聚苯醚树脂，聚苯乙烯树脂和ABS树脂的热塑性树脂和炭黑，并含有苯乙烯/丁二烯/丁烯/苯乙烯嵌段共聚物或 这种共聚物与烯烃树脂的混合物，并且具有10 2至10 10Ω的表面电阻率。 可以显着地降低与IC等接触时通过磨损而脱落的炭黑等导致的IC等的污染。

公开(公告)号：US07014896B1

公开(公告)日：2006-03-21

申请号：US10030103

申请日：2000-11-27

申请人： Takeshi Miyakawa ,  Mikio Shimizu ,  Yuichi Kadoya ,  Masafumi Hiura ,  Minoru Oda

发明人： Takeshi Miyakawa ,  Mikio Shimizu ,  Yuichi Kadoya ,  Masafumi Hiura ,  Minoru Oda

IPC分类号： B29D22/00 ,  B29D23/00

CPC分类号： C08L67/02 ,  B32B27/36 ,  Y10T428/1352 ,  Y10T428/2817 ,  Y10T428/31507 ,  C08L69/00

摘要： An electronic component packaging container which comprises a multilayer polyester sheet having a base layer comprising a polyethylene terephthalate type resin and a polycarbonate type resin and a surface layer comprising a polycarbonate type resin, formed on at least one side of the base layer, wherein the base layer contains from 70 to 97 wt % of the polyethylene terephthalate type resin and from 3 to 30 wt % of the polycarbonate type resin based on the total amount of the polyethylene terephthalate type resin and the polycarbonate type resin, and the thickness of the surface layer is from 10 to 30% of the total thickness.

摘要翻译： 一种电子部件包装容器，其包括形成在所述基底层的至少一侧上的具有包含聚对苯二甲酸乙二醇酯型树脂和聚碳酸酯型树脂的基层和包含聚碳酸酯型树脂的表层的多层聚酯片，其中， 基于聚对苯二甲酸乙二醇酯型树脂和聚碳酸酯型树脂的总量，层包含70至97重量％的聚对苯二甲酸乙二醇酯型树脂和3至30重量％的聚碳酸酯树脂，并且表层的厚度 为总厚度的10〜30％。

公开(公告)号：US07199187B2

公开(公告)日：2007-04-03

申请号：US10494375

申请日：2002-11-15

申请人： Takeshi Miyakawa ,  Minoru Oda ,  Masafumi Hiura

发明人： Takeshi Miyakawa ,  Minoru Oda ,  Masafumi Hiura

IPC分类号： B32B27/30

CPC分类号： B32B27/18 ,  B32B1/02 ,  B32B25/00 ,  B32B25/02 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B27/302 ,  B32B27/306 ,  B32B27/32 ,  B32B2323/04 ,  B32B2323/10 ,  B32B2331/04 ,  B32B2355/02 ,  B32B2439/00 ,  C08L9/00 ,  C08L25/06 ,  C08L2205/02 ,  C08L2205/03 ,  Y10T428/12347 ,  Y10T428/1317 ,  Y10T428/1359 ,  Y10T428/15 ,  Y10T428/19 ,  Y10T428/249939 ,  Y10T428/31909 ,  Y10T428/31938 ,  C08L2666/08

摘要： A sheet excellent in mechanical performance such as folding endurance is provided. A sheet having a substrate layer using an impact-resistant styrene type resin containing 2 to 15 wt % of rubber particles having a peak at less than 2 μm and an impact-resistant styrene type resin containing 0.2 to 10 wt % of rubber particles having a peak at 2 μm or more in a distribution of volume-based particle diameters, or a sheet having a substrate layer comprising an impact-resistant styrene type resin (A) containing 10 to 15 wt % of rubber having a volume average particle diameter of from 0.5 μm to 1.5 μm and an impact-resistant styrene type resin (B) containing 5 to 10 wt % of rubber having a volume average particle diameter of from 2.0 μm to 3.0 μm wherein (A) is from 50 to 95 wt % and (B) is from 5 to 50 wt % on the basis of the total amount of both components, and a surface layer formed on at least its one surface, is provided.

摘要翻译： 提供了诸如耐折性能的机械性能优异的片材。 使用含有2〜15重量％的具有小于2μm的峰的橡胶粒子的耐冲击苯乙烯类树脂的基材层和含有0.2〜10重量％的橡胶粒子的耐冲击苯乙烯类树脂， 以体积为基准的粒径分布为2μm以上的峰，或具有包含10〜15重量％体积平均粒径的橡胶的耐冲击苯乙烯类树脂（A）的基材层的片材， 0.5〜1.5μm的橡胶和5〜10重量％的体积平均粒径为2.0〜3.0μm的橡胶的耐冲击苯乙烯类树脂（B），其中（A）为50〜95重量％，（A）为50〜 B）基于两种组分的总量为5至50重量％，并且至少在其一个表面上形成表面层。