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42 条记录 (耗时 0.025 秒)

    Packaging container for electronic part
    1.
    发明授权
    Packaging container for electronic part 失效
    电子部件包装容器

    公开(公告)号：US07014896B1

    公开(公告)日：2006-03-21

    申请号：US10030103

    申请日：2000-11-27

    申请人： Takeshi Miyakawa ,  Mikio Shimizu ,  Yuichi Kadoya ,  Masafumi Hiura ,  Minoru Oda

    发明人： Takeshi Miyakawa ,  Mikio Shimizu ,  Yuichi Kadoya ,  Masafumi Hiura ,  Minoru Oda

    IPC分类号： B29D22/00 ,  B29D23/00

    CPC分类号： C08L67/02 ,  B32B27/36 ,  Y10T428/1352 ,  Y10T428/2817 ,  Y10T428/31507 ,  C08L69/00

    摘要： An electronic component packaging container which comprises a multilayer polyester sheet having a base layer comprising a polyethylene terephthalate type resin and a polycarbonate type resin and a surface layer comprising a polycarbonate type resin, formed on at least one side of the base layer, wherein the base layer contains from 70 to 97 wt % of the polyethylene terephthalate type resin and from 3 to 30 wt % of the polycarbonate type resin based on the total amount of the polyethylene terephthalate type resin and the polycarbonate type resin, and the thickness of the surface layer is from 10 to 30% of the total thickness.

    摘要翻译： 一种电子部件包装容器，其包括形成在所述基底层的至少一侧上的具有包含聚对苯二甲酸乙二醇酯型树脂和聚碳酸酯型树脂的基层和包含聚碳酸酯型树脂的表层的多层聚酯片，其中， 基于聚对苯二甲酸乙二醇酯型树脂和聚碳酸酯型树脂的总量，层包含70至97重量％的聚对苯二甲酸乙二醇酯型树脂和3至30重量％的聚碳酸酯树脂，并且表层的厚度 为总厚度的10〜30％。

    Electroconductive resin composition
    3.
    发明授权
    Electroconductive resin composition 有权
    导电树脂组合物

    公开(公告)号：US07261840B2

    公开(公告)日：2007-08-28

    申请号：US10495656

    申请日：2002-12-19

    申请人： Takeshi Miyakawa ,  Katsuhisa Ogita ,  Masafumi Hiura ,  Minoru Oda

    发明人： Takeshi Miyakawa ,  Katsuhisa Ogita ,  Masafumi Hiura ,  Minoru Oda

    IPC分类号： H01B1/24

    CPC分类号： H01L23/293 ,  C08K3/04 ,  C08L23/04 ,  C08L25/06 ,  C08L53/02 ,  C08L55/02 ,  C08L71/123 ,  H01L2924/0002 ,  Y10S428/922 ,  C08L2666/02 ,  C08L2666/04 ,  C08L2666/24 ,  H01L2924/00

    摘要： An electroconductive resin composition useful for packaging an electronic device, is provided, whereby a drawback that carbon black is likely to fall off from the surface of a molded product by abrasion, has been overcome. It is an electroconductive resin composition which comprises at least one thermoplastic resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin and an ABS resin, and carbon black and which contains a styrene/butadiene/butylene/styrene block copolymer or a mixture of such a copolymer with an olefinic resin, and has a surface resistivity of from 102 to 1010 Ω. Contamination of IC, etc., to be caused by falling off of carbon black, etc. by abrasion when contacted with IC, etc., can be substantially reduced.

    摘要翻译： 提供了一种用于封装电子器件的导电树脂组合物，其中炭黑很可能通过磨损从模制产品的表面脱落的缺点。 它是一种导电树脂组合物，其包含至少一种选自聚苯醚树脂，聚苯乙烯树脂和ABS树脂的热塑性树脂和炭黑，并含有苯乙烯/丁二烯/丁烯/苯乙烯嵌段共聚物或 这种共聚物与烯烃树脂的混合物，并且具有10 2至10 10Ω的表面电阻率。 可以显着地降低与IC等接触时通过磨损而脱落的炭黑等导致的IC等的污染。

    Sheet
    4.
    发明授权
    Sheet 有权
    片

    公开(公告)号：US07199187B2

    公开(公告)日：2007-04-03

    申请号：US10494375

    申请日：2002-11-15

    申请人： Takeshi Miyakawa ,  Minoru Oda ,  Masafumi Hiura

    发明人： Takeshi Miyakawa ,  Minoru Oda ,  Masafumi Hiura

    IPC分类号： B32B27/30

    CPC分类号： B32B27/18 ,  B32B1/02 ,  B32B25/00 ,  B32B25/02 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B27/302 ,  B32B27/306 ,  B32B27/32 ,  B32B2323/04 ,  B32B2323/10 ,  B32B2331/04 ,  B32B2355/02 ,  B32B2439/00 ,  C08L9/00 ,  C08L25/06 ,  C08L2205/02 ,  C08L2205/03 ,  Y10T428/12347 ,  Y10T428/1317 ,  Y10T428/1359 ,  Y10T428/15 ,  Y10T428/19 ,  Y10T428/249939 ,  Y10T428/31909 ,  Y10T428/31938 ,  C08L2666/08

    摘要： A sheet excellent in mechanical performance such as folding endurance is provided. A sheet having a substrate layer using an impact-resistant styrene type resin containing 2 to 15 wt % of rubber particles having a peak at less than 2 μm and an impact-resistant styrene type resin containing 0.2 to 10 wt % of rubber particles having a peak at 2 μm or more in a distribution of volume-based particle diameters, or a sheet having a substrate layer comprising an impact-resistant styrene type resin (A) containing 10 to 15 wt % of rubber having a volume average particle diameter of from 0.5 μm to 1.5 μm and an impact-resistant styrene type resin (B) containing 5 to 10 wt % of rubber having a volume average particle diameter of from 2.0 μm to 3.0 μm wherein (A) is from 50 to 95 wt % and (B) is from 5 to 50 wt % on the basis of the total amount of both components, and a surface layer formed on at least its one surface, is provided.

    摘要翻译： 提供了诸如耐折性能的机械性能优异的片材。 使用含有2〜15重量％的具有小于2μm的峰的橡胶粒子的耐冲击苯乙烯类树脂的基材层和含有0.2〜10重量％的橡胶粒子的耐冲击苯乙烯类树脂， 以体积为基准的粒径分布为2μm以上的峰，或具有包含10〜15重量％体积平均粒径的橡胶的耐冲击苯乙烯类树脂（A）的基材层的片材， 0.5〜1.5μm的橡胶和5〜10重量％的体积平均粒径为2.0〜3.0μm的橡胶的耐冲击苯乙烯类树脂（B），其中（A）为50〜95重量％，（A）为50〜 B）基于两种组分的总量为5至50重量％，并且至少在其一个表面上形成表面层。

    Sheet and electronic component packaging container
    5.
    发明授权
    Sheet and electronic component packaging container 有权
    板和电子元件包装容器

    公开(公告)号：US07097900B2

    公开(公告)日：2006-08-29

    申请号：US10343308

    申请日：2002-06-14

    申请人： Minoru Oda ,  Katsuhisa Ogita ,  Takeshi Miyakawa ,  Tetsuo Fujimura ,  Mikio Shimizu

    发明人： Minoru Oda ,  Katsuhisa Ogita ,  Takeshi Miyakawa ,  Tetsuo Fujimura ,  Mikio Shimizu

    IPC分类号： B32B27/18 ,  B32B27/30 ,  B32B27/32 ,  B32B33/00 ,  B65D85/00

    CPC分类号： B32B27/08 ,  Y10T428/24942 ,  Y10T428/265 ,  Y10T428/31507 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31855 ,  Y10T428/31935 ,  Y10T428/31938

    摘要： In order to prevent static electricity impairment of an electronic component, a layer at the surface of a container to be in contact with an electronic component is one having a relatively high surface resistivity, a layer having a higher electrical conductivity than that is laminated below it, and the surface resistivity of the layer at the surface is higher than that of the layer below it. It is considered that in an electronic component packaging container having such a constitution, static electricity electrified on an electronic component is gradually discharged from the electronic component to the surface of the electronic component packaging container without sudden discharge, thus preventing the static electricity impairment. The surface layer preferably comprises a material close to the electronic component in the series of frictional electrification.

    摘要翻译： 为了防止电子部件的静电损伤，与电子部件接触的容器表面的层是具有比较高的表面电阻率的层，具有比层压在其下方的电导率高的层 ，表面层的表面电阻率高于其下面的层的表面电阻率。 认为在具有这种结构的电子部件包装容器中，电气部件上带电的静电从电子部件逐渐排出到电子部件包装容器的表面而不会突然放电，从而防止静电损伤。 表面层优选地包括在一系列摩擦带电中靠近电子部件的材料。

    Conductive composite plastic sheet and container
    10.
    发明授权
    Conductive composite plastic sheet and container 失效
    导电复合塑料片和容器

    公开(公告)号：US5747164A

    公开(公告)日：1998-05-05

    申请号：US579579

    申请日：1995-12-26

    申请人： Takeshi Miyakawa ,  Mikio Shimizu ,  Takeshi Nabeta

    发明人： Takeshi Miyakawa ,  Mikio Shimizu ,  Takeshi Nabeta

    IPC分类号： B32B27/20 ,  B32B9/04

    CPC分类号： B32B27/20 ,  Y10T428/13 ,  Y10T428/31504

    摘要： An electroconductive composite plastic sheet comprising a substrate sheet made of at least one thermoplastic resin selected from the group consisting of a polyphenylene ether type resin, a polystyrene type resin and an ABS type resin and having laminated on each side of the substrate sheet, an electroconductive resin composition comprising (A) at least one thermoplastic resin selected from the group consisting of a polyphenylene ether type resin, a polystyrene type resin and an ABS type resin, (B) carbon black, and (C) an olefin type resin or (C1) a resin obtained by hydrogenation of a styrene/diene block copolymer, said electroconductive resin composition containing from 5 to 50 parts by weight of (B) the carbon black per 100 parts by weight of (A) the thermoplastic resin, and from 1 to 30 parts by weight of (C) the olefin type resin or (C1) the resin obtained by hydrogenation of a styrene/diene block copolymer, per 100 parts by weight of the total amount of (A) the thermoplastic resin and (B) the carbon black, and the sheet having the electroconductive resin composition laminated on each side thereof having a surface resistivity of from 10.sup.2 to 10.sup.10 .OMEGA..

    摘要翻译： 一种导电复合塑料片，其包含由至少一种选自由聚苯醚型树脂，聚苯乙烯类树脂和ABS型树脂组成的组中的热塑性树脂制成并且在基片的每一侧层压的基片， 树脂组合物，其包含（A）选自聚苯醚型树脂，聚苯乙烯类树脂和ABS型树脂中的至少一种热塑性树脂，（B）炭黑和（C）烯烃类树脂或（C1 ）通过苯乙烯/二烯嵌段共聚物的氢化获得的树脂，所述导电树脂组合物每100重量份的（A）热塑性树脂含有5至50重量份的（B）炭黑，并且从1至 30重量份（C）烯烃类树脂或（C1）通过苯乙烯/二烯嵌段共聚物氢化得到的树脂，相对于（A）热塑性树脂的总量100重量份 n和（B）炭黑，并且其表面电阻率为102〜1010欧姆每一面层叠有导电树脂组合物的片材。