公开(公告)号：US06742694B2

公开(公告)日：2004-06-01

申请号：US10074718

申请日：2002-02-13

申请人： Takuya Satoh ,  Tatsumi Tsuchiya ,  Yasuhiro Mita ,  Lan Shi ,  Hiroyoshi Yokome ,  Tatsushi Yoshida ,  Surya Pattanaik

发明人： Takuya Satoh ,  Tatsumi Tsuchiya ,  Yasuhiro Mita ,  Lan Shi ,  Hiroyoshi Yokome ,  Tatsushi Yoshida ,  Surya Pattanaik

IPC分类号： B23K100

CPC分类号： G11B5/486 ,  B23K1/0056 ,  B23K3/0623 ,  B23K3/08 ,  B23K2101/40 ,  B23K2101/42 ,  H05K3/3442 ,  H05K3/3478

摘要： An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.

摘要翻译： 一种装置将滑块的接合焊盘和引线的引线垫连接在头部万向节组件中，以提高焊球配置装置的效率，小型化和维护，以及用于回流焊球的焊球回流装置。 焊球配置装置从通过吸盘抽真空的焊球供给装置的焊球排出孔排出焊球。 用于形成无活性气氛的环境空间和惰性气体供应部分形成在桌子上以从光学单元消除惰性气体供应单元，使得会聚的激光束直接辐射到焊球上。

公开(公告)号：US07210221B2

公开(公告)日：2007-05-01

申请号：US10929512

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： B23P19/02

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US07380329B2

公开(公告)日：2008-06-03

申请号：US10929322

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B5/48

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A method of assembling a head gimbal assembly. The method comprises a series of steps which include: stacking a base plate, a load beam, and a flexure to form a three-layered stacked series with at least a bottom layer being a base plate series; joining portions of the load beam to the base plate, and the flexure to the load beam in the three-layered stacked series to make a suspension section; attaching a slider to the flexure in the suspension section to make a head gimbal assembly; load-bending a hinge portion formed in the head gimbal assembly; and heating the hinge portion in order to adjust a bending load on the hinge portion at a predetermined bending angle to a predetermined value.

摘要翻译： 头部万向节组件的组装方法。 该方法包括一系列步骤，其包括：堆叠基板，负载梁和挠曲件以形成至少底层为基板系列的三层堆叠系列; 将所述负载梁的部分接合到所述基板，并且将所述弯曲部分连接到所述三层堆叠系列中的所述负载梁以形成悬挂部; 将滑块附接到悬架部分中的挠曲件以制造头部万向节组件; 负载弯曲形成在头部万向节组件中的铰链部分; 并加热铰链部分，以便以预定的弯曲角度将铰链部分上的弯曲载荷调整到预定值。

公开(公告)号：US07161766B2

公开(公告)日：2007-01-09

申请号：US10929507

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B5/48

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. The base plate structure comprises a band portion having conveying holes and positioning holes formed at a predetermined pith respectively in a longitudinal direction. A plurality of the base plates are disposed via connecting portions integrally formed at a predetermined pitch at edges on one side of the band portion.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 基板结构包括具有分别在纵向方向上形成在预定的髓上的输送孔和定位孔的带部分。 多个基板通过在带部分的一侧的边缘处以预定间距整体形成的连接部分设置。

公开(公告)号：US20050024777A1

公开(公告)日：2005-02-03

申请号：US10929507

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B21/21 ,  G11B5/48 ,  G11B21/20

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

公开(公告)号：US20050022372A1

公开(公告)日：2005-02-03

申请号：US10929512

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B21/21 ,  G11B5/48 ,  G11B21/20 ,  B23P19/00

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US06823581B2

公开(公告)日：2004-11-30

申请号：US09989633

申请日：2001-11-20

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： B23P1902

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US20050028353A1

公开(公告)日：2005-02-10

申请号：US10929322

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B21/21 ,  G11B5/48 ,  G11B21/20 ,  G11B5/012 ,  G11B17/00

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assemblingjigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要其数量至少等于在各个组装过程中保留的未完成的HG组件的数量的组装。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US06366431B1

公开(公告)日：2002-04-02

申请号：US09430995

申请日：1999-11-01

申请人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Naoki Fujii

发明人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Naoki Fujii

IPC分类号： G11B548

CPC分类号： G11B5/4826

摘要： The object of the present invention is to provide a structure of a head supporting arm for preventing a read/write head from being damaged during a heating process for bonding a slider to a flexure and a method for fabricating the head supporting arm with preventing the read/write head from being damaged during the heating process. A head supporting arm of the present invention comprises: a load beam, a flexure including a portion coupled to said load beam and a bonding portion; and a slider bonded on said bonding portion by an adhesive; wherein said bonding portion of said flexure includes an edge placed on a surface of said slider; and wherein an exposing aperture, which exposes both a portion of a surface region, including said one edge, of said bonding portion and a portion of said surface of said slider, is formed on said load beam.

摘要翻译： 本发明的目的是提供一种用于防止读/写头在用于将滑块接合到挠曲件的加热过程中被损坏的头部支撑臂的结构以及用于制造头部支撑臂的方法，以防止读取 /写头在加热过程中被损坏。 本发明的头部支撑臂包括：负载梁，挠曲件，其包括联接到所述负载梁的部分和接合部分; 以及通过粘合剂粘结在所述接合部分上的滑块; 其中所述挠曲件的所述接合部分包括放置在所述滑块的表面上的边缘; 并且其中在所述负载梁上形成暴露孔，所述曝光孔暴露所述结合部分的所述一个边缘的表面区域的一部分和所述滑块的所述表面的一部分。

公开(公告)号：US4755721A

公开(公告)日：1988-07-05

申请号：US26331

申请日：1987-03-16

申请人： Toshiyuki Okada ,  Hiroyoshi Yokome ,  Akira Kosasa ,  Tomoyuki Habu ,  Yasuharu Yamamoto

发明人： Toshiyuki Okada ,  Hiroyoshi Yokome ,  Akira Kosasa ,  Tomoyuki Habu ,  Yasuharu Yamamoto

IPC分类号： H01J61/18 ,  H01J61/82 ,  H01J61/20

CPC分类号： H01J61/18 ,  H01J61/82 ,  H01J61/825

摘要： This invention discloses a high pressure sodium vapor lamp having unsaturated vapor pressure type characteristics with sodium and mercury contained in an arc tube. The sodium is enclosed in an amount sufficient to exhibit unsaturated vapor pressure type characteristics while the mercury is enclosed in an amount M.sub.Hg calculated by the following formula: ##EQU1## where M.sub.Hg : the amount of mercury enclosed (mg)D: the internal diameter of the arc tube (cm)L: the electrode-to-electrode distance (cm)V.sub.olume : the volume of the arc tube (cc)V.sub.n : the rated lamp voltage (Volt).