公开(公告)号：US06921974B2

公开(公告)日：2005-07-26

申请号：US10400803

申请日：2003-03-28

申请人： Tan Hien Boon ,  Liu Hao ,  Park Soo Gil

发明人： Tan Hien Boon ,  Liu Hao ,  Park Soo Gil

IPC分类号： H01L23/433 ,  H01L23/495 ,  H01L23/34

CPC分类号： H01L23/4334 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

摘要： A plastic ball grid array package has a heat slug which is placed onto the substrate, which has the semiconductor device attached, prior to encapsulation. The heat transfer member is initially located by guide pins and fixed in place by the encapsulation.

摘要翻译： 塑料球栅阵列封装具有在封装之前放置在具有半导体器件的衬底上的散热块。 传热构件最初由引导销定位，并通过封装固定就位。