摘要:
Printed circuit board (PCB) positioning spacers in an optoelectronic module. In one example embodiment, an optoelectronic module includes a housing comprising a top shell and a bottom shell, top and bottom printed circuit boards (PCBs) at least partially enclosed within the housing, and a spacer positioned between the first and second PCBs. The spacer includes top and bottom surfaces, a plurality of top posts extending from the top surface, and a bottom post extending from the bottom surface. The top posts extend through openings in the top PCB to contact one or more inside surfaces of the top shell. The bottom post extends through an opening in the bottom PCB to contact an inside surface of the bottom shell.
摘要:
Printed circuit board (PCB) positioning in an optoelectronic module. In one example embodiment, a spacer can be use to position top and bottom PCBs that are at least partially enclosed within top and bottom shells of an optoelectronic module. The spacer includes top and bottom surfaces and a plurality of top posts extending from the top surface. The top posts are configured to extend through openings in the top PCB to contact inside surfaces of the top shell.
摘要:
An electromagnetic radiation shield for an electronic module. In one example embodiment, an EMR shield for an electronic transceiver module includes a conductive carrier sized and configured to surround a shell of an electronic transceiver module. The conductive carrier defines a plurality of extended elements located on at least one edge of the conductive carrier and an orientation element. Each extended element is configured to bias against the shell in order to create a physical and electrical contact between the conductive carrier and the shell. The orientation element is configured to engage a corresponding structure in the shell in order to correctly orient the conductive carrier with respect to the shell.
摘要:
One embodiment includes communications module having a release slide and a boot. The release slide includes a main body, a plurality of arms, and a plurality of coupling structures. The arms extend from a first end of the main body. The coupling structures extend from a second end of the main body opposite the first end. The boot is disposed over the coupling structures of the release slide and defines a cavity configured to slidably receive a communications cable.
摘要:
One embodiment includes an integrated boot and release slide having a release slide and a boot. The release slide includes a main body, a plurality of arms, and a plurality of coupling structures. The arms extend from a first end of the main body. The coupling structures extend from a second end of the main body opposite the first end. The boot is overmolded over the coupling structures of the release slide and defines a cavity configured to slidably receive a communications cable.
摘要:
In an embodiment, a shell assembly for a communications module is described that includes a top shell, a bottom shell, and a thermal boss. The top shell has a top panel and opposing lateral side portions. The bottom shell has a bottom panel and opposing lateral side portions. The top shell and the bottom shell are configured to be assembled together to define a cavity therebetween. The cavity may be configured to receive a transceiver assembly. The thermal boss extends from the top panel and includes a thermal interface surface defining a thermal interface plane oriented at an angle relative to the top panel.
摘要:
One embodiment includes an integrated boot and release slide having a release slide and a boot. The release slide includes a main body, a plurality of arms, and a plurality of coupling structures. The arms extend from a first end of the main body. The coupling structures extend from a second end of the main body opposite the first end. The boot is overmolded over the coupling structures of the release slide and defines a cavity configured to slidably receive a communications cable.
摘要:
An electromagnetic radiation shield for an electronic module. In one example embodiment, an EMR shield for an electronic transceiver module includes a conductive carrier sized and configured to surround a shell of an electronic transceiver module. The conductive carrier defines a plurality of extended elements located on at least one edge of the conductive carrier and an orientation element. Each extended element is configured to bias against the shell in order to create a physical and electrical contact between the conductive carrier and the shell. The orientation element is configured to engage a corresponding structure in the shell in order to correctly orient the conductive carrier with respect to the shell.
摘要:
One embodiment includes communications module having a release slide and a boot. The release slide includes a main body, a plurality of arms, and a plurality of coupling structures. The arms extend from a first end of the main body. The coupling structures extend from a second end of the main body opposite the first end. The boot is disposed over the coupling structures of the release slide and defines a cavity configured to slidably receive a communications cable.
摘要:
In an embodiment, a shell assembly for a communications module is described that includes a top shell, a bottom shell, and a thermal boss. The top shell has a top panel and opposing lateral side portions. The bottom shell has a bottom panel and opposing lateral side portions. The top shell and the bottom shell are configured to be assembled together to define a cavity therebetween. The cavity may be configured to receive a transceiver assembly. The thermal boss extends from the top panel and includes a thermal interface surface defining a thermal interface plane oriented at an angle relative to the top panel.