公开(公告)号：US20120104597A1

公开(公告)日：2012-05-03

申请号：US13069563

申请日：2011-03-23

申请人： Tatsuji Ishiduka ,  Junji Yoshikawa ,  Tsutomu Kojima

发明人： Tatsuji Ishiduka ,  Junji Yoshikawa ,  Tsutomu Kojima

IPC分类号： H01L23/485 ,  H01L21/60

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/11845 ,  H01L2224/13082 ,  H01L2224/16145 ,  H01L2224/29082 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/9211 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01028 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00

摘要： According to an embodiment, a chip-on-chip structure includes a first chip, a second chip, the first chip and the second chip being opposite to each other, a first electrode terminal, a second electrode terminal, a bump and a protecting material. The first electrode terminal is provided on the surface of the first chip at the side of the second chip. The second electrode terminal is provided on the surface of the second chip at the side of the first chip. The bump electrically connects the first electrode terminal and the second electrode terminal. The protecting material is formed around the bump between the first chip and the second chip. The protecting material includes a layer made of a material having heat-sensitive adhesive property.

摘要翻译： 根据实施例，片上芯片结构包括第一芯片，第二芯片，第一芯片和第二芯片彼此相对，第一电极端子，第二电极端子，凸块和保护材料 。 第一电极端子设置在第二芯片的一侧的第一芯片的表面上。 第二电极端子设置在第二芯片的第一芯片侧的表面上。 凸块电连接第一电极端子和第二电极端子。 保护材料围绕第一芯片和第二芯片之间的凸块形成。 保护材料包括由具有热敏粘合性的材料制成的层。

公开(公告)号：US20100155255A1

公开(公告)日：2010-06-24

申请号：US12601163

申请日：2008-05-16

申请人： Toshimitsu Nagao ,  Yusuke Yoshikane ,  Junji Yoshikawa ,  Toru Morimoto ,  Toshiya Murata ,  Kazuya Satou

发明人： Toshimitsu Nagao ,  Yusuke Yoshikane ,  Junji Yoshikawa ,  Toru Morimoto ,  Toshiya Murata ,  Kazuya Satou

IPC分类号： B05D3/10 ,  C09D7/00

CPC分类号： C23C18/22 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/28

摘要： The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article.

摘要翻译： 本发明提供了一种用于树脂模制品的无电镀的预处理方法，包括使用含有锰酸盐的蚀刻溶液蚀刻树脂模塑制品，然后使树脂模制品与含有还原化合物的水溶液和 无机酸; 以及包含该预处理工序的树脂成形体的电镀工序。 此外，本发明提供了用于电镀工艺的各种处理剂。 根据本发明，当在树脂模制品的化学镀处理中使用含锰酸盐盐蚀刻溶液进行蚀刻处理时，可以形成具有足够粘附性的镀层。