摘要:
A multistage fine-hole machining device has lap stations for lapping an inner surface defining a through-hole of a workpiece. Each of the lap stations has a passing unit for passing wire through the through-hole of the workpiece, a supply unit for supplying a polishing material to the wire, and a sliding unit for effecting relative sliding movement between the workpiece and the wire while the wire is passed through the through-hole of the workpiece and is supplied with the polishing material to thereby lap the inner surface of the workpiece with the polishing material and enlarge the diameter of the through-hole. A transfer device successively transfers the workpiece to each of the lap stations to lap the inner surface of the workpiece at each of the lap stations during the lapping operation for successively enlarging the diameter of the through-hole to a preselected diameter.
摘要:
An end face polishing apparatus comprises a jig plate for supporting a workpiece, a polishing member for polishing an end face of the workpiece, and a movable lever connected to the jig plate. A pressurizing section presses the lever to bring the end face of the workpiece into pressure contact with the polishing member. The pressurizing section has a first spring member for biasing the lever in a first direction, a pressurizing head for biasing the lever in a second direction opposite to the first direction, a second spring member for biasing the pressurizing head in the second direction, and a pressure sensor disposed between the pressurizing head and the lever for detecting a pressure applied by the end face of the ferrule onto the polishing member when the lever is pressed by the pressurizing section. A pressurization control section controls the pressure applied by the end face of the workpiece onto the polishing member when the lever is pressed by the pressurizing section.
摘要:
In etching an insulating film such as an SiOC film or the like, in order to suppress a diameter of a hole or a width of a groove, a pre-processing is performed before performing the etching. In the pre-processing, a processing gas containing CF4 gas and CH3F gas is converted into a plasma, and an opening size of an opening portion of a resist mask is decreased by depositing deposits at a sidewall thereof by using the plasma. Further, in etching the SiOC film, a processing gas containing CF4 gas, CH3F gas, and N2 gas is converted into a plasma by supplying a processing gas atmosphere by using a first high frequency wave for generating the plasma, wherein the electric power divided by a surface area of a substrate becomes over 1500 W/70685.8 mm2 (a surface area of a 300 mm wafer), and then the SiOC film is etched.
摘要:
An end face polishing device has a first revolution shaft mounted for undergoing revolving movement about a first axis, a rotational shaft mounted for undergoing rotation about a second axis eccentric from the first axis, and a second revolution shaft mounted for undergoing revolving movement about a third axis eccentric from the second axis. A polishing disc is connected to the second revolution shaft for revolving movement therewith.
摘要:
In a vacuum processing chamber, an etching is performed on an object to be processed having at least a mask layer formed in a predetermined pattern and a Ti layer, as a layer to be etched, formed under the mask layer. During the etching, a first plasma processing is carried out to etch the Ti layer by using a plasma of an etching gas containing a fluorine compound at an inner pressure of the chamber of 4 Pa or less. Subsequently, a second plasma processing for dry cleaning is performed by using a plasma of a cleaning gas after the first plasma processing is completed. At this time, a deposit containing a Ti compound produced during the plasma processing is removed.
摘要:
In a vacuum processing chamber, an etching is performed on an object to be processed having at least a mask layer formed in a predetermined pattern and a Ti layer, as a layer to be etched, formed under the mask layer. During the etching, a first plasma processing is carried out to etch the Ti layer by using a plasma of an etching gas containing a fluorine compound at an inner pressure of the chamber of 4 Pa or less. Subsequently, a second plasma processing for dry cleaning is performed by using a plasma of a cleaning gas after the first plasma processing is completed. At this time, a deposit containing a Ti compound produced during the plasma processing is removed.
摘要:
An end face polishing apparatus comprises a polishing board and a jig board for supporting workpieces. A polishing member is detachably arranged on the polishing board and has a polishing film for polishing end faces of the workpieces while the workpieces are supported by the jig board. A first holding device holdings unused polishing members each having a new polishing film preliminarily attached thereto. At least one second holding device holds used polishing members which have been removed from the polishing board. A polishing member exchanging device is mounted for linear movement in horizontal and vertical directions for exchanging a used polishing member arranged on the polishing board with an unused polishing member by seizing the used polishing member from the polishing board and conveying the used polishing member to the second holding device, and by taking an unused polishing member from the first holding device and placing the unused polishing member on the polishing board.
摘要:
For providing a magnetostrictive film that can exhibit high magnetostrictive properties in the vicinity of zero magnetic field and their manufacturing methods, a magnetostrictive film thermal sprayed on an object under test includes a metallic glass film subjected to thermal processing at a temperature lower than the glass transition temperature and not lower than the Curie point, and shows a linearity between the magnetic field and the magnetostriction in at least a part of the magnetic field from −15 kA/m to +15 kA/m (both inclusive).
摘要:
A chuck spindle apparatus comprises a chuck spindle mounted for rotation about a central rotational axis, a chuck main body integrally connected to a forward end of the chuck spindle for rotation therewith, and an indexing device. The chuck main body has a chuck portion for bringing any one of a series of fabrication centers of a workpiece into coincidence with the central rotational axis to thereby chuck the workpiece. The indexing device is disposed within the chuck main body for moving the chuck portion of the chuck main body to bring another one of the fabrication centers of the workpiece into coincidence with the central rotational axis while the workpiece is chucked by the chuck portion of the chuck main body.
摘要:
A process for refining aluminum using a segregation solidification process under a positive pressure inert gas protecting atmosphere comprising, maintaining the temperature of molten aluminum in the vessel by a plurality of electric heater sections arranged around the periphery of said vessel in vertically superposed relationship to each other, cooling a narrow peripheral portion of the inner surface of said vessel beneath the level of the molten aluminum therein by means of a peripheral cooling section arranged around the periphery of said vessel between adjacent heater sections to crystallize the molten aluminum onto said peripheral portion of the inner surface of said vessel, scraping off the refined and solidified aluminum on said peripheral portion by scraping and tamping means having a cross-sectional configuration complementary to that of the inner surface of said vessel, tamping the heaped aluminum by said scraping and tamping means, and deenergizing some of said heater sections located at positions around the solidified heap of aluminum.