Solid-state electrolytic capacitor and manufacturing method thereof
    1.
    发明授权
    Solid-state electrolytic capacitor and manufacturing method thereof 有权
    固态电解电容器及其制造方法

    公开(公告)号:US07359180B2

    公开(公告)日:2008-04-15

    申请号:US10595080

    申请日:2005-04-11

    IPC分类号: H01G9/04

    摘要: A solid electrolytic capacitor includes a flat-shaped anode terminal having a first surface connected to an anode portion of a capacitor element and having a second surface opposite to the first surface, a flat-shaped cathode terminal having a first surface connected to a cathode layer of the capacitor element and having a second surface opposite to the first surface thereof, and an insulating resin package accommodating the capacitor element, the anode terminal, and the cathode terminal. The second surface of the cathode terminal is flush with the second surface of the anode terminal. The second surface of the anode terminal and the second surface of the cathode terminal expose to an outside of the resin package. The anode terminal includes a first thick portion and a first thin portion thinner than the first thick portion. The first thick portion has the second surface of the anode terminal and a portion of the first surface of the anode terminal. The first thin portion has a portion of the first surface of the anode terminal and being connected to the first thick portion. The cathode terminal includes a second thick portion and a second thin portion thinner than the second thick portion. The second thick portion has the second surface of the cathode terminal and a portion of the first surface of the cathode terminal. The second thin portion has a portion of the first surface and being connected to the second thick portion. This solid electrolytic capacitor has a small equivalent series inductance, and is stably mountable to a mount body.

    摘要翻译: 固体电解电容器包括平面状的阳极端子,其具有连接到电容器元件的阳极部分的第一表面并具有与第一表面相对的第二表面,扁平状阴极端子,其具有连接到阴极层的第一表面 并且具有与其第一表面相对的第二表面,以及容纳电容器元件,阳极端子和阴极端子的绝缘树脂封装。 阴极端子的第二表面与阳极端子的第二表面齐平。 阳极端子的第二表面和阴极端子的第二表面暴露于树脂封装的外部。 阳极端子包括第一厚部分和比第一厚部分更薄的第一薄部分。 第一厚部具有阳极端子的第二表面和阳极端子的第一表面的一部分。 第一薄部分具有阳极端子的第一表面的一部分并连接到第一厚部分。 阴极端子包括第二厚部分和比第二厚部分更薄的第二薄部分。 第二厚部具有阴极端子的第二表面和阴极端子的第一表面的一部分。 第二薄部分具有第一表面的一部分并且连接到第二厚部分。 该固体电解电容器具有小的等效串联电感,并且稳定地安装到安装体。

    Chip solid electrolytic capacitor
    2.
    发明授权
    Chip solid electrolytic capacitor 失效
    芯片固体电解电容器

    公开(公告)号:US07057882B2

    公开(公告)日:2006-06-06

    申请号:US11222964

    申请日:2005-09-12

    IPC分类号: H01G9/00 H01G4/228 H01G9/10

    摘要: A chip solid electrolytic capacitor includes a capacitor element with an anode portion and a cathode portion, an anode lead frame, a cathode lead frame and packaging resin. The anode lead frame includes a first plane, an anode junction and an anode terminal. The anode junction is formed on one end of the first plane and connected to the anode portion. The anode terminal is formed on the other side of the first plane. The cathode lead frame has a second plane and a cathode terminal. The second plane has the cathode portion mounted thereon, is connected to the cathode portion, and is stacked on the first plane. The cathode terminal is formed on the same side of the second plane as the anode terminal. The packaging resin has a surface to be mounted and covers the capacitor element, with the anode terminal and the cathode terminal exposed on the surface to be mounted.

    摘要翻译: 芯片固体电解电容器包括具有阳极部分和阴极部分的电容器元件,阳极引线框架,阴极引线框架和封装树脂。 阳极引线框架包括第一平面,阳极结和阳极端子。 阳极结形成在第一平面的一端并连接到阳极部分。 阳极端子形成在第一平面的另一侧上。 阴极引线框架具有第二平面和阴极端子。 第二平面具有安装在其上的阴极部分,连接到阴极部分,并且堆叠在第一平面上。 阴极端子形成在与阳极端子相同的第二平面的一侧。 包装树脂具有要安装的表面并且覆盖电容器元件,阳极端子和阴极端子暴露在要安装的表面上。

    Chip solid electrolytic capacitor
    3.
    发明申请
    Chip solid electrolytic capacitor 失效
    芯片固体电解电容器

    公开(公告)号:US20060056136A1

    公开(公告)日:2006-03-16

    申请号:US11222964

    申请日:2005-09-12

    IPC分类号: H01G9/00

    摘要: The chip solid electrolytic capacitor includes a capacitor element with an anode portion and a cathode portion, an anode lead frame, a cathode lead frame and packaging resin. The anode lead frame includes a first plane, an anode junction and an anode terminal. The anode junction is formed on one end of the first plane and connected to the anode portion. The anode terminal is formed on the other side of the first plane. The cathode lead frame has a second plane and a cathode terminal. The second plane mounts the cathode portion thereon and connected to the cathode portion, and is stacked on the first plane. The cathode terminal is formed on the same side of the second plane as the anode terminal. The packaging resin has a surface to be mounted and covers the capacitor element, with the anode terminal and the cathode terminal exposed on the surface to be mounted.

    摘要翻译: 芯片固体电解电容器包括具有阳极部分和阴极部分的电容器元件,阳极引线框架,阴极引线框架和封装树脂。 阳极引线框架包括第一平面,阳极结和阳极端子。 阳极结形成在第一平面的一端并连接到阳极部分。 阳极端子形成在第一平面的另一侧上。 阴极引线框架具有第二平面和阴极端子。 第二平面将阴极部分安装在其上并连接到阴极部分,并且堆叠在第一平面上。 阴极端子形成在与阳极端子相同的第二平面的一侧。 包装树脂具有要安装的表面并且覆盖电容器元件,阳极端子和阴极端子暴露在要安装的表面上。

    CHIP TYPE SOLID ELECTROLYTIC CAPACITOR
    4.
    发明申请
    CHIP TYPE SOLID ELECTROLYTIC CAPACITOR 有权
    芯片型固体电解电容器

    公开(公告)号:US20100259868A1

    公开(公告)日:2010-10-14

    申请号:US12821568

    申请日:2010-06-23

    IPC分类号: H01G9/012

    摘要: A chip type solid electrolytic capacitor includes a capacitor element-laminate. In the capacitor element-laminate, a plurality of capacitor elements, each having an anode portion and a cathode portion, are laminated so that the anode portions of the adjacent capacitor elements are disposed in the direction opposite to each other. Anode lead terminals are joined to the bottom faces of the anode portions of the capacitor elements disposed at both ends of the capacitor element-laminate. A cathode lead terminal is joined to the bottom face of the cathode portion of the capacitor element disposed in the center of the capacitor element-laminate. An Electrically insulating exterior resin coats the capacitor element-laminate so as to expose at least a part of the bottom faces of the anode lead terminals and a part of the cathode lead terminal.

    摘要翻译: 芯片型固体电解电容器包括电容器元件层叠体。 在电容器元件层叠体中,层叠多个具有阳极部和阴极部的电容器元件,使得相邻的电容器元件的阳极部沿相反方向配置。 阳极引线端子连接到设置在电容器元件 - 层叠体的两端的电容器元件的阳极部分的底面。 阴极引线端子连接到设置在电容器元件 - 层叠体的中心的电容器元件的阴极部分的底面。 电绝缘外部树脂涂覆电容器元件层压体,以暴露阳极引线端子和阴极引线端子的一部分的至少一部分底面。

    Chip type solid electrolytic capacitor
    5.
    发明授权
    Chip type solid electrolytic capacitor 有权
    片式固体电解电容器

    公开(公告)号:US07778011B2

    公开(公告)日:2010-08-17

    申请号:US11719029

    申请日:2006-01-19

    IPC分类号: H01G9/00

    摘要: A chip type solid electrolytic capacitor includes a capacitor element-laminate. In the capacitor element-laminate, a plurality of capacitor elements, each having an anode portion and a cathode portion, are laminated so that the anode portions of the adjacent capacitor elements are disposed in the direction opposite to each other. Anode lead terminals are joined to the bottom faces of the anode portions of the capacitor elements disposed at both ends of the capacitor element-laminate. A cathode lead terminal is joined to the bottom face of the cathode portion of the capacitor element disposed in the center of the capacitor element-laminate. An Electrically insulating exterior resin coats the capacitor element-laminate so as to expose at least a part of the bottom faces of the anode lead terminals and a part of the cathode lead terminal.

    摘要翻译: 芯片型固体电解电容器包括电容器元件层叠体。 在电容器元件层叠体中,层叠多个具有阳极部和阴极部的电容器元件,使得相邻的电容器元件的阳极部沿相反方向配置。 阳极引线端子连接到设置在电容器元件 - 层叠体的两端的电容器元件的阳极部分的底面。 阴极引线端子连接到设置在电容器元件 - 层叠体的中心的电容器元件的阴极部分的底面。 电绝缘外部树脂涂覆电容器元件层压体,以暴露阳极引线端子和阴极引线端子的一部分的至少一部分底面。

    Chip type solid electrolytic capacitor
    6.
    发明授权
    Chip type solid electrolytic capacitor 有权
    片式固体电解电容器

    公开(公告)号:US07929273B2

    公开(公告)日:2011-04-19

    申请号:US12821568

    申请日:2010-06-23

    IPC分类号: H01G9/00

    摘要: A chip type solid electrolytic capacitor includes a capacitor element-laminate. In the capacitor element-laminate, a plurality of capacitor elements, each having an anode portion and a cathode portion, are laminated so that the anode portions of the adjacent capacitor elements are disposed in the direction opposite to each other. Anode lead terminals are joined to the bottom faces of the anode portions of the capacitor elements disposed at both ends of the capacitor element-laminate. A cathode lead terminal is joined to the bottom face of the cathode portion of the capacitor element disposed in the center of the capacitor element-laminate. An Electrically insulating exterior resin coats the capacitor element-laminate so as to expose at least a part of the bottom faces of the anode lead terminals and a part of the cathode lead terminal.

    摘要翻译: 芯片型固体电解电容器包括电容器元件层叠体。 在电容器元件层叠体中,层叠多个具有阳极部和阴极部的电容器元件,使得相邻的电容器元件的阳极部沿相反方向配置。 阳极引线端子连接到设置在电容器元件 - 层叠体的两端的电容器元件的阳极部分的底面。 阴极引线端子连接到设置在电容器元件 - 层叠体的中心的电容器元件的阴极部分的底面。 电绝缘外部树脂涂覆电容器元件层压体,以暴露阳极引线端子和阴极引线端子的一部分的至少一部分底面。

    CHIP TYPE SOLID ELECTROLYTIC CAPACITOR
    7.
    发明申请
    CHIP TYPE SOLID ELECTROLYTIC CAPACITOR 有权
    芯片型固体电解电容器

    公开(公告)号:US20090073638A1

    公开(公告)日:2009-03-19

    申请号:US11719029

    申请日:2006-01-19

    IPC分类号: H01G9/15

    摘要: A chip type solid electrolytic capacitor includes a capacitor element-laminate. In the capacitor element-laminate, a plurality of capacitor elements, each having an anode portion and a cathode portion, are laminated so that the anode portions of the adjacent capacitor elements are disposed in the direction opposite to each other. Anode lead terminals are joined to the bottom faces of the anode portions of the capacitor elements disposed at both ends of the capacitor element-laminate. A cathode lead terminal is joined to the bottom face of the cathode portion of the capacitor element disposed in the center of the capacitor element-laminate. An Electrically insulating exterior resin coats the capacitor element-laminate so as to expose at least a part of the bottom faces of the anode lead terminals and a part of the cathode lead terminal.

    摘要翻译: 芯片型固体电解电容器包括电容器元件层叠体。 在电容器元件层叠体中,层叠多个具有阳极部和阴极部的电容器元件,使得相邻的电容器元件的阳极部沿相反方向配置。 阳极引线端子连接到设置在电容器元件 - 层叠体的两端的电容器元件的阳极部分的底面。 阴极引线端子连接到设置在电容器元件 - 层叠体的中心的电容器元件的阴极部分的底面。 电绝缘外部树脂涂覆电容器元件层压体,以暴露阳极引线端子和阴极引线端子的一部分的至少一部分底面。

    Chip-type filter
    8.
    发明授权
    Chip-type filter 有权
    片式过滤器

    公开(公告)号:US07612987B2

    公开(公告)日:2009-11-03

    申请号:US12368569

    申请日:2009-02-10

    IPC分类号: H01G9/00

    摘要: A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second group, the positive electrode sections in both groups are disposed on the opposite sides with respect to the negative electrode sections. Positive electrode terminals are electrically connected to the positive electrode sections of capacitor elements in the first group and those of capacitor elements in the second group, respectively. Negative electrode terminals are electrically connected to the negative electrode sections in the laminated body, and are disposed at both ends of the direction crossing the connecting direction between the positive electrode terminals. The inductor section is insulated from the negative electrode sections and couples the positive electrode terminals.

    摘要翻译: 芯片型滤波器具有通过堆叠多个电容器元件,一对正极端子,一对负极端子,绝缘外部树脂和电感器部分而形成的层叠体。 层叠体包括第一组中的电容器元件和第二组中的电容器元件,两组中的正极部分相对于负极部分设置在相对侧上。 正极端子分别电连接到第一组中的电容器元件的正极部分和第二组中的电容器元件的正极部分。 负极端子与层叠体中的负极部电连接,并且配置在与正极端子之间的连接方向交叉的方向的两端。 电感器部分与负极部分绝缘并连接正极端子。