公开(公告)号：US06211277B1

公开(公告)日：2001-04-03

申请号：US09165202

申请日：1998-10-02

申请人： Tatsuo Kawata ,  Hiroki Sashima ,  Takaki Kashihara ,  Masanobu Fujii ,  Naoki Nara ,  Terumi Tsukahara ,  Hiroyuki Sakai

发明人： Tatsuo Kawata ,  Hiroki Sashima ,  Takaki Kashihara ,  Masanobu Fujii ,  Naoki Nara ,  Terumi Tsukahara ,  Hiroyuki Sakai

IPC分类号： C08K300

CPC分类号： H01L23/4951 ,  C08G59/245 ,  C08G59/687 ,  C08K3/40 ,  C08L63/00 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LOC structure semiconductor device having a good solder heat resistance without electrical characteristic failures due to damages to the passivation film and the diffusion layer thereunder attributing to the filler can be obtained by encapsulating an LOC structure semiconductor chip with an encapsulating material comprising an epoxy resin, a curing agent, a curing promoter, and an inorganic filler, the filler having a smaller particle size than the distance between a inner lead and a semiconductor chip and being in an amount of 80 to 95% by weight based on the total weight of the encapsulating material.

摘要翻译： 通过用包含环氧树脂的封装材料封装LOC结构半导体芯片，可以获得具有良好的焊料耐热性而没有电特性故障的LOC结构半导体器件，这是由于由于对填料引起的钝化膜及其扩散层的损害， 固化剂，固化促进剂和无机填料，所述填料的粒径小于内引线和半导体芯片之间的距离，并且基于所述填料的总重量为80〜95重量％ 封装材料。

公开(公告)号：US06284818B1

公开(公告)日：2001-09-04

申请号：US09521212

申请日：2000-03-08

申请人： Tatsuo Kawata ,  Hiroyuki Sakai ,  Terumi Tsukahara

发明人： Tatsuo Kawata ,  Hiroyuki Sakai ,  Terumi Tsukahara

IPC分类号： C08K536

CPC分类号： H01L23/293 ,  C08K3/28 ,  C08K5/23 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/181 ,  C08L63/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In the present invention, provided are i) an encapsulant composition comprising an epoxy resin, a curing agent, an inorganic filler, an adduct of triphenylphosphine with benzoquinone, and a hydrous bismuth nitrate oxide; the inorganic filler being mixed in an amount of from 70% by volume to 85% by volume based on the total weight of the encapsulant composition, and the hydrous bismuth nitrate oxide being mixed in an amount of from 2.5 parts by weight to 20 parts by weight based on 100 parts by weight of the epoxy resin, and ii) an electronic device having an encapsulating member comprising a cured product of this encapsulant composition.

摘要翻译： 在本发明中，i）包含环氧树脂，固化剂，无机填料，三苯基膦与苯醌的加成物和硝酸铋硝酸盐的密封剂组合物; 相对于密封剂组合物的总重量，无机填料的混合量为70体积％至85体积％，硝酸铋水合物的混合量为2.5重量份至20重量份， 基于100重量份的环氧树脂的重量，以及ii）具有包含该密封剂组合物的固化产物的封装构件的电子器件。