公开(公告)号：US07742312B2

公开(公告)日：2010-06-22

申请号：US11773279

申请日：2007-07-03

申请人： Te-Wei Li

发明人： Te-Wei Li

IPC分类号： H05K7/00

CPC分类号： H05K1/144 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/40 ,  H04M1/0277 ,  H05K1/16 ,  H05K3/28 ,  H05K2201/0394 ,  H05K2201/0999 ,  H05K2201/10303 ,  H05K2203/161 ,  Y10T428/31504 ,  Y10T428/31551

摘要： An electronic device and method of fabrication are provided. The electronic device comprises a substrate, a patterned conductive layer serving as an antenna layer formed on the outer surface of the substrate, electrically connected with a printed circuit board (PCB) for sending or receiving a wireless signal, wherein the substrate is placed between the patterned conductive layer and PCB. The patterned conductive layer may be electrically connected to the PCB through a hole in the substrate by a connecting piece. The substrate may be a housing of the electronic device.

摘要翻译： 提供了一种电子设备和制造方法。 该电子设备包括：衬底，用作形成在衬底的外表面上的天线层的图案化导电层，与用于发送或接收无线信号的印刷电路板（PCB）电连接，其中衬底放置在 图案导电层和PCB。 图案化导电层可以通过连接片通过基板中的孔与PCB电连接。 基板可以是电子设备的壳体。