Electrostatic discharge protection device for high voltage

    公开(公告)号:US09768159B2

    公开(公告)日:2017-09-19

    申请号:US14829898

    申请日:2015-08-19

    CPC classification number: H01L27/0266 H01L27/0255 H01L27/0262

    Abstract: A circuit for protecting against electrostatic discharge events has a semiconductor substrate (200) of first conductivity embedding a first diode in a well (260) of opposite second conductivity, the diode's anode (111) tied to an I/O pin-to-be-protected (101) at a first voltage, and the first diode's cathode (112) connected to the first drain (123) of a first MOS transistor in the substrate. The first MOS transistor's first gate (122) is biased to a second voltage smaller than the first voltage, thereby reducing the first voltage by the amount of the second voltage. In series with the first MOS transistor is a second MOS transistor with its second drain (670) merged with the first source of the first MOS transistor, and its second source (131), together with its second gate (132), tied to ground potential (140).

    ELECTROSTATIC DISCHARGE PROTECTION DEVICE FOR HIGH VOLTAGE

    公开(公告)号:US20170338222A1

    公开(公告)日:2017-11-23

    申请号:US15672813

    申请日:2017-08-09

    CPC classification number: H01L27/0266 H01L27/0255 H01L27/0262

    Abstract: A circuit for protecting against electrostatic discharge events has a semiconductor substrate (200) of first conductivity embedding a first diode in a well (260) of opposite second conductivity, the diode's anode (111) tied to an I/O pin-to-be-protected (101) at a first voltage, and the first diode's cathode (112) connected to the first drain (123) of a first MOS transistor in the substrate. The first MOS transistor's first gate (122) is biased to a second voltage smaller than the first voltage, thereby reducing the first voltage by the amount of the second voltage. In series with the first MOS transistor is a second MOS transistor with its second drain (670) merged with the first source of the first MOS transistor, and its second source (131), together with its second gate (132), tied to ground potential (140).

    Electrostatic discharge protection device for high voltage

    公开(公告)号:US10177136B2

    公开(公告)日:2019-01-08

    申请号:US15672813

    申请日:2017-08-09

    Abstract: A circuit for protecting against electrostatic discharge events has a semiconductor substrate (200) of first conductivity embedding a first diode in a well (260) of opposite second conductivity, the diode's anode (111) tied to an I/O pin-to-be-protected (101) at a first voltage, and the first diode's cathode (112) connected to the first drain (123) of a first MOS transistor in the substrate. The first MOS transistor's first gate (122) is biased to a second voltage smaller than the first voltage, thereby reducing the first voltage by the amount of the second voltage. In series with the first MOS transistor is a second MOS transistor with its second drain (670) merged with the first source of the first MOS transistor, and its second source (131), together with its second gate (132), tied to ground potential (140).

    ELECTROSTATIC DISCHARGE PROTECTION DEVICE FOR HIGH VOLTAGE
    5.
    发明申请
    ELECTROSTATIC DISCHARGE PROTECTION DEVICE FOR HIGH VOLTAGE 有权
    用于高电压的静电放电保护装置

    公开(公告)号:US20170053905A1

    公开(公告)日:2017-02-23

    申请号:US14829898

    申请日:2015-08-19

    CPC classification number: H01L27/0266 H01L27/0255 H01L27/0262

    Abstract: A circuit for protecting against electrostatic discharge events has a semiconductor substrate (200) of first conductivity embedding a first diode in a well (260) of opposite second conductivity, the diode's anode (111) tied to an I/O pin-to-be-protected (101) at a first voltage, and the first diode's cathode (112) connected to the first drain (123) of a first MOS transistor in the substrate. The first MOS transistor's first gate (122) is biased to a second voltage smaller than the first voltage, thereby reducing the first voltage by the amount of the second voltage. In series with the first MOS transistor is a second MOS transistor with its second drain (670) merged with the first source of the first MOS transistor, and its second source (131), together with its second gate (132), tied to ground potential (140).21

    Abstract translation: 21

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