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    INTERPOSER WITH EXTRUDED FEED-THROUGH VIAS
    1.
    发明申请
    INTERPOSER WITH EXTRUDED FEED-THROUGH VIAS 有权
    具有挤压式进料口的间隙器

    公开(公告)号：US20130233609A1

    公开(公告)日：2013-09-12

    申请号：US13787284

    申请日：2013-03-06

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： STEVEN KUMMERL

    IPC: H01L21/48 ,  H05K1/11

    CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/09 ,  H01L2224/08238 ,  H01L2924/0002 ,  H01L2924/15747 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/0017 ,  Y10T29/49117 ,  H01L2924/00

    Abstract: A method of forming interposers includes positioning a plurality of extruded metal wires across a first platten and second platten, which secures the extruded metal wires. A sealing material is added to sidewalls of a volume having the plurality of extruded metal wires within, with the first and second plattens as end plates to form a holding volume. The holding volume is filled with a filling material. The filling material is heated to a sufficient temperature to form a heat treated filled volume. After removing the sealing material, the heat treated filled volume is sawed into a plurality of slices having a predetermined thickness to form a plurality of interposer substrates having a plurality of feed-thru conducting features provided by the plurality of extruded metal wires.

    Abstract translation: 一种形成插入件的方法包括将多个挤出的金属丝定位在第一平板和第二平板上，这固定了挤出的金属线。 将密封材料添加到具有多个挤压金属线的体积的侧壁中，其中第一和第二平板作为端板形成保持体积。 保持体积填充有填充材料。 将填充材料加热到足够的温度以形成经热处理的填充体积。 在去除密封材料之后，将经热处理的填充体积被锯切成具有预定厚度的多个切片，以形成具有由多个挤压金属丝提供的多个馈通导电特征的多个插入器基板。

    CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION
    2.
    发明申请
    CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION 审中-公开

    公开(公告)号：US20200083147A1

    公开(公告)日：2020-03-12

    申请号：US16123100

    申请日：2018-09-06

    Applicant: Texas Instruments Incorporated

    Inventor： JO BITO ,  BENJAMIN STASSEN COOK ,  STEVEN KUMMERL

    IPC: H01L23/495 ,  H01L23/498

    Abstract: A packaged semiconductor device includes an IC die having bump features that are coupled to bond pads flip chip attached to a custom LF. The custom LF includes metal structures including metal leads on at least 2 sides, and printed metal providing a printed LF portion including printed metal traces that connect to and extend inward from at least one of the metal leads over the dielectric support material that are coupled to FC pads configured for receiving the bump features including at least some of the printed metal traces coupled to the bond pads on the IC die. The IC die is flip chip mounted on the printed LF portion so that the bump features are connected to the FC pads.

    CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION
    3.
    发明申请
    CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION 有权

    公开(公告)号：US20240413058A1

    公开(公告)日：2024-12-12

    申请号：US18810024

    申请日：2024-08-20

    Applicant: Texas Instruments Incorporated

    Inventor： JO BITO ,  BENJAMIN STASSEN COOK ,  STEVEN KUMMERL

    IPC: H01L23/495 ,  H01L23/498

    Abstract: A packaged semiconductor device includes an IC die having bump features that are coupled to bond pads flip chip attached to a custom LF. The custom LF includes metal structures including metal leads on at least 2 sides, and printed metal providing a printed LF portion including printed metal traces that connect to and extend inward from at least one of the metal leads over the dielectric support material that are coupled to FC pads configured for receiving the bump features including at least some of the printed metal traces coupled to the bond pads on the IC die. The IC die is flip chip mounted on the printed LF portion so that the bump features are connected to the FC pads.

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