公开(公告)号：US11858661B2

公开(公告)日：2024-01-02

申请号：US17650619

申请日：2022-02-10

Applicant: The Boeing Company

Inventor： Benjamin S. Merrit ,  Hsien-Lin Huang ,  Mark Abdouch ,  Nathan A. Secinaro ,  Daniel Bracy

IPC: B64F5/10 ,  B64C3/26 ,  B29C65/78 ,  B64C1/06 ,  B29D99/00

CPC classification number: B64F5/10 ,  B29C65/7808 ,  B29D99/0014 ,  B64C1/064 ,  B64C1/065 ,  B64C3/26

Abstract: A method of manufacturing a panel assembly includes supporting the panel assembly in a free state using a holding fixture. The panel assembly has a skin panel, and sacrificial material coupled to a skin panel inner surface. The method includes acquiring a free state outer surface contour of the panel assembly by scanning a skin panel outer surface while the panel assembly is supported by the holding fixture. The method also includes developing a numerically controlled (NC) machining program having cutter paths configured for machining the interface locations to an inner surface contour that reflects nominal thicknesses of the panel assembly based off of the free state outer surface contour. In addition, the method includes machining the sacrificial material at the interface locations by moving a cutter along the cutter paths while the panel assembly is supported by the holding fixture.

公开(公告)号：US20230249844A1

公开(公告)日：2023-08-10

申请号：US17650619

申请日：2022-02-10

Applicant: The Boeing Company

Inventor： Benjamin S. Merrit ,  Hsien-Lin Huang ,  Mark Abdouch ,  Nathan A. Secinaro ,  Daniel Bracy

IPC: B64F5/10 ,  B64C3/26 ,  B64C1/06 ,  B29D99/00 ,  B29C65/78

CPC classification number: B64F5/10 ,  B64C3/26 ,  B64C1/065 ,  B64C1/064 ,  B29D99/0014 ,  B29C65/7808

Abstract: A method of manufacturing a panel assembly includes supporting the panel assembly in a free state using a holding fixture. The panel assembly has a skin panel, and sacrificial material coupled to a skin panel inner surface. The method includes acquiring a free state outer surface contour of the panel assembly by scanning a skin panel outer surface while the panel assembly is supported by the holding fixture. The method also includes developing a numerically controlled (NC) machining program having cutter paths configured for machining the interface locations to an inner surface contour that reflects nominal thicknesses of the panel assembly based off of the free state outer surface contour. In addition, the method includes machining the sacrificial material at the interface locations by moving a cutter along the cutter paths while the panel assembly is supported by the holding fixture.

公开(公告)号：US20240085309A1

公开(公告)日：2024-03-14

申请号：US17943632

申请日：2022-09-13

Applicant: The Boeing Company

Inventor： Richard Joel Thompson ,  Tyler Benjamin Smith ,  Nam Hoang Nguyen ,  Jason Robert Lathrop ,  Kristen Smith Williams ,  Hsien-Lin Huang ,  Wilbur Harrison Barwick

IPC: G01N17/00 ,  G06F17/17 ,  G06K9/62 ,  G06N20/00

CPC classification number: G01N17/006 ,  G06F17/175 ,  G06K9/6215 ,  G06K9/6276 ,  G06K9/6298 ,  G06N20/00

Abstract: The application is directed to methods and devices for estimating corrosion of a material. One of the methods includes obtaining data regarding corrosion. The data is obtained from various sources, such as but not limited to sensors and observational data. The data is then trained to provide for a more complete data set. The trained data is then used to estimate the expected amount of corrosion for a given situation.

公开(公告)号：US09391261B2

公开(公告)日：2016-07-12

申请号：US14138120

申请日：2013-12-22

Applicant: The Boeing Company ,  University of Washington through its Center for Commercialization

Inventor： Jeffrey Lynn Duce ,  Scott Robert Johnston ,  I-Yeu Shen ,  Guozhong Cao ,  Hsien-Lin Huang

IPC: H01L41/107 ,  H01L41/113 ,  H01L41/08 ,  H01L41/187 ,  H01L41/314 ,  G01L1/16 ,  G01M5/00

CPC classification number: H01L41/1132 ,  G01L1/16 ,  G01M5/0033 ,  G01M5/0083 ,  H01L41/0805 ,  H01L41/1876 ,  H01L41/314

Abstract: A structure is provided having a substrate and a direct write deposited lead zirconate titanate (PZT) nanoparticle ink based piezoelectric sensor assembly deposited on the substrate. The PZT nanoparticle ink based piezoelectric sensor assembly has a PZT nanoparticle ink based piezoelectric sensor with a PZT nanoparticle ink deposited onto the substrate via an ink deposition direct write printing process. The PZT nanoparticle ink does not require a high temperature sintering/crystallization process once deposited. The PZT nanoparticle ink based piezoelectric sensor assembly further has a power and communication wire assembly coupled to the PZT nanoparticle ink based piezoelectric sensor. The power and communication wire assembly has a conductive ink deposited onto the substrate via the ink deposition direct write printing process.

Abstract translation: 提供了一种结构，其具有基板和沉积在该基板上的直写式淀积铅锆钛酸铅（PZT）纳米颗粒油墨基压电传感器组件。 基于PZT纳米颗粒油墨的压电传感器组件具有PZT纳米颗粒油墨基压电传感器，其中PZT纳米颗粒油墨通过油墨沉积直接写入印刷方法沉积到基底上。 一旦沉积，PZT纳米颗粒油墨就不需要高温烧结/结晶过程。 基于PZT纳米颗粒油墨的压电传感器组件还具有耦合到基于PZT纳米颗粒油墨的压电传感器的功率和通信线组件。 功率和通信线组件具有通过油墨沉积直写式印刷工艺沉积到基板上的导电油墨。

公开(公告)号：US20150333250A1

公开(公告)日：2015-11-19

申请号：US14138120

申请日：2013-12-22

Applicant: University of Washington through its Center for Commercialization ,  The Boeing Company

Inventor： Jeffrey Lynn Duce ,  Scott Robert Johnston ,  I-Yeu Shen ,  Guozhong Cao ,  Hsien-Lin Huang

IPC: H01L41/187 ,  H01L41/314 ,  H01L41/113

CPC classification number: H01L41/1132 ,  G01L1/16 ,  G01M5/0033 ,  G01M5/0083 ,  H01L41/0805 ,  H01L41/1876 ,  H01L41/314

Abstract: A structure is provided having a substrate and a direct write deposited lead zirconate titanate (PZT) nanoparticle ink based piezoelectric sensor assembly deposited on the substrate. The PZT nanoparticle ink based piezoelectric sensor assembly has a PZT nanoparticle ink based piezoelectric sensor with a PZT nanoparticle ink deposited onto the substrate via an ink deposition direct write printing process. The PZT nanoparticle ink does not require a high temperature sintering/crystallization process once deposited. The PZT nanoparticle ink based piezoelectric sensor assembly further has a power and communication wire assembly coupled to the PZT nanoparticle ink based piezoelectric sensor. The power and communication wire assembly has a conductive ink deposited onto the substrate via the ink deposition direct write printing process.

Abstract translation: 提供了一种结构，其具有基板和沉积在该基板上的直写式淀积铅锆钛酸铅（PZT）纳米颗粒油墨基压电传感器组件。 基于PZT纳米颗粒油墨的压电传感器组件具有PZT纳米颗粒油墨基压电传感器，其中PZT纳米颗粒油墨通过油墨沉积直接写入印刷方法沉积到基底上。 一旦沉积，PZT纳米颗粒油墨就不需要高温烧结/结晶过程。 基于PZT纳米颗粒油墨的压电传感器组件还具有耦合到基于PZT纳米颗粒油墨的压电传感器的功率和通信线组件。 功率和通信线组件具有通过油墨沉积直写式印刷工艺沉积到基板上的导电油墨。