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1.发明授权Dynamic process state adjustment of a processing tool to reduce non-uniformity 有权动态过程状态调整的加工工具减少不均匀性公开(公告)号：US06751518B1
公开(公告)日：2004-06-15
申请号：US10134244
申请日：2002-04-29
IPC分类号： G06F1900
CPC分类号： H01L21/67276
摘要： A method and an apparatus for reducing process non-uniformity across a processed semiconductor wafers. A first semiconductor wafer is processed. A process non-uniformity associated with the first processed semiconductor wafer is identified. A feedback correction in response to the process non-uniformity during processing of a second semiconductor wafer is performed and/or a feed-forward compensation is performed in response to the process non-uniformity during a subsequent process performed across the first semiconductor wafer is performed.
摘要翻译： 一种用于减少经处理的半导体晶片的工艺不均匀性的方法和装置。 处理第一半导体晶片。 识别与第一处理的半导体晶片相关联的工艺不均匀。 执行响应于处理第二半导体晶片期间的处理不均匀性的反馈校正和/或响应于在第一半导体晶片执行的后续处理期间的处理不均匀性执行前馈补偿 。
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公开(公告)号：US08615314B1
公开(公告)日：2013-12-24
申请号：US10932989
申请日：2004-09-02
IPC分类号： G05B13/02
CPC分类号： G05B19/41875 , G05B2219/32182 , G05B2219/45031 , Y02P90/22
摘要： A method, apparatus and a system, for performing a process control using analysis of an upstream process is provided. The method comprises performing a first process on a workpiece and performing a qualitative analysis upon the workpiece relating to the first process, the qualitative analysis comprises analyzing at least one metrology measurement relating to the first process and a workpiece feature to evaluate a characteristic of the workpiece. The method further comprises selecting a process control parameter for performing a second process upon the workpiece based upon the qualitative analysis.
摘要翻译： 提供了一种使用上游处理的分析进行处理控制的方法，装置和系统。 该方法包括对工件执行第一过程并对与第一过程相关的工件执行定性分析，定性分析包括分析与第一过程有关的至少一个度量测量和工件特征以评估工件的特性 。 该方法还包括基于定性分析来选择用于对工件执行第二处理的过程控制参数。
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3.发明授权Method and apparatus for updating control state variables of a process control model based on rework data 有权基于返工数据更新过程控制模型的控制状态变量的方法和装置公开(公告)号：US06970757B1
公开(公告)日：2005-11-29
申请号：US09838467
申请日：2001-04-19
申请人： Joyce S. Oey Hewett , Anthony J. Toprac , Christopher A. Bode , Alexander J. Pasadyn , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Joyce S. Oey Hewett , Anthony J. Toprac , Christopher A. Bode , Alexander J. Pasadyn , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
IPC分类号： G05B19/418 , G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32179 , G05B2219/32228 , G05B2219/45031 , Y02P90/22 , Y02P90/86
摘要： A method for controlling a manufacturing process includes processing a plurality of workpieces in a tool; monitoring a rework rate associated with the workpieces processed in the tool; and initiating an automatic corrective action in response to the rework rate being greater than a predetermined threshold. A manufacturing system includes a tool adapted to process a plurality of workpieces and a rework controller adapted to monitor a rework rate associated with the workpieces processed in the tool and initiate an automatic corrective action in response to the rework rate being greater than a predetermined threshold.
摘要翻译： 一种用于控制制造过程的方法包括在工具中处理多个工件; 监测与工具中处理的工件相关联的返工率; 以及响应于所述返工率大于预定阈值而启动自动校正动作。 制造系统包括适于处理多个工件的工具和适于监测与工具中处理的工件相关联的返工率的返工控制器，并响应于返工率大于预定阈值而启动自动校正动作。
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4.发明授权Method and apparatus for controlling process target values based on manufacturing metrics 失效基于制造指标控制过程目标值的方法和装置公开(公告)号：US06937914B1
公开(公告)日：2005-08-30
申请号：US09789872
申请日：2001-02-21
申请人： Christopher A. Bode , Thomas J. Sonderman , Alexander J. Pasadyn , Anthony J. Toprac , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Michael L. Miller
发明人： Christopher A. Bode , Thomas J. Sonderman , Alexander J. Pasadyn , Anthony J. Toprac , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Michael L. Miller
IPC分类号： G05B19/418 , G06F19/00
CPC分类号： G05B19/41865 , G05B2219/32063 , G05B2219/45031 , Y02P90/20 , Y02P90/86
摘要： A method for controlling a tool adapted to process workpieces in accordance with an operating recipe based on a process target value is provided. The method includes collecting manufacturing characteristic data associated with the workpieces; correlating the manufacturing characteristic data with a first manufacturing metric to generate a first manufacturing metric distribution for the workpieces; and adjusting the process target value based on the first manufacturing metric distribution. A manufacturing system includes a processing tool and a target monitor. The processing tool is adapted to process workpieces in accordance with an operating recipe based on a process target value. The target monitor is adapted to collect manufacturing characteristic data associated with the workpieces, correlate the manufacturing characteristic data with a first manufacturing metric to generate a first manufacturing metric distribution for the workpieces, and adjust the process target value based on the first manufacturing metric distribution.
摘要翻译： 提供了一种用于控制适于根据基于过程目标值的操作配方来处理工件的工具的方法。 该方法包括收集与工件相关联的制造特性数据; 将所述制造特征数据与第一制造度量相关联，以产生所述工件的第一制造度量分布; 以及基于所述第一制造度量分布来调整所述过程目标值。 制造系统包括处理工具和目标监视器。 处理工具适于根据基于过程目标值的操作配方来处理工件。 目标监视器适于收集与工件相关联的制造特性数据，将制造特性数据与第一制造度量相关联，以产生工件的第一制造度量分布，并且基于第一制造度量分布来调整过程目标值。
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5.发明授权公开(公告)号：US06615098B1
公开(公告)日：2003-09-02
申请号：US09789871
申请日：2001-02-21
申请人： Christopher A. Bode , Alexander J. Pasadyn , Anthony J. Toprac , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Christopher A. Bode , Alexander J. Pasadyn , Anthony J. Toprac , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
IPC分类号： G06F1760
CPC分类号： G05B19/41865 , G05B19/0426 , G05B2219/32129 , G05B2219/36225 , G05B2219/45031 , Y02P90/20
摘要： A method for controlling a manufacturing system includes processing workpieces in a plurality of tools; initiating a baseline control script for a selected tool of the plurality of tools; providing context information for the baseline control script; determining a tool type based on the context information; selecting a control routine for the selected tool based on the tool type; and executing the control routine to generate a control action for the selected tool. A manufacturing system includes a plurality of tools adapted to process workpieces, a control execution manager, and a control executor. The control execution manager is adapted to initiate a baseline control script for a selected tool of the plurality of tools and provide context information for the baseline control script. The control executor is adapted to execute the baseline control script, determine a tool type based on the context information, select a control routine for the selected tool based on the tool type, and execute the control routine to generate a control action for the selected tool.
摘要翻译： 一种用于控制制造系统的方法包括：处理多个工具中的工件; 为所述多个工具的所选择的工具启动基线控制脚本; 提供基线控制脚本的上下文信息; 基于上下文信息确定工具类型; 根据刀具类型选择所选刀具的控制程序; 以及执行所述控制程序以产生所选择的工具的控制动作。 制造系统包括适于处理工件的多个工具，控制执行管理器和控制执行器。 所述控制执行管理器适于启动用于所述多个工具的所选工具的基线控制脚本并提供所述基线控制脚本的上下文信息。 控制执行器适于执行基线控制脚本，基于上下文信息确定工具类型，基于工具类型选择所选刀具的控制程序，并执行控制程序以生成所选刀具的控制动作 。
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6.发明授权Method and apparatus for utilizing integrated metrology data as feed-forward data 有权利用综合计量数据作为前馈数据的方法和装置公开(公告)号：US06708075B2
公开(公告)日：2004-03-16
申请号：US09992447
申请日：2001-11-16
IPC分类号： G06F1900
摘要： A method and an apparatus for performing feed-forward correction during semiconductor wafer manufacturing. A first process on a semiconductor wafer is performed. Integrated metrology data related to the first process of the semiconductor wafer is acquired. An integrated metrology feed-forward process is performed based upon the integrated metrology data, the integrated metrology feed-forward process comprising identifying at least one error on the semiconductor wafer based upon the integrated metrology data related to the first process of the semiconductor wafer and performing an adjustment process to a second process to be performed on the wafer to compensate for the error. The second process on the semiconductor wafer is performed based upon the adjustment process.
摘要翻译： 一种用于在半导体晶片制造期间执行前馈校正的方法和装置。 执行半导体晶片上的第一工序。 获得与半导体晶片的第一工艺有关的集成度量数据。 基于综合度量学数据进行综合计量学前馈过程，所述综合度量学前馈过程包括基于与半导体晶片的第一工艺相关的集成测量数据识别半导体晶片上的至少一个误差并执行 对在晶片上执行的补偿误差的第二处理的调整处理。 基于调整处理进行半导体晶片上的第二工序。
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7.发明授权Method for prioritizing production lots based on grade estimates and output requirements 有权根据年龄估计和产出要求确定生产批次的方法公开(公告)号：US06699727B1
公开(公告)日：2004-03-02
申请号：US09821675
申请日：2001-03-29
申请人： Anthony J. Toprac , Joyce S. Oey Hewett , Christopher A. Bode , Alexander J. Pasadyn , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Anthony J. Toprac , Joyce S. Oey Hewett , Christopher A. Bode , Alexander J. Pasadyn , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
IPC分类号： G01R3126
CPC分类号： H01L22/20 , G05B19/418 , G05B2219/32194 , G05B2219/32263 , Y02P90/02 , Y02P90/18 , Y02P90/20 , Y02P90/22
摘要： A method for prioritizing production flow includes processing a plurality of manufactured items in a process flow; measuring characteristics of a plurality of manufactured items in the process flow; estimating performance grades for the plurality of manufactured items based on the measured characteristics; grouping the manufactured items with like estimated performance grades; assigning priorities to groups of manufactured items with like estimated performance grades; and directing the plurality of manufactured items through the process flow based on the assigned priorities. A manufacturing system includes a plurality of processing tools adapted to process a plurality of manufactured items in a process flow, a metrology tool, and a process control server. The metrology tool is adapted to measure characteristics of a plurality of manufactured items in the process flow. The process control server is adapted to estimate performance grades for the plurality of manufactured items based on the measured characteristics, group the manufactured items with like estimated performance grades, assign priorities to groups of manufactured items with like estimated performance grades, and direct the plurality of manufactured items through the process flow based on the assigned priorities.
摘要翻译： 一种用于确定生产流程优先级的方法包括在处理流程中处理多个制造的物品; 测量处理流程中的多个制成品的特性; 基于所测量的特性来估计所述多个制造物品的性能等级; 对具有相似估计性能等级的制成品进行分组; 将优先事项分配给具有类似估计绩效等级的制成品组; 以及基于所分配的优先级，通过所述处理流程来引导所述多个制造的物品。 制造系统包括多个处理工具，其适用于处理流程中的多个制造物品，计量工具和过程控制服务器。 计量工具适于测量处理流程中的多个制造物品的特性。 过程控制服务器适于基于测量的特性来估计多个制造物品的性能等级，将具有相似估计性能等级的制造物品分组，将具有相似估计性能等级的制造商品组的优先级分配给多个 基于分配的优先级，通过流程流程制造出的物品。
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8.发明授权Method and apparatus for controlling the flow of wafers through a process flow 有权通过工艺流程控制晶片流动的方法和装置公开(公告)号：US06675058B1
公开(公告)日：2004-01-06
申请号：US09821630
申请日：2001-03-29
申请人： Alexander J. Pasadyn , Anthony J. Toprac , Christopher A. Bode , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Alexander J. Pasadyn , Anthony J. Toprac , Christopher A. Bode , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
IPC分类号： G06F1900
CPC分类号： G05B19/41865 , G05B2219/32272 , H01L21/67276 , Y02P90/18 , Y02P90/20 , Y02P90/86
摘要： A method for controlling the flow of wafers through a process flow includes monitoring operating states of a plurality of processing tools adapted to process wafers; measuring a characteristic of a particular incoming wafer; identifying a particular processing tool having an operating state complimentary to the measured characteristic; and routing the particular incoming wafer to the particular processing tool for processing. A manufacturing system includes a plurality of processing tools adapted to process wafers and a process control server. The process control server is adapted to access metrology data related to a characteristic of a particular incoming wafer, identify a particular processing tool having an operating state complimentary to the characteristic, and route the particular incoming wafer to the particular processing tool for processing.
摘要翻译： 用于通过工艺流程控制晶片流动的方法包括监测适于处理晶片的多个处理工具的操作状态; 测量特定输入晶片的特性; 识别具有与测量特性相互补充的操作状态的特定加工工具; 并将特定进入的晶片路由到特定的处理工具进行处理。 制造系统包括适于处理晶片的多个处理工具和过程控制服务器。 过程控制服务器适于访问与特定输入晶片的特性相关的度量数据，识别具有与该特征相互补充的操作状态的特定处理工具，并将特定输入晶片路由到特定处理工具进行处理。
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9.发明授权Method and apparatus for determining a sampling plan based on process and equipment state information 有权基于过程和设备状态信息确定采样计划的方法和装置公开(公告)号：US06821792B1
公开(公告)日：2004-11-23
申请号：US10023119
申请日：2001-12-18
IPC分类号： H01L21302
CPC分类号： H01L22/20 , G05B2219/37448 , G05B2219/45031
摘要： A processing line includes a process tool, a metrology tool, a tool state monitor, and a sampling controller. The processing tool is configured to process workpieces. The metrology tool is configured to measure an output characteristic of selected workpieces in accordance with a sampling plan. The tool state monitor is configured to observe at least one tool state variable value during the processing of a selected workpiece in the processing tool. The sampling controller is configured to receive the observed tool state variable value and determine the sampling plan for the metrology tool based on the observed tool state variable value. A method for processing workpieces includes processing a plurality of workpieces in a processing tool. A characteristic of selected workpieces is measured in accordance with a sampling plan. At least one tool state variable value is observed during the processing of a particular workpiece in the processing tool. The sampling plan is determined based on the observed tool state variable value.
摘要翻译： 处理线包括处理工具，计量工具，工具状态监视器和采样控制器。 处理工具被配置为处理工件。 计量工具被配置为根据抽样计划来测量所选择的工件的输出特性。 工具状态监视器被配置为在处理工具中的所选择的工件的处理期间观察至少一个刀具状态变量值。 采样控制器被配置为接收观察到的工具状态变量值，并且基于所观测的工具状态变量值来确定测量工具的采样计划。 一种用于处理工件的方法包括在处理工具中处理多个工件。 所选工件的特性根据抽样计划进行测量。 在处理工具中的特定工件的处理期间观察到至少一个刀具状态变量值。 采样计划是根据观察到的工具状态变量值确定的。
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公开(公告)号：US06801817B1
公开(公告)日：2004-10-05
申请号：US09789140
申请日：2001-02-20
申请人： Christopher A. Bode , Alexander J. Pasadyn , Anthony J. Toprac , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Christopher A. Bode , Alexander J. Pasadyn , Anthony J. Toprac , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
IPC分类号： G06F1900
CPC分类号： G05B19/41865 , G05B19/40937 , Y02P90/16 , Y02P90/20 , Y02P90/265
摘要： A method for controlling a manufacturing system includes processing workpieces in a plurality of tools; initiating a baseline control script for a selected tool of the plurality of tools; providing context information for the baseline control script; determining a tool type based on the context information; selecting a group of control routines for the selected tool based on the tool type; determining required control routines from the group of control routines based on the context information; and executing the required control routines to generate control actions for the selected tool. A manufacturing system includes a plurality of tools adapted to process workpieces, a control execution manager, and a control executor. The control execution manager is adapted to initiate a baseline control script for a selected tool of the plurality of tools and provide context information for the baseline control script. The control executor is adapted to execute the baseline control script, determine a tool type based on the context information, select a group of control routines for the selected tool based on the tool type, determine required control routines from the group of control routines based on the context information, and execute the required control routines to generate control actions for the selected tool.
摘要翻译： 一种用于控制制造系统的方法包括：处理多个工具中的工件; 为所述多个工具的所选择的工具启动基线控制脚本; 提供基线控制脚本的上下文信息; 基于上下文信息确定工具类型; 基于所述工具类型为所选择的工具选择一组控制例程; 基于所述上下文信息来确定来自所述一组控制例程的所需控制例程; 并执行所需的控制例程以产生所选择的工具的控制动作。 制造系统包括适于处理工件的多个工具，控制执行管理器和控制执行器。 所述控制执行管理器适于启动用于所述多个工具的所选工具的基线控制脚本并提供所述基线控制脚本的上下文信息。 控制执行器适于执行基线控制脚本，基于上下文信息确定工具类型，基于工具类型为所选择的工具选择一组控制例程，从基于控制例程的组中确定所需的控制例程 上下文信息，并执行所需的控制例程以生成所选择的工具的控制动作。
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