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公开(公告)号:US20120049375A1
公开(公告)日:2012-03-01
申请号:US12871939
申请日:2010-08-31
申请人: Thorsten MEYER , Gottfried BEER , Christian GEISSLER , Thomas ORT , Klaus PRESSEL , Bernd WAIDHAS , Andreas WOLTER
发明人: Thorsten MEYER , Gottfried BEER , Christian GEISSLER , Thomas ORT , Klaus PRESSEL , Bernd WAIDHAS , Andreas WOLTER
IPC分类号: H01L23/48 , H01L21/768
CPC分类号: H01L23/5389 , H01L21/568 , H01L24/05 , H01L24/24 , H01L24/82 , H01L24/96 , H01L25/0655 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/05547 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/12105 , H01L2224/24137 , H01L2224/24195 , H01L2924/01005 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/1431 , H01L2924/1433 , H01L2924/1434 , H01L2924/1461 , H01L2924/15787 , H01L2924/18162 , H01L2924/00
摘要: A method and a system for routing electrical connections of a plurality of chips are disclosed. In one embodiment, a semiconductor device is provided comprising at least one semiconductor chip, at least one routing plane comprising at least one routing line, and at least one connecting line electrically coupled to the at least one routing line and at least one semiconductor chip.
摘要翻译: 公开了一种用于路由多个芯片的电连接的方法和系统。 在一个实施例中,提供半导体器件,其包括至少一个半导体芯片,包括至少一个布线线的至少一个布线平面以及电耦合到所述至少一个布线线和至少一个半导体芯片的至少一个连接线。