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公开(公告)号：US07180284B2
公开(公告)日：2007-02-20
申请号：US11244334
申请日：2005-10-04
CPC分类号： G01R31/2868 , G01R31/2851 , G01R31/2887 , G01R31/2893 , G01R31/311
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
摘要翻译： 本发明提供一种测试衬底上电路的方法。 一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动 关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子 从触点脱离，并且将基板从测试卡盘移除。
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公开(公告)号：US06781394B1
公开(公告)日：2004-08-24
申请号：US10035457
申请日：2001-10-22
IPC分类号： G01R3102
CPC分类号： G01R31/01 , G01R31/2886
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
摘要翻译： 本发明提供一种测试衬底上电路的方法。 一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动 关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子 从触点脱离，并且将基板从测试卡盘移除。
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公开(公告)号：US07259548B2
公开(公告)日：2007-08-21
申请号：US11033349
申请日：2005-01-07
CPC分类号： G01R31/2893 , G01R31/2867 , G01R31/2887 , G01R31/2891
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
摘要翻译： 本发明提供一种测试衬底上电路的方法。 一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动 关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子 从触点脱离，并且将基板从测试卡盘移除。
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公开(公告)号：US06771060B1
公开(公告)日：2004-08-03
申请号：US10035482
申请日：2001-10-22
IPC分类号： G01R3126
CPC分类号： G01R31/2868 , G01R31/2851 , G01R31/2887 , G01R31/2893 , G01R31/311
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
摘要翻译： 本发明提供一种测试衬底上电路的方法。 一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动 关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子 从触点脱离，并且将基板从测试卡盘移除。
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公开(公告)号：US07453260B2
公开(公告)日：2008-11-18
申请号：US11492509
申请日：2006-07-24
CPC分类号： G01R31/2893 , G01R31/2867 , G01R31/2887 , G01R31/2891
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
摘要翻译： 本发明提供一种测试衬底上电路的方法。 一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动 关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子 从触点脱离，并且将基板从测试卡盘移除。
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公开(公告)号：US07098649B2
公开(公告)日：2006-08-29
申请号：US10871630
申请日：2004-06-17
CPC分类号： G01R31/2893 , G01R31/2867 , G01R31/2887 , G01R31/2891
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
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公开(公告)号：US07002337B2
公开(公告)日：2006-02-21
申请号：US10900899
申请日：2004-07-27
IPC分类号： G01R31/26
CPC分类号： G01R31/2868 , G01R31/2851 , G01R31/2887 , G01R31/2893 , G01R31/311
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
摘要翻译： 本发明提供一种测试衬底上电路的方法。 一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动 关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子 从触点脱离，并且将基板从测试卡盘移除。
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公开(公告)号：US06861859B1
公开(公告)日：2005-03-01
申请号：US10035508
申请日：2001-10-22
IPC分类号： G01R31/28 , H01L21/66 , H01L21/677 , G01R31/02 , G01R31/26
CPC分类号： G01R31/2893 , G01R31/2867 , G01R31/2887 , G01R31/2891
摘要： The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contracts, and the substrate is removed from the test chuck.
摘要翻译： 本发明提供一种测试衬底上电路的方法。 一般来说，基板位于转移卡盘中，测试卡盘的表面移动与基板接触，将基板固定到测试卡盘，使测试卡盘相对于转印卡盘移动，使得基板移动 关闭转印卡盘，基板上的端子移动与触点接触，将电路通过端子和触点电连接到电气测试仪，信号通过端子和电测试器与电路之间的触点中继，端子 从合同脱离，并且将基板从测试卡盘移除。
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