-
公开(公告)号：US20110171478A1
公开(公告)日：2011-07-14
申请号：US12718516
申请日：2010-03-05
申请人： Tingji Tang , Gu Xu , Xing-Fu Zhong , Wenbin Hong , Tony D. Flaim , Kimberly Yess , Ramachandran K. Trichur
发明人： Tingji Tang , Gu Xu , Xing-Fu Zhong , Wenbin Hong , Tony D. Flaim , Kimberly Yess , Ramachandran K. Trichur
IPC分类号： C09D145/00 , B32B13/12 , B32B15/08 , B32B27/00 , B32B27/08 , B32B17/10 , G03F7/20 , G03F7/004 , H05K13/00
CPC分类号： B81C1/00801 , B81C2201/053 , C08G61/08 , C08G2261/3324 , C08G2261/418 , G03F7/033 , G03F7/094 , H01L21/0274 , H01L21/3081 , Y10T428/31645 , Y10T428/31667 , Y10T428/31692 , Y10T428/31855 , Y10T428/31909
摘要： New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.
摘要翻译： 提供了在制造半导体和MEMS器件期间使用这些组合物作为保护层的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可以用于在酸蚀刻和其它加工和处理期间形成保护基材的层。 保护层可以是光敏的或非感光的，并且可以在保护层下面使用或不使用底漆层。 优选的底漆层在溶剂体系中包含碱性聚合物。
-
公开(公告)号：US08771927B2
公开(公告)日：2014-07-08
申请号：US12718516
申请日：2010-03-05
申请人： Tingji Tang , Gu Xu , Xing-Fu Zhong , Wenbin Hong , Tony D. Flaim , Kimberly Yess , Ramachandran K. Trichur
发明人： Tingji Tang , Gu Xu , Xing-Fu Zhong , Wenbin Hong , Tony D. Flaim , Kimberly Yess , Ramachandran K. Trichur
IPC分类号： G03F7/26
CPC分类号： B81C1/00801 , B81C2201/053 , C08G61/08 , C08G2261/3324 , C08G2261/418 , G03F7/033 , G03F7/094 , H01L21/0274 , H01L21/3081 , Y10T428/31645 , Y10T428/31667 , Y10T428/31692 , Y10T428/31855 , Y10T428/31909
摘要： New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.
摘要翻译： 提供了在制造半导体和MEMS器件期间使用这些组合物作为保护层的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可以用于在酸蚀刻和其它加工和处理期间形成保护基材的层。 保护层可以是光敏的或非感光的，并且可以在保护层下面使用或不使用底漆层。 优选的底漆层在溶剂体系中包含碱性聚合物。
-
3.发明申请DEVELOPMENT OF HIGH-VISCOSITY BONDING LAYER THROUGH IN-SITU POLYMER CHAIN EXTENSION 有权通过现场聚合物链扩展开发高粘度粘结层公开(公告)号：US20130288058A1
公开(公告)日：2013-10-31
申请号：US13460372
申请日：2012-04-30
申请人： Wenbin Hong , Tony D. Flaim , Rama Puligadda , Susan Bailey
发明人： Wenbin Hong , Tony D. Flaim , Rama Puligadda , Susan Bailey
CPC分类号： C08G73/0233 , B32B15/08 , C08G18/3215 , C08G18/4837 , C08G18/4841 , C08G18/7621 , C08G18/7671 , C08G69/44 , C08G2170/40 , C09J4/00 , C09J5/00 , C09J133/00 , C09J175/02 , C09J175/08 , C09J177/12 , C09J2203/326 , C09J2205/302 , H01L21/2007 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , Y10T156/10 , Y10T428/31515 , Y10T428/31551 , Y10T428/31725 , Y10T428/31786 , C08G18/10 , C08G18/48
摘要： New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.
摘要翻译： 提供了使用这些组合物作为临时晶片接合的粘合组合物的新组合物和方法。 组合物用于在微电子制造中使用粘合组合物的组分的原位聚合反应将活性晶片临时粘合到载体晶片或基底上，以产生粘合层。 组合物形成机械强度和耐热性，但允许晶片在制造过程中的适当阶段分离的聚合粘合层。 粘合层还保留其溶解度，使得可以使用简单的湿法而不是蚀刻或其它苛刻的处理从脱粘的晶片清洗残留物。
-
公开(公告)号：US20120291938A1
公开(公告)日：2012-11-22
申请号：US13548674
申请日：2012-07-13
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
IPC分类号： B29C65/52
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。
-
公开(公告)号：US08092628B2
公开(公告)日：2012-01-10
申请号：US12263120
申请日：2008-10-31
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
IPC分类号： B32B37/00
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。
-
公开(公告)号：US20110086955A1
公开(公告)日：2011-04-14
申请号：US12969367
申请日：2010-12-15
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
IPC分类号： C08K5/5393 , C09J147/00
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。
-
公开(公告)号：US20100112305A1
公开(公告)日：2010-05-06
申请号：US12263120
申请日：2008-10-31
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。
-
8.发明授权Development of high-viscosity bonding layer through in-situ polymer chain extension 有权通过原位聚合物链延伸开发高粘度粘结层公开(公告)号：US09127126B2
公开(公告)日：2015-09-08
申请号：US13460372
申请日：2012-04-30
申请人： Wenbin Hong , Tony D. Flaim , Rama Puligadda , Susan Bailey
发明人： Wenbin Hong , Tony D. Flaim , Rama Puligadda , Susan Bailey
CPC分类号： C08G73/0233 , B32B15/08 , C08G18/3215 , C08G18/4837 , C08G18/4841 , C08G18/7621 , C08G18/7671 , C08G69/44 , C08G2170/40 , C09J4/00 , C09J5/00 , C09J133/00 , C09J175/02 , C09J175/08 , C09J177/12 , C09J2203/326 , C09J2205/302 , H01L21/2007 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , Y10T156/10 , Y10T428/31515 , Y10T428/31551 , Y10T428/31725 , Y10T428/31786 , C08G18/10 , C08G18/48
摘要： New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.
摘要翻译： 提供了使用这些组合物作为临时晶片接合的粘合组合物的新组合物和方法。 组合物用于在微电子制造中使用粘合组合物的组分的原位聚合反应将活性晶片临时粘合到载体晶片或基底上，以产生粘合层。 组合物形成机械强度和耐热性，但允许晶片在制造过程中的适当阶段分离的聚合粘合层。 粘合层还保留其溶解度，使得可以使用简单的湿法而不是蚀刻或其它苛刻的处理从脱粘的晶片清洗残留物。
-
公开(公告)号：US08771442B2
公开(公告)日：2014-07-08
申请号：US13548674
申请日：2012-07-13
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
IPC分类号： C08L65/00 , C09J123/00 , B32B37/00 , C08G77/14 , C08G73/10
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。
-
公开(公告)号：US08221571B2
公开(公告)日：2012-07-17
申请号：US12969367
申请日：2010-12-15
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
-
-
-
-
-
-
-
-
-
搜索结果
20 条记录 (耗时 0.062 秒)
