公开(公告)号：US09127126B2

公开(公告)日：2015-09-08

申请号：US13460372

申请日：2012-04-30

申请人： Wenbin Hong ,  Tony D. Flaim ,  Rama Puligadda ,  Susan Bailey

发明人： Wenbin Hong ,  Tony D. Flaim ,  Rama Puligadda ,  Susan Bailey

IPC分类号： H01L21/00 ,  B31B1/60 ,  C08G73/02 ,  H01L21/683 ,  H01L21/20 ,  C09J5/00 ,  B32B15/08

CPC分类号： C08G73/0233 ,  B32B15/08 ,  C08G18/3215 ,  C08G18/4837 ,  C08G18/4841 ,  C08G18/7621 ,  C08G18/7671 ,  C08G69/44 ,  C08G2170/40 ,  C09J4/00 ,  C09J5/00 ,  C09J133/00 ,  C09J175/02 ,  C09J175/08 ,  C09J177/12 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/2007 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/10 ,  Y10T428/31515 ,  Y10T428/31551 ,  Y10T428/31725 ,  Y10T428/31786 ,  C08G18/10 ,  C08G18/48

摘要： New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.

摘要翻译： 提供了使用这些组合物作为临时晶片接合的粘合组合物的新组合物和方法。 组合物用于在微电子制造中使用粘合组合物的组分的原位聚合反应将活性晶片临时粘合到载体晶片或基底上，以产生粘合层。 组合物形成机械强度和耐热性，但允许晶片在制造过程中的适当阶段分离的聚合粘合层。 粘合层还保留其溶解度，使得可以使用简单的湿法而不是蚀刻或其它苛刻的处理从脱粘的晶片清洗残留物。

公开(公告)号：US20130288058A1

公开(公告)日：2013-10-31

申请号：US13460372

申请日：2012-04-30

申请人： Wenbin Hong ,  Tony D. Flaim ,  Rama Puligadda ,  Susan Bailey

发明人： Wenbin Hong ,  Tony D. Flaim ,  Rama Puligadda ,  Susan Bailey

IPC分类号： B32B37/00 ,  B32B7/12 ,  B32B38/10 ,  B32B37/12 ,  B32B38/00

CPC分类号： C08G73/0233 ,  B32B15/08 ,  C08G18/3215 ,  C08G18/4837 ,  C08G18/4841 ,  C08G18/7621 ,  C08G18/7671 ,  C08G69/44 ,  C08G2170/40 ,  C09J4/00 ,  C09J5/00 ,  C09J133/00 ,  C09J175/02 ,  C09J175/08 ,  C09J177/12 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/2007 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/10 ,  Y10T428/31515 ,  Y10T428/31551 ,  Y10T428/31725 ,  Y10T428/31786 ,  C08G18/10 ,  C08G18/48

摘要： New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.

摘要翻译： 提供了使用这些组合物作为临时晶片接合的粘合组合物的新组合物和方法。 组合物用于在微电子制造中使用粘合组合物的组分的原位聚合反应将活性晶片临时粘合到载体晶片或基底上，以产生粘合层。 组合物形成机械强度和耐热性，但允许晶片在制造过程中的适当阶段分离的聚合粘合层。 粘合层还保留其溶解度，使得可以使用简单的湿法而不是蚀刻或其它苛刻的处理从脱粘的晶片清洗残留物。

公开(公告)号：US20140130969A1

公开(公告)日：2014-05-15

申请号：US14131157

申请日：2012-07-09

申请人： Jeremy McCutcheon ,  Tony D. Flaim ,  Susan Bailey

发明人： Jeremy McCutcheon ,  Tony D. Flaim ,  Susan Bailey

IPC分类号： B32B38/10 ,  B32B7/06 ,  B32B7/14 ,  B32B43/00 ,  B32B7/12

CPC分类号： B32B38/10 ,  B32B7/06 ,  B32B7/12 ,  B32B7/14 ,  B32B43/006 ,  B32B2457/14 ,  H01L21/2007 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  Y10T156/11 ,  Y10T428/24331 ,  Y10T428/24851 ,  Y10T428/30 ,  Y10T428/31598 ,  Y10T428/31667

摘要： New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.

摘要翻译： 提供了从这些方法形成的新的临时粘合方法和制品。 在一个实施方案中，所述方法包括用刚性支撑层在生长衬底上涂覆器件或其它超薄层，然后将该堆叠结合到载体衬底。 然后可以除去生长衬底，并将超薄层安装在最终的载体上。 在另一个实施例中，本发明提供了在处理期间处理装置层的方法，该方法必须在脆性层的两侧出现而不会损坏脆性层。 这是通过连续使用两个载体来实现的，一个在器件层的每一侧上，用不同的粘合组合物键合，用于选择性脱粘。

公开(公告)号：US09827757B2

公开(公告)日：2017-11-28

申请号：US14131157

申请日：2012-07-09

申请人： Jeremy McCutcheon ,  Tony D. Flaim ,  Susan Bailey

发明人： Jeremy McCutcheon ,  Tony D. Flaim ,  Susan Bailey

IPC分类号： B29C65/48 ,  B32B9/04 ,  B32B37/12 ,  B32B37/16 ,  B32B38/10 ,  B32B43/00 ,  H01L21/683 ,  B32B7/06 ,  B32B7/12 ,  B32B7/14 ,  H01L21/20

CPC分类号： B32B38/10 ,  B32B7/06 ,  B32B7/12 ,  B32B7/14 ,  B32B43/006 ,  B32B2457/14 ,  H01L21/2007 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  Y10T156/11 ,  Y10T428/24331 ,  Y10T428/24851 ,  Y10T428/30 ,  Y10T428/31598 ,  Y10T428/31667

摘要： New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.

公开(公告)号：US11752922B1

公开(公告)日：2023-09-12

申请号：US16930636

申请日：2020-07-16

申请人： Andrew Galton ,  Randy Martin ,  Bruce Murphy ,  Susan Bailey

发明人： Andrew Galton ,  Randy Martin ,  Bruce Murphy ,  Susan Bailey

IPC分类号： B60P7/08 ,  B25J18/02 ,  B25J1/04 ,  B60P7/12

CPC分类号： B60P7/0853 ,  B25J1/04 ,  B25J18/025 ,  B60P7/12

摘要： A load securement device may comprise an extendable pole and a plurality of attachments. The device may be operable to manipulate a tie down of a cargo trailer. As non-limiting examples, the tie down may be a cargo strap, a cargo chain, or an elastic cord used to secure a cargo or to secure a tarp over the cargo. The extendable pole may be lengthened to reach the top of the cargo. The extendable pole may be shortened to take up less space for storage. The plurality of attachments may alter a distal end of the extendable pole to enable the extendable pole to perform multiple tasks necessary for securing the cargo. As non-limiting examples, the plurality of attachments may enable the extendable pole to toss the cargo strap, to pull the cargo strap, or lift a hard corner.

公开(公告)号：US20180340281A1

公开(公告)日：2018-11-29

申请号：US15990786

申请日：2018-05-28

申请人： Randy Bailey ,  Susan Bailey

发明人： Randy Bailey ,  Susan Bailey

IPC分类号： D06C3/04 ,  F16B2/10 ,  D06F95/00

摘要： A clipping apparatus is described herein. The clipping apparatus may include a u-shaped clasp and a tab. The clasp may include an open end and a closed end, a first side and a second side, and a tongue. The tab may be coupled to, and extend from, the closed end of the clasp. The first side may include a wall extending from the closed end to the open end. The second side may include two prongs extending from the closed end to the open end. The tongue may be rotatably connected to the two prongs between the two prongs. The tab may include a first opening and a second opening. The first opening may be disposed in the tab adjacent to the closed end of the clasp. The second opening may be disposed in the tab at a distal end to the tab from the clasp.

公开(公告)号：US20070243354A1

公开(公告)日：2007-10-18

申请号：US11406189

申请日：2006-04-18

申请人： Susan Bailey ,  Andrew Van Brocklin ,  Vladek Kasperchik

发明人： Susan Bailey ,  Andrew Van Brocklin ,  Vladek Kasperchik

IPC分类号： B32B3/02

CPC分类号： B41M5/30 ,  B41M5/34 ,  B41M5/42 ,  B41M5/44

摘要： An image-recording medium includes a substrate, one or more writable layers adapted to be written by laser radiation characterized by a laser wavelength to form an image therein, and one or more thermally insulating layers comprising a material substantially transparent both at the laser wavelength and at wavelengths in the visible spectrum.

摘要翻译： 一种图像记录介质包括一个基板，一个或多个可写入层，其适用于以激光波长为特征的激光辐射写入，以形成其中的图像;以及一个或多个热绝缘层，包括在激光波长和基本上透明的材料; 在可见光谱的波长。

公开(公告)号：US20070238045A1

公开(公告)日：2007-10-11

申请号：US11393536

申请日：2006-03-29

申请人： Andrew Brocklin ,  Susan Bailey ,  Makarand Gore

发明人： Andrew Brocklin ,  Susan Bailey ,  Makarand Gore

IPC分类号： G03C1/00

CPC分类号： B41M5/286 ,  B41M5/28 ,  B41M5/34

摘要： A radiation imageable coating includes a first thermochromic layer including a bleachable antenna dye and a second thermochromic layer including a non-bleachable antenna dye.

摘要翻译： 可辐射成像涂层包括包含可漂白天线染料的第一热变色层和包含不可漂白天线染料的第二热变色层。