SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD AND NON-TRANSITORY STORAGE MEDIUM
    1.
    发明申请
    SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD AND NON-TRANSITORY STORAGE MEDIUM 有权
    基板清洁装置,基板清洁方法和非存储存储介质

    公开(公告)号:US20140352737A1

    公开(公告)日:2014-12-04

    申请号:US14283331

    申请日:2014-05-21

    CPC classification number: H01L21/67051

    Abstract: A cleaning liquid and a gas are discharged in sequence to a central portion of a substrate while the substrate is being rotated, and after nozzles that discharge them are moved to a peripheral edge side of the substrate, discharge of the cleaning liquid is switched to a second cleaning liquid nozzle set at a position deviated from a movement locus of the first cleaning liquid nozzle. Both of the nozzles are moved toward the peripheral edge side of the substrate while discharging the cleaning liquid and discharging the gas so that a difference between a distance from the discharge position of the second cleaning liquid nozzle to the central portion of the substrate and a distance from the discharge position of the gas nozzle to the central portion of the substrate gradually decreases.

    Abstract translation: 在基板旋转的同时,将清洗液和气体顺序地排出到基板的中心部分,在将其排出的喷嘴移动到基板的周缘侧后,将清洗液的排出切换为 第二清洗液喷嘴设置在偏离第一清洗液喷嘴的移动轨迹的位置。 两个喷嘴在排出清洁液体并排出气体的同时朝向基板的周缘侧移动,使得从第二清洗液喷嘴的排出位置到基板的中心部分的距离与距离 从气体喷嘴的排出位置到基板的中央部逐渐减小。

    SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD AND NON-TRANSITORY STORAGE MEDIUM

    公开(公告)号:US20170256427A1

    公开(公告)日:2017-09-07

    申请号:US15598358

    申请日:2017-05-18

    CPC classification number: H01L21/67051

    Abstract: A cleaning liquid and a gas are discharged in sequence to a central portion of a substrate while the substrate is being rotated, and after nozzles that discharge them are moved to a peripheral edge side of the substrate, discharge of the cleaning liquid is switched to a second cleaning liquid nozzle set at a position deviated from a movement locus of the first cleaning liquid nozzle. Both of the nozzles are moved toward the peripheral edge side of the substrate while discharging the cleaning liquid and discharging the gas so that a difference between a distance from the discharge position of the second cleaning liquid nozzle to the central portion of the substrate and a distance from the discharge position of the gas nozzle to the central portion of the substrate gradually decreases.

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