SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20230257877A1

    公开(公告)日:2023-08-17

    申请号:US18163949

    申请日:2023-02-03

    CPC classification number: C23C16/4412 C23C16/4584

    Abstract: A substrate processing apparatus includes: a processing chamber; a rotary table rotatably provided inside the processing chamber; a stage that is rotatable relative to the rotary table at a position spaced apart from a rotation center of the rotary table; a process gas supplier provided above the rotary table; a separation gas supplier to supply a separation gas to separation regions, each of the separation regions being adjacent to a processing region; and a gas exhauster including exhaust ports communicating with an inside of the processing chamber, wherein the exhaust ports are provided in the processing region between the separation regions and are provided above the rotary table.

    SUBSTRATE PROCESSING APPARATUS
    3.
    发明公开

    公开(公告)号:US20240295027A1

    公开(公告)日:2024-09-05

    申请号:US18581954

    申请日:2024-02-20

    CPC classification number: C23C16/4584

    Abstract: A substrate processing apparatus includes a vacuum chamber; a rotary table rotatably provided in the vacuum chamber; and a stage configured to rotate together with the rotary table. The rotary table has an opening provided at a position spaced apart from a rotation center of the rotary table. An inner surface of the opening is continuous with an upper surface and a lower surface of the rotary table. The stage is spaced apart from the inner surface of the opening by a clearance.

Patent Agency Ranking