公开(公告)号：US20240094644A1

公开(公告)日：2024-03-21

申请号：US18465420

申请日：2023-09-12

Applicant: Tokyo Electron Limited

Inventor： Makoto OGATA ,  Katsuya HASHIMOTO ,  Katsunori ICHINO ,  Masataka TANAKA ,  Kazuya KUDO

IPC: G03F7/00

CPC classification number: G03F7/70808 ,  G03F7/7085 ,  G03F7/70925

Abstract: A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatment modules, wherein: the solution supply unit includes supply pipelines provided with a solution feeder corresponding to the solution treatment modules; and the solution feeder includes a pump configured to pressure-feed the treatment solution to the corresponding solution treatment module and a filter configured to filtrate the treatment solution, and is arranged adjacent to the corresponding solution treatment module in a horizontal direction.