公开(公告)号：US20240152052A1

公开(公告)日：2024-05-09

申请号：US18386781

申请日：2023-11-03

Applicant: Tokyo Electron Limited

Inventor： Masataka TANAKA ,  Tsunaki IKEDA ,  Yuta NISHIYAMA

IPC: G03F7/16 ,  G03F7/40 ,  H01L21/67

CPC classification number: G03F7/16 ,  G03F7/40 ,  H01L21/67023

Abstract: A substrate processing apparatus includes: a carrier block, into which a carrier storing a substrate is carried; a processing block including a liquid processing module that supplies a processing liquid to the substrate transferred from the carrier block, thereby performing a liquid processing; and an interface block, to which the substrate is transferred from the processing block. The interface block includes a liquid storage, in which a bottle storing the processing liquid is disposed. The carrier block includes a liquid feeder that feeds the processing liquid supplied from the liquid storage, to the liquid processing module. The liquid feeder includes a filter that filters the processing liquid supplied from the liquid storage, and a first pump that pumps the processing liquid toward the liquid processing module.

公开(公告)号：US20240094644A1

公开(公告)日：2024-03-21

申请号：US18465420

申请日：2023-09-12

Applicant: Tokyo Electron Limited

Inventor： Makoto OGATA ,  Katsuya HASHIMOTO ,  Katsunori ICHINO ,  Masataka TANAKA ,  Kazuya KUDO

IPC: G03F7/00

CPC classification number: G03F7/70808 ,  G03F7/7085 ,  G03F7/70925

Abstract: A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatment modules, wherein: the solution supply unit includes supply pipelines provided with a solution feeder corresponding to the solution treatment modules; and the solution feeder includes a pump configured to pressure-feed the treatment solution to the corresponding solution treatment module and a filter configured to filtrate the treatment solution, and is arranged adjacent to the corresponding solution treatment module in a horizontal direction.

公开(公告)号：US20170032983A1

公开(公告)日：2017-02-02

申请号：US15220653

申请日：2016-07-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Koshi MUTA ,  Tsuyoshi MORIYA ,  Takuya MORI ,  Kazuhiro TAKESHITA ,  Tomonori ESAKI ,  Kouichi MIZUNAGA ,  Masataka TANAKA ,  Kouzou KANAGAWA ,  Keigo NAKANO

IPC: H01L21/67 ,  G03F7/16

CPC classification number: G03F7/16 ,  G03F7/168 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67748

Abstract: A thermal catalytic layer is formed on the inner surface of a processing container and heated. Thus, when a sublimate sublimated from a coating film on a wafer W and received within the processing container reaches the vicinity of the thermal catalytic layer, the sublimate is decomposed and removed by the thermal activation of the thermal catalytic layer. In removing a sublimate attached to a light transmission window, a cleaning substrate formed with the thermal catalytic layer on the surface thereof is carried into the processing container and caused to approach the light transmission window. Thereafter, the cleaning substrate is heated so that the sublimate attached to the surface of the light transmission window is removed.

Abstract translation: 在处理容器的内表面上形成热催化剂层并加热。 因此，当从晶片W上的涂膜升华并接收在处理容器内的升华达到热催化层附近时，通过热催化层的热活化来分解和去除升华。 在移除附着在透光窗口上的升华中，在其表面上形成有热催化层的清洁基板被运送到处理容器中并使其接近透光窗。 此后，加热清洁基板，使得附着在透光窗的表面上的升华被去除。