公开(公告)号：US20240242978A1

公开(公告)日：2024-07-18

申请号：US18413295

申请日：2024-01-16

Applicant: Tokyo Electron Limited

Inventor： Shota UMEZAKI ,  Shigeru MORIYAMA ,  Tomotaka OMAGARI ,  Keiichi YAHATA ,  Shuji OIE ,  Yuichi TANAKA ,  Katsuhiro OOKAWA ,  Manabu YAMANAKA ,  Takuya ITAHASHI

IPC: H01L21/67 ,  F26B5/04

CPC classification number: H01L21/67034 ,  F26B5/04 ,  H01L21/67126 ,  H01L21/67242

Abstract: A substrate processing apparatus includes a drying unit for replacing a liquid film formed on a substrate with a supercritical fluid to dry the substrate, and a control device. The drying unit includes a pressure container, a supply mechanism for supplying fluid to the pressure container, a discharge mechanism for discharging the fluid from the pressure container, a panel for separating an internal space from an external space, an electromagnetic lock, and a concentration sensor for detecting a concentration of the fluid. An unlocking condition for the control device to switch a state of the electromagnetic lock from a locked state to an unlocked state includes a condition that a detection value of the pressure sensor is less than or equal to a first threshold value and a condition that a detection value of the concentration sensor is less than or equal to a second threshold value.

公开(公告)号：US20250028256A1

公开(公告)日：2025-01-23

申请号：US18707280

申请日：2021-11-17

Applicant: Tokyo Electron Limited

Inventor： Keiichi YAHATA

IPC: G03F7/00

Abstract: A substrate treatment system connected to an exposure apparatus, includes: a substrate treatment apparatus configured to perform a treatment on a substrate; and a supply apparatus configured to supply atmosphere gas during a substrate treatment to the substrate treatment apparatus, wherein: the supply apparatus includes an intake part configured to take in emission gas emitted from the exposure apparatus; and the supply apparatus regulates a temperature and/or a humidity of the emission gas taken in from the intake part and then supplies the emission gas as the atmosphere gas to the substrate treatment apparatus.