公开(公告)号：US20240128058A1

公开(公告)日：2024-04-18

申请号：US18381222

申请日：2023-10-18

Applicant: Tokyo Electron Limited

Inventor： Takashi ARAMAKI ,  Kojiro MATSUZAKA ,  Atsushi OGATA ,  Lifu LI ,  Gyeong Min PARK

IPC: H01J37/32

CPC classification number: H01J37/32513 ,  H01J2237/334

Abstract: A substrate processing apparatus comprises a substrate support disposed in the chamber, a shutter including a valve body configured to open and close an opening of the chamber, and a baffle plate disposed between an inner peripheral side of the chamber and the substrate support and having a vertically inclined portion at an end portion on a substrate support side, and a contact member disposed on a side surface of the substrate support and formed of a conductive elastic member. In a state where the shutter is closed, contact between the end portion on the substrate support side and the contact member is maintained.