公开(公告)号：US20240128058A1

公开(公告)日：2024-04-18

申请号：US18381222

申请日：2023-10-18

Applicant: Tokyo Electron Limited

Inventor： Takashi ARAMAKI ,  Kojiro MATSUZAKA ,  Atsushi OGATA ,  Lifu LI ,  Gyeong Min PARK

IPC: H01J37/32

CPC classification number: H01J37/32513 ,  H01J2237/334

Abstract: A substrate processing apparatus comprises a substrate support disposed in the chamber, a shutter including a valve body configured to open and close an opening of the chamber, and a baffle plate disposed between an inner peripheral side of the chamber and the substrate support and having a vertically inclined portion at an end portion on a substrate support side, and a contact member disposed on a side surface of the substrate support and formed of a conductive elastic member. In a state where the shutter is closed, contact between the end portion on the substrate support side and the contact member is maintained.

公开(公告)号：US20200098550A1

公开(公告)日：2020-03-26

申请号：US16582115

申请日：2019-09-25

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shuichi TAKAHASHI ,  Takaharu MIYADATE ,  Takaaki KIKUCHI ,  Atsushi OGATA ,  Nobutaka SASAKI ,  Takashi TAIRA

IPC: H01J37/32 ,  H01L21/687

Abstract: In a plasma processing apparatus, a table has a wafer support to hold a wafer and a peripheral segment surrounding the wafer support and having through-holes. The peripheral segment has an upper surface lower than that of the wafer support. An outer focus ring is disposed over the peripheral segment and has a recess or a cutout at an inner portion of the outer focus ring, and the recess or cutout has through-holes. An inner focus ring is disposed in the recess or cutout of the outer focus ring. Lift pins respectively extend through the through-holes of the peripheral segment and the through-holes of the recess or cutout of the outer focus ring. Shift mechanisms control shift of the respective lift pins.

公开(公告)号：US20230326725A1

公开(公告)日：2023-10-12

申请号：US18210012

申请日：2023-06-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shuichi TAKAHASHI ,  Takaharu MIYADATE ,  Takaaki KIKUCHI ,  Atsushi OGATA ,  Nobutaka SASAKI ,  Takashi TAIRA

IPC: H01J37/32 ,  H01L21/687

CPC classification number: H01J37/32642 ,  H01J37/32724 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/67069

Abstract: In a plasma processing apparatus, a table has a wafer support to hold a wafer and a peripheral segment surrounding the wafer support and having through-holes. The peripheral segment has an upper surface lower than that of the wafer support. An outer focus ring is disposed over the peripheral segment and has a recess or a cutout at an inner portion of the outer focus ring, and the recess or cutout has through-holes. An inner focus ring is disposed in the recess or cutout of the outer focus ring. Lift pins respectively extend through the through-holes of the peripheral segment and the through-holes of the recess or cutout of the outer focus ring. Shift mechanisms control shift of the respective lift pins.

公开(公告)号：US20200234929A1

公开(公告)日：2020-07-23

申请号：US16744982

申请日：2020-01-16

Applicant: TOKYO ELECTRON LIMITED

Inventor： Atsushi OGATA

IPC: H01J37/32 ,  G01B21/24

Abstract: A mounting table has a first surface for mounting jigs one by one and a second surface for mounting a ring member. An acquisition unit acquires a gap dimension between the second surface and a facing portion of the mounted jig. A measurement unit measures a lifted distance of the ring member at each of circumferential multiple locations when an upper surface of the ring member is in contact with the facing portion. A thickness calculation unit calculates, for each of the multiple locations, thickness at each of different radial positions of the ring member based on the gap dimension and the lifted distance. A misalignment calculation unit specifies a characteristic position of the ring member for each of the multiple locations based on the calculated thickness and calculate a misalignment amount between a center of a circle passing through the characteristic positions and a center of the first surface.

公开(公告)号：US20200161101A1

公开(公告)日：2020-05-21

申请号：US16683920

申请日：2019-11-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Atsushi OGATA

IPC: H01J37/32 ,  H01J37/02

Abstract: A mounting table has a first mounting surface for mounting jigs sequentially one by one and a second mounting surface for mounting a ring member. The jigs respectively have facing portions facing an upper surface of the ring member, and positions of the facing portions in a radial direction of the ring member are different. An acquisition unit acquires gap information indicating a gap dimension between the second mounting surface and the facing portion of the mounted jig. A measurement unit measures a lifted distance of the ring member from the second mounting surface when the upper surface is in contact with the facing portion by lifting the ring member while the mounted jig is mounted. A thickness calculation unit calculates thicknesses of the ring member at different locations in the radial direction of the ring member based on the gap dimension and the measured lifted distance.