公开(公告)号：US20220199377A1

公开(公告)日：2022-06-23

申请号：US17553112

申请日：2021-12-16

Applicant: TOKYO ELECTRON LIMITED

Inventor： Toshiharu HIRATA ,  Manabu NAKAGAWASAI ,  Takashi ISHII ,  Keiichi IOBE

IPC: H01J37/32 ,  F24H9/06 ,  C23C14/50 ,  C23C14/54

Abstract: A substrate processing apparatus, a method, and a program for controlling temperature of the substrate processing apparatus. A substrate processing apparatus comprising: a mounting table configured to hold a substrate to be processed in a vacuum processing container; a heat transfer gas container placed on a back side of the mounting table with a gap between the mounting table and the heat transfer gas container and configured to be cooled by a refrigerator; and a control device configured to control heating of the refrigerator to the vicinity of a first temperature on the basis of a temperature of a first control point provided near the refrigerator and then switching the heating control for the refrigerator on or off.

公开(公告)号：US20210280777A1

公开(公告)日：2021-09-09

申请号：US17193545

申请日：2021-03-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Manabu NAKAGAWASAI ,  Koji MAEDA ,  Shinji ORIMOTO ,  Motoi YAMAGATA

IPC: H01L43/12 ,  C23C14/54 ,  C23C14/50

Abstract: A substrate processing apparatus includes a processing chamber where a substrate support on which a substrate is placed and a target holder configured to hold a target are disposed, a freezing device disposed with a gap with respect to a bottom surface of the substrate support and having a chiller and a cold heat medium laminated on the chiller, and a rotating device configured to rotate the substrate support. The substrate processing apparatus further includes a first elevating device configured to raise and lower the substrate support, a coolant channel formed in the chiller to supply a coolant to the gap, and a cold heat transfer material disposed in the gap and being in contact with the substrate support and the cold heat medium so as to transfer heat therebetween.

公开(公告)号：US20220220606A1

公开(公告)日：2022-07-14

申请号：US17638736

申请日：2020-07-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tamaki TAKEYAMA ,  Hiroaki CHIHAYA ,  Motoi YAMAGATA ,  Manabu NAKAGAWASAI ,  Shinji ORIMOTO

IPC: C23C14/54 ,  C23C14/50 ,  C23C14/34 ,  H01L21/687

Abstract: There is provided a method for processing a substrate, comprising: preparing a substrate processing device including a rotatable stage on which a substrate is placed, a frozen heat transfer body fixed on a backside of the stage with a gap interposed therebetween and cooled to an extremely low temperature, a gas supply mechanism configured to supply to the gap a cooling gas for transferring a cold heat of the frozen heat transfer body to the stage, a rotation mechanism configured to rotate the stage, and a processing mechanism configured to process the substrate; preheating the stage such that a temperature of the stage reaches a steady cooling temperature within a fixed range; and after preheating, continuously processing a plurality of substrates by the processing mechanism while rotating the stage that has reached the steady cooling temperature in a state where a substrate having a specific temperature higher than or equal to room temperature is placed on the stage.

公开(公告)号：US20210285718A1

公开(公告)日：2021-09-16

申请号：US17197989

申请日：2021-03-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Manabu NAKAGAWASAI

IPC: F25D29/00 ,  G01K7/18 ,  G01K1/14

Abstract: A temperature sensor, a temperature measuring device comprising the temperature sensor, and a temperature measuring method using the temperature sensor are disclosed. The temperature sensor is disposed at a measurement target having an extremely low temperature and transmits temperature measurement data to a temperature measurement output unit through a lead wire. The temperature sensor includes a housing, an electric resistor disposed in the housing, and a thermal anchor portion disposed inside or outside the housing and connected to the lead wire. Further, the lead wire extending from the thermal anchor portion is connected to the temperature measurement output unit.

公开(公告)号：US20220151078A1

公开(公告)日：2022-05-12

申请号：US17521563

申请日：2021-11-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Manabu NAKAGAWASAI ,  Motoi YAMAGATA

IPC: H05K3/30 ,  H01L21/67

Abstract: There is provided a method for manufacturing a substrate with a sensor in which a sensor is disposed on a plate-shaped substrate. The method comprises: holding the sensor by a magnetic force from a position on an opposite surface of a surface of the plate-shaped substrate on which the sensor is disposed that corresponds to a position where the sensor is fixed; and fixing the sensor to the plate-shaped substrate by curing an adhesive attached to the sensor in a state where the sensor is held by the magnetic force.

公开(公告)号：US20210285092A1

公开(公告)日：2021-09-16

申请号：US17198756

申请日：2021-03-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Manabu NAKAGAWASAI

IPC: C23C14/35 ,  H01J37/34 ,  C23C14/56 ,  C23C14/50

Abstract: A sputtering apparatus includes a base on which a substrate is mounted, an annular member disposed at an outer periphery of the base to surround a side surface and a backside of the substrate without in contact with the substrate, and an edge cover that covers an outer edge of an upper surface of the substrate mounted on the base. The annular member has a first surface facing the backside of the substrate mounted on the base with a gap, a second surface facing the side surface of the substrate mounted on the base with a gap, and a tapered surface formed at a corner portion between the first surface and the second surface.

公开(公告)号：US20210287916A1

公开(公告)日：2021-09-16

申请号：US17198005

申请日：2021-03-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Manabu NAKAGAWASAI ,  Satoshi TAKEDA

IPC: H01L21/48 ,  H01L21/52 ,  H01L21/228

Abstract: A substrate processing device is provided. The substrate processing device includes a processing container including a mounting table, a refrigeration device disposed to have a gap between the mounting table and the refrigeration device, a first elevating device configured to raise or lower the refrigeration device, a refrigerant flow path to supply a refrigerant to the gap, a compression device configured to compress the refrigerant supplied to the refrigerant flow path, and refrigerant transfer pipes connected to both a first connection-fixing unit which is a flow path port of the refrigerant flow path and a second connection-fixing unit fluid-communicating with the compression device. Further, each of the refrigeration transfer pipes extends such that at least a portion of the refrigerant transfer pipe is curved between the first and second connection-fixing units, and each of the refrigerant transfer pipes is placed on a support member at the second connection-fixing unit.

公开(公告)号：US20200381272A1

公开(公告)日：2020-12-03

申请号：US16624492

申请日：2018-06-25

Applicant: Tokyo Electron Limited

Inventor： Shinji ORIMOTO ,  Manabu NAKAGAWASAI ,  Kouji MAEDA ,  Hiroshi MIKI ,  Naoyuki SUZUKI

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A placing table structure according to an embodiment includes: a fixedly disposed refrigerated heat transfer element; a rotatable outer cylinder disposed around the refrigerated heat transfer element; and a stage connected to the outer cylinder and disposed above an upper surface of the refrigerated heat transfer element with inclusion of a gap between the refrigerated heat transfer element and the stage.

公开(公告)号：US20180294176A1

公开(公告)日：2018-10-11

申请号：US15947400

申请日：2018-04-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Manabu NAKAGAWASAI

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/67 ,  C23C14/35 ,  C23C16/458 ,  H01J37/32 ,  C23C16/46 ,  H01L21/02

Abstract: A movable structure includes a processing chamber configured to perform processing under a vacuum environment; a fixed portion disposed in the processing chamber; a movable portion that is movable with respect to the fixed portion; a transmission/reception module provided at the fixed portion and having a hermetically sealed structure; and a sensor module provided at the movable portion and having a hermetically sealed structure. The transmission/reception module and the sensor module perform transmission and reception of signals in a non-contact manner.