公开(公告)号：US20220220606A1

公开(公告)日：2022-07-14

申请号：US17638736

申请日：2020-07-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tamaki TAKEYAMA ,  Hiroaki CHIHAYA ,  Motoi YAMAGATA ,  Manabu NAKAGAWASAI ,  Shinji ORIMOTO

IPC: C23C14/54 ,  C23C14/50 ,  C23C14/34 ,  H01L21/687

Abstract: There is provided a method for processing a substrate, comprising: preparing a substrate processing device including a rotatable stage on which a substrate is placed, a frozen heat transfer body fixed on a backside of the stage with a gap interposed therebetween and cooled to an extremely low temperature, a gas supply mechanism configured to supply to the gap a cooling gas for transferring a cold heat of the frozen heat transfer body to the stage, a rotation mechanism configured to rotate the stage, and a processing mechanism configured to process the substrate; preheating the stage such that a temperature of the stage reaches a steady cooling temperature within a fixed range; and after preheating, continuously processing a plurality of substrates by the processing mechanism while rotating the stage that has reached the steady cooling temperature in a state where a substrate having a specific temperature higher than or equal to room temperature is placed on the stage.

公开(公告)号：US20150370204A1

公开(公告)日：2015-12-24

申请号：US14740805

申请日：2015-06-16

Applicant: Tokyo Electron Limited

Inventor： Hiroyuki YOKOHARA ,  Shinji ORIMOTO ,  Hiroshi SONE ,  Naoyuki SUZUKI

IPC: H01L27/146

CPC classification number: G03G15/2064 ,  C23C14/3407 ,  H01J37/3435

Abstract: A fixing unit fixes a plate-shaped member to a fixing base member. The fixing unit includes: a pressing unit configured to press the plate-shaped member toward the fixing base member; and a plurality of positioning units, installed at the fixing base member to be in contact with side surfaces of the plate-shaped member, and configured to place the plate-shaped member with respect to the fixing base member. Each of the positioning units includes: a shaft to be installed at the fixing base member; and a slide part movable along the shaft, and the slide part includes a contact part to be in contact with one of the side surfaces of the plate-shaped member and a clearance part formed on the contact part to have a smaller width than that of the contact part.

Abstract translation: 固定单元将板状构件固定到固定基座构件。 定影单元包括：按压单元，构造成将板状构件朝向固定基底构件按压; 以及多个定位单元，安装在所述固定基座构件上以与所述板状构件的侧面接触，并且被构造成将所述板状构件相对于所述固定基座构件放置。 每个定位单元包括：安装在固定基座构件上的轴; 以及滑动部，其能够沿着所述轴移动，并且所述滑动部包括与所述板状构件的一个侧面接触的接触部和形成在所述接触部上的间隙部，其宽度小于 接触部分。

公开(公告)号：US20220189813A1

公开(公告)日：2022-06-16

申请号：US17549037

申请日：2021-12-13

Applicant: TOKYO ELECTRON LIMITED

Inventor： Katsuyoshi AIKAWA ,  Hiroshi SONE ,  Shinji ORIMOTO

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

Abstract: There is provided a mounting table. The mounting table comprises: a dielectric plate having a through-hole at an outer peripheral portion thereof and having a substrate support on which a substrate is placed; a support member; a first heat insulating member disposed between the dielectric plate and the support member; a first biasing member disposed between the first heat insulating member and the support member, and a fastening member configured to detachably fix the dielectric plate to the support member by way of penetrating through the through-hole of the dielectric plate, the first heat insulating member, and the first biasing member.

公开(公告)号：US20210280777A1

公开(公告)日：2021-09-09

申请号：US17193545

申请日：2021-03-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Manabu NAKAGAWASAI ,  Koji MAEDA ,  Shinji ORIMOTO ,  Motoi YAMAGATA

IPC: H01L43/12 ,  C23C14/54 ,  C23C14/50

Abstract: A substrate processing apparatus includes a processing chamber where a substrate support on which a substrate is placed and a target holder configured to hold a target are disposed, a freezing device disposed with a gap with respect to a bottom surface of the substrate support and having a chiller and a cold heat medium laminated on the chiller, and a rotating device configured to rotate the substrate support. The substrate processing apparatus further includes a first elevating device configured to raise and lower the substrate support, a coolant channel formed in the chiller to supply a coolant to the gap, and a cold heat transfer material disposed in the gap and being in contact with the substrate support and the cold heat medium so as to transfer heat therebetween.

公开(公告)号：US20230167542A1

公开(公告)日：2023-06-01

申请号：US17905989

申请日：2021-02-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Junichi TAKEI ,  Shinji ORIMOTO ,  Shinji FURUKAWA

IPC: C23C14/50 ,  C23C14/35

CPC classification number: C23C14/50 ,  C23C14/35 ,  H01J37/3435

Abstract: A film forming apparatus for forming a film on a moving substrate by sputtering includes a processing container, a placement base having a placement surface on which a substrate is placed, a holder configured to hold a target, an upper shield member configured to divide a space in the processing container into an upper space and a lower space, a movement mechanism configured to move the placement base in a movement direction parallel to the placement surface and to move the placement base in the vertical direction, a leg member configured to connect the placement base and the movement mechanism, and a lower shield member configured to define the movement space together with the upper shield member. The lower shield member includes a fixed shield member and a moving shield member.

公开(公告)号：US20200381272A1

公开(公告)日：2020-12-03

申请号：US16624492

申请日：2018-06-25

Applicant: Tokyo Electron Limited

Inventor： Shinji ORIMOTO ,  Manabu NAKAGAWASAI ,  Kouji MAEDA ,  Hiroshi MIKI ,  Naoyuki SUZUKI

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A placing table structure according to an embodiment includes: a fixedly disposed refrigerated heat transfer element; a rotatable outer cylinder disposed around the refrigerated heat transfer element; and a stage connected to the outer cylinder and disposed above an upper surface of the refrigerated heat transfer element with inclusion of a gap between the refrigerated heat transfer element and the stage.

公开(公告)号：US20190390325A1

公开(公告)日：2019-12-26

申请号：US16446441

申请日：2019-06-19

Applicant: Tokyo Electron Limited

Inventor： Junichi TAKEI ,  Hiroshi SONE ,  Naoyuki SUZUKI ,  Shinji ORIMOTO

IPC: C23C14/35 ,  H01J37/34 ,  H01L21/203 ,  C23C14/54

Abstract: A sputtering device includes a processing chamber where a substrate is accommodated, and a slit plate that partitions the processing chamber into a first space where a target member is disposed and a second space where the substrate is disposed. The slit plate includes an inner member having an opening that penetrates therethrough in a thickness direction of the slit plate, and an outer member disposed around the inner member. The inner member is attachable to and detachable from the outer member.