公开(公告)号：US20140345523A1

公开(公告)日：2014-11-27

申请号：US14284536

申请日：2014-05-22

Applicant: Tokyo Electron Limited

Inventor： Hitoshi KIKUCHI ,  Takeshi Kobayashi ,  Mitsuhiro Yoshida ,  Yuta Haga ,  Yuji Takabatake ,  Naohide Ito ,  Katsuaki Sugawara ,  Masaaki Chiba ,  Hiroyuki Sato

IPC: C23C16/52 ,  G01B11/14 ,  G01B21/16

CPC classification number: C23C16/52 ,  C23C16/45551

Abstract: A substrate ejection detection device is used for substrate processing apparatus configured to process a substrate by continuously rotating a turntable holding the substrate on a concave portion formed in a surface thereof to receive the substrate thereon. In the substrate processing device, the turntable is substantially horizontally provided in a chamber. The substrate ejection detection device includes a substrate ejection determination unit configured to determine whether the substrate is out of the concave portion by determining whether the substrate exists on the concave portion while rotating the turntable.

Abstract translation: 衬底喷射检测装置用于基板处理装置，其被配置为通过将保持基板的转台连续旋转在形成在其表面上的凹部上来处理基板，以在其上接纳基板。 在基板处理装置中，转盘基本上水平地设置在室中。 基板喷射检测装置包括基板排出确定单元，其被配置为通过在旋转转盘的同时确定基板是否存在于凹部上来确定基板是否在凹部之外。