公开(公告)号：US20180158711A1

公开(公告)日：2018-06-07

申请号：US15829096

申请日：2017-12-01

申请人： TOKYO ELECTRON LIMITED

发明人： Yasuharu SASAKI ,  Akira ISHIKAWA ,  Ryo CHIBA

IPC分类号： H01L21/683 ,  H01L21/687

CPC分类号： H01L21/68742 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/68757 ,  Y10T279/23

摘要： A plasma processing apparatus includes an electrostatic chuck and a lifter pin. The electrostatic chuck has a mounting surface on which a target object is mounted and a back surface opposite to the mounting surface, and a through hole formed through the mounting surface and the back surface. The lifter pin is at least partially formed of an insulating member and has a leading end accommodated in the through hole. The lifter pin vertically moves with respect to the mounting surface to vertically transfer the target object. A conductive material is provided at at least one of a leading end portion of the lifter pin which corresponds to the through hole and a wall surface of the through hole which faces the lifter pin.

公开(公告)号：US20210319987A1

公开(公告)日：2021-10-14

申请号：US17220085

申请日：2021-04-01

申请人： Tokyo Electron Limited

发明人： Ryo CHIBA ,  Akira NAGAYAMA ,  Yasuharu SASAKI ,  Daiki SATOH ,  Taketoshi TOMIOKA

IPC分类号： H01J37/32 ,  C23C16/455 ,  H01L21/683 ,  H01L21/67

摘要： An edge ring to be disposed to encircle a substrate is provided. The edge ring includes a bottom used to define vertical heights that are from points on the circumference of a virtual circle, to the bottom of the edge ring, the virtual circle having a radius from a first point that is placed on a central axis of the edge ring, the first point being defined as the center of the virtual circle, the radius being half of a diameter ranging from an inner diameter to an outer diameter of the edge ring, and an absolute value indicative of a difference between a maximum value and a minimum value for the vertical heights being set to be less than or equal to a preset upper limit.

公开(公告)号：US20190326153A1

公开(公告)日：2019-10-24

申请号：US16460055

申请日：2019-07-02

申请人： TOKYO ELECTRON LIMITED

发明人： Yasuharu SASAKI ,  Akira ISHIKAWA ,  Ryo CHIBA

IPC分类号： H01L21/687 ,  H01L21/683

摘要： A plasma processing apparatus includes an electrostatic chuck and a lifter pin. The electrostatic chuck has a mounting surface on which a target object is mounted and a back surface opposite to the mounting surface, and a through hole formed through the mounting surface and the back surface. The lifter pin is at least partially formed of an insulating member and has a leading end accommodated in the through hole. The lifter pin vertically moves with respect to the mounting surface to vertically transfer the target object. A conductive material is provided at at least one of a leading end portion of the lifter pin which corresponds to the through hole and a wall surface of the through hole which faces the lifter pin.

公开(公告)号：US20200335384A1

公开(公告)日：2020-10-22

申请号：US16643263

申请日：2019-06-05

申请人： TOKYO ELECTRON LIMITED

发明人： Ryo CHIBA ,  Yasuharu SASAKI ,  Akira NAGAYAMA

IPC分类号： H01L21/687

摘要： The present invention provides a stage which comprises: a plate-shaped member having a mounting surface on which a workpiece to be processed is mounted and a rear surface facing the mounting surface, said plate-shaped member being provided with a through hole that penetrates through the mounting surface and the rear surface; and an embedded member disposed inside the through hole. This stage is configured such that the surface of the embedded member is provided with at least one of a concave portion and a convex portion.

公开(公告)号：US20190267277A1

公开(公告)日：2019-08-29

申请号：US16282552

申请日：2019-02-22

申请人： Tokyo Electron Limited

发明人： Yasuharu SASAKI ,  Ryo CHIBA ,  Akira NAGAYAMA

IPC分类号： H01L21/687 ,  H01J37/32

摘要： A plasma processing apparatus includes a mounting stage including a mounting surface, on which an object to be processed is mounted, a back surface provided on a side opposite to the mounting surface, a plate-like member, in which a first hole penetrating through the mounting surface and the back surface is formed, and a base having a supporting surface for supporting the plate-like member and having a second hole communicating with the first hole; and an embedment member disposed inside the first and second holes, the first embedment member being disposed inside the first hole, the second embedment member being disposed inside the second hole, wherein the first embedment member and the second embedment member are not mutually fixed, and the first embedment member has a portion having a wider width than a width of an upper end portion on a lower side than the upper end portion.