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1.
公开(公告)号:US10003018B1
公开(公告)日:2018-06-19
申请号:US15589613
申请日:2017-05-08
发明人: Ian Colgan , Ioan Domsa , George Eyres , Saito Makoto , Noel O'Shaughnessy , Toru Ishii , David Hurley
CPC分类号: H01L43/12 , C21D1/42 , C21D1/54 , C21D9/0018 , H01L27/222 , Y02P10/253
摘要: Embodiments are described for annealing systems and related methods to process microelectronic workpieces using vertical multi-batch perpendicular magnetic annealing systems that allow for a side-by-side configuration of multiple annealing systems to satisfy reduced footprint requirements.