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公开(公告)号：US20140318711A1
公开(公告)日：2014-10-30
申请号：US14250061
申请日：2014-04-10
Applicant: Tokyo Electron Limited
Inventor： Norio Wada , Goro Furutani , Satoshi Ookawa
IPC: H01L21/67
CPC classification number: H01L21/67092 , B30B13/00 , B30B15/064 , B30B15/34 , B32B37/06 , B32B37/08 , B32B37/1009
Abstract: A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a first cooling mechanism, a second cooling mechanism, a third heating mechanism and a fourth heating mechanism. The first holding unit has a first heating mechanism and holds a first substrate. The second holding unit has a second heating mechanism and holds a second substrate. The pressing mechanism contacts and presses the first substrate and the second substrate. The first cooling mechanism cools the first substrate through the first holding unit. The second cooling mechanism cools the second substrate through the second holding unit. The third heating mechanism heats the first cooling mechanism. The fourth heating mechanism heats the second cooling mechanism.
Abstract translation: 根据本公开的示例性实施例的接合装置包括第一保持单元，第二保持单元，第一冷却机构，第二冷却机构，第三加热机构和第四加热机构。 第一保持单元具有第一加热机构并保持第一基板。 第二保持单元具有第二加热机构并保持第二基板。 按压机构接触并按压第一基板和第二基板。 第一冷却机构通过第一保持单元冷却第一基板。 第二冷却机构通过第二保持单元冷却第二基板。 第三加热机构加热第一冷却机构。 第四加热机构加热第二冷却机构。
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公开(公告)号：US20140318680A1
公开(公告)日：2014-10-30
申请号：US14249842
申请日：2014-04-10
Applicant: TOKYO ELECTRON LIMITED
Inventor： Norio Wada , Goro Furutani , Satoshi Ookawa
CPC classification number: B32B38/1858 , B32B37/10 , B32B38/004 , B32B2457/14 , H01L21/67092 , Y10T156/10 , Y10T156/1744
Abstract: A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a pressing mechanism and a holding mechanism. The first holding unit is provided with a first heating mechanism and holds a first substrate. The second holding unit disposed facing the first holding unit and provided with a second heating mechanism, holds a second substrate. The pressing mechanism relatively moves the first holding unit and the second holding unit in order to contact and press the first substrate and the second substrate. The holding mechanism elastically holds an outer periphery of the first holding unit and the second holding unit.
Abstract translation: 根据本公开的示例性实施例的接合装置包括第一保持单元，第二保持单元，按压机构和保持机构。 第一保持单元设置有第一加热机构并保持第一基板。 第二保持单元设置为面对第一保持单元并设置有第二加热机构，保持第二基板。 按压机构相对移动第一保持单元和第二保持单元以接触并按压第一基板和第二基板。 保持机构弹性保持第一保持单元和第二保持单元的外周。
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公开(公告)号：US09486989B2
公开(公告)日：2016-11-08
申请号：US14274895
申请日：2014-05-12
Applicant: TOKYO ELECTRON LIMITED
Inventor： Satoshi Ookawa
IPC: H01L21/683 , B32B37/10 , H01L21/67 , H01L21/677 , H01L21/68 , G02F1/13 , B32B38/18
CPC classification number: B32B37/10 , B32B38/18 , B32B2309/68 , B32B2315/08 , B32B2457/14 , G02F1/1303 , H01L21/67092 , H01L21/67126 , H01L21/6719 , H01L21/67748 , H01L21/681 , H01L21/6831 , Y10T156/10
Abstract: A bonding method includes: holding a substrate to be processed by a first holding unit; holding a glass substrate by a second holding unit in a first holding state of seating the glass substrate thereon or in a second holding state of electrostatically attracting the glass substrate; depressurizing the interior of a chamber; and bringing the substrate to be processed and the glass substrate into contact with each other and pressing them. Holding a glass substrate includes: switching from the first holding state to the second holding state during at least one predetermined period of time selected from a plurality of predetermined periods of time, the plurality of predetermined periods of time including a pressure change timing in depressurizing the interior of a chamber and a pressing timing in bonding the substrate to be processed and the glass substrate.
Abstract translation: 接合方法包括：通过第一保持单元保持待处理的基板; 在第一保持状态下，通过第二保持单元将玻璃基板固定在其上或静电吸引玻璃基板的第二保持状态; 减压室内部; 使被处理基板与玻璃基板接触并进行按压。 保持玻璃基板包括：在从多个预定时间段中选择的至少一个预定时间段内从第一保持状态切换到第二保持状态，多个预定时间段包括减压的压力变化定时 腔室内部和接合待处理衬底和玻璃衬底的按压定时。
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Patent Agency Ranking
公开(公告)号：US09165803B2
公开(公告)日：2015-10-20
申请号：US14254966
申请日：2014-04-17
Applicant: Tokyo Electron Limited
Inventor： Goro Furutani , Norio Wada , Satoshi Ookawa
CPC classification number: H01L21/67092 , H01L21/67103 , H01L21/67109 , H01L21/67248 , Y10T156/1744
Abstract: A bonding method according to an exemplary embodiment of the present disclosure includes a first holding processing, a second holding processing, a temporary bonding processing, a temperature increasing processing and a main bonding processing. In the first holding processing, a target substrate is held. In the second holding processing, a glass substrate held by electrostatic adsorption. In the temporary bonding processing, the target substrate and the glass substrate are temporarily bonded with a pressing force lower than a predetermined pressing force at a temperature lower than a predetermined temperature. In the temperature increasing processing, while releasing the electrostatic adsorption of the glass substrate at the same time as or after the temporary bonding, the temperature is increased to the predetermined temperature. In the main bonding processing, a main bonding of the target substrate and the glass substrate is performed with the predetermined pressing force.
Abstract translation: 根据本公开的示例性实施例的接合方法包括第一保持处理，第二保持处理，临时接合处理，升温处理和主接合处理。 在第一保持处理中，保持目标基板。 在第二保持处理中，通过静电吸附保持的玻璃基板。 在临时接合处理中，目标基板和玻璃基板在比预定温度低的温度下以比预定的按压力低的按压力暂时接合。 在升温处理中，在暂时接合的同时或之后释放玻璃基板的静电吸附的同时，将温度升高至规定温度。 在主接合处理中，以预定的按压力进行目标基板和玻璃基板的主要接合。
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公开(公告)号：US09469093B2
公开(公告)日：2016-10-18
申请号：US14249842
申请日：2014-04-10
Applicant: Tokyo Electron Limited
Inventor： Norio Wada , Goro Furutani , Satoshi Ookawa
CPC classification number: B32B38/1858 , B32B37/10 , B32B38/004 , B32B2457/14 , H01L21/67092 , Y10T156/10 , Y10T156/1744
Abstract: A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a pressing mechanism and a holding mechanism. The first holding unit is provided with a first heating mechanism and holds a first substrate. The second holding unit disposed facing the first holding unit and provided with a second heating mechanism, holds a second substrate. The pressing mechanism relatively moves the first holding unit and the second holding unit in order to contact and press the first substrate and the second substrate. The holding mechanism elastically holds an outer periphery of the first holding unit and the second holding unit.
Abstract translation: 根据本公开的示例性实施例的接合装置包括第一保持单元，第二保持单元，按压机构和保持机构。 第一保持单元设置有第一加热机构并保持第一基板。 第二保持单元设置为面对第一保持单元并设置有第二加热机构，保持第二基板。 按压机构相对移动第一保持单元和第二保持单元以接触并按压第一基板和第二基板。 保持机构弹性保持第一保持单元和第二保持单元的外周。
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公开(公告)号：US20140329341A1
公开(公告)日：2014-11-06
申请号：US14254966
申请日：2014-04-17
Applicant: Tokyo Electron Limited
Inventor： Goro Furutani , Norio Wada , Satoshi Ookawa
CPC classification number: H01L21/67092 , H01L21/67103 , H01L21/67109 , H01L21/67248 , Y10T156/1744
Abstract: A bonding method according to an exemplary embodiment of the present disclosure includes a first holding processing, a second holding processing, a temporary bonding processing, a temperature increasing processing and a main bonding processing. In the first holding processing, a target substrate is held. In the second holding processing, a glass substrate held by electrostatic adsorption. In the temporary bonding processing, the target substrate and the glass substrate are temporarily bonded with a pressing force lower than a predetermined pressing force at a temperature lower than a predetermined temperature. In the temperature increasing processing, while releasing the electrostatic adsorption of the glass substrate at the same time as or after the temporary bonding, the temperature is increased to the predetermined temperature. In the main bonding processing, a main bonding of the target substrate and the glass substrate is performed with the predetermined pressing force.
Abstract translation: 根据本公开的示例性实施例的接合方法包括第一保持处理，第二保持处理，临时接合处理，升温处理和主接合处理。 在第一保持处理中，保持目标基板。 在第二保持处理中，通过静电吸附保持的玻璃基板。 在临时接合处理中，目标基板和玻璃基板在比预定温度低的温度下以比预定的按压力低的按压力暂时接合。 在升温处理中，在暂时接合的同时或之后释放玻璃基板的静电吸附的同时，将温度升高至规定温度。 在主接合处理中，以预定的按压力进行目标基板和玻璃基板的主要接合。
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公开(公告)号：US12255063B2
公开(公告)日：2025-03-18
申请号：US17259244
申请日：2019-07-18
Applicant: Tokyo Electron Limited
Inventor： Hayato Tanoue , Takashi Uno , Satoshi Ookawa , Suguru Enokida
IPC: H01L21/762 , H01L21/02 , H01L21/67 , H01L21/687
Abstract: A substrate processing system configured to process a substrate includes a first modifying apparatus configured to form, in a combined substrate in which a front surface of a first substrate and a front surface of a second substrate are bonded to each other, an internal modification layer elongated within the first substrate in a plane direction from a center of the first substrate toward at least an edge portion of the first substrate as a removing target; a second modifying apparatus configured to form, within the first substrate, an edge modification layer elongated in a thickness direction of the first substrate along a boundary between the edge portion and a central portion of the first substrate; and a separating apparatus configured to separate a portion of the first substrate at a rear surface side, starting from the internal modification layer.
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公开(公告)号：US09005385B2
公开(公告)日：2015-04-14
申请号：US14250061
申请日：2014-04-10
Applicant: Tokyo Electron Limited
Inventor： Norio Wada , Goro Furutani , Satoshi Ookawa
CPC classification number: H01L21/67092 , B30B13/00 , B30B15/064 , B30B15/34 , B32B37/06 , B32B37/08 , B32B37/1009
Abstract: A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a first cooling mechanism, a second cooling mechanism, a third heating mechanism and a fourth heating mechanism. The first holding unit has a first heating mechanism and holds a first substrate. The second holding unit has a second heating mechanism and holds a second substrate. The pressing mechanism contacts and presses the first substrate and the second substrate. The first cooling mechanism cools the first substrate through the first holding unit. The second cooling mechanism cools the second substrate through the second holding unit. The third heating mechanism heats the first cooling mechanism. The fourth heating mechanism heats the second cooling mechanism.
Abstract translation: 根据本公开的示例性实施例的接合装置包括第一保持单元，第二保持单元，第一冷却机构，第二冷却机构，第三加热机构和第四加热机构。 第一保持单元具有第一加热机构并保持第一基板。 第二保持单元具有第二加热机构并保持第二基板。 按压机构接触并按压第一基板和第二基板。 第一冷却机构通过第一保持单元冷却第一基板。 第二冷却机构通过第二保持单元冷却第二基板。 第三加热机构加热第一冷却机构。 第四加热机构加热第二冷却机构。
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