公开(公告)号：US09824861B2

公开(公告)日：2017-11-21

申请号：US14970714

申请日：2015-12-16

Applicant: Tokyo Electron Limited

Inventor： Masahiro Numakura ,  Yoshikazu Ishikawa ,  Toshihiko Hamada ,  Junya Sato ,  Toshiyuki Kobayashi ,  Shouichi Otake

IPC: G01R31/26 ,  H01L21/66 ,  H01J37/32 ,  H01L21/677 ,  H01L21/67

CPC classification number: H01J37/32009 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67276 ,  H01L21/67742

Abstract: A substrate processing apparatus includes at least one process module configured to process first substrates. A position detector is configured to detect first positions of the first substrates. A control unit is configured to control the position detector so as to measure a second position of a second substrate selected from the first substrates to be processed in a same process module depending on a measurement interval set for the same process module.