公开(公告)号：US08565911B2

公开(公告)日：2013-10-22

申请号：US13804452

申请日：2013-03-14

Applicant: Tokyo Electron Limited

Inventor： Yo Abe ,  Kiichi Takahashi ,  Junya Sato ,  Yoshinobu Motodate

IPC: G06F7/00

CPC classification number: H01L21/67098 ,  H01L21/67109 ,  H01L21/67766 ,  H01L21/67781

Abstract: When a substrate is transferred by a holding arm to a multiple tier wafer boat, contact between the holding arm and the substrate is prevented. When the wafer boat is not subjected to a thermal effect, a normal height position of a ring member is obtained by relatively elevating and lowering a transfer base member with respect to the wafer boat. Before a wafer, which is not yet thermally processed, is transferred to the wafer boat, a height position of the corresponding ring member is obtained. By comparing a difference between the normal height position of the ring member and the height position of the ring member before the wafer is transported, with a threshold value, whether to transfer the wafer by the wafer transfer mechanism to the wafer boat can be judged.

Abstract translation: 当基板被保持臂转移到多层晶片舟皿时，防止了保持臂和基板之间的接触。 当晶片舟不受热效应时，通过相对于晶片舟相对地升高和降低转印基底构件，获得环形构件的正常高度位置。 在尚未热处理的晶片被转移到晶片舟皿之前，获得相应的环件的高度位置。 通过比较环状构件的正常高度位置与晶片运送前环状构件的高度位置之间的差异，可以判断是否通过晶片传送机构将晶片转移到晶片舟皿上。

公开(公告)号：US11598007B2

公开(公告)日：2023-03-07

申请号：US16549365

申请日：2019-08-23

Applicant: Tokyo Electron Limited

Inventor： Nao Akashi ,  Yuta Haga ,  Hiroyuki Sato ,  Motoi Okada ,  Kei Sano ,  Junya Sato ,  Takayuki Kita ,  Atsushi Suzuki ,  Kiwamu Tsukino ,  Takuro Tsutsui

IPC: G06K9/00 ,  C23C16/52 ,  C23C16/458 ,  C23C16/46 ,  G06T7/73 ,  G06N3/08 ,  G06T7/00 ,  H04N5/247

Abstract: According to an aspect of the present disclosure, a substrate state determining apparatus includes: an image capturing unit that captures an image of a substrate placed on a stage; a learning unit that executes a machine learning using training data in which information indicating a state of the substrate is attached to the image of the substrate, so as to generate a substrate state determination model in which the image of the substrate is taken as an input and a value related to the state of the substrate corresponding to the image of the substrate is taken as an output; and a determination unit that determines the state of the substrate corresponding to the image of the substrate captured by the image capturing unit, using the substrate state determination model generated by the learning unit.

公开(公告)号：US20200080202A1

公开(公告)日：2020-03-12

申请号：US16549365

申请日：2019-08-23

Applicant: Tokyo Electron Limited

Inventor： Nao Akashi ,  Yuta Haga ,  Hiroyuki Sato ,  Motoi Okada ,  Kei Sano ,  Junya Sato ,  Takayuki Kita ,  Atsushi Suzuki ,  Kiwamu Tsukino ,  Takuro Tsutsui

IPC: C23C16/52 ,  C23C16/458 ,  C23C16/46 ,  G06T7/73 ,  G06T7/00 ,  G06N3/08

Abstract: According to an aspect of the present disclosure, a substrate state determining apparatus includes: an image capturing unit that captures an image of a substrate placed on a stage; a learning unit that executes a machine learning using training data in which information indicating a state of the substrate is attached to the image of the substrate, so as to generate a substrate state determination model in which the image of the substrate is taken as an input and a value related to the state of the substrate corresponding to the image of the substrate is taken as an output; and a determination unit that determines the state of the substrate corresponding to the image of the substrate captured by the image capturing unit, using the substrate state determination model generated by the learning unit.

公开(公告)号：US09824861B2

公开(公告)日：2017-11-21

申请号：US14970714

申请日：2015-12-16

Applicant: Tokyo Electron Limited

Inventor： Masahiro Numakura ,  Yoshikazu Ishikawa ,  Toshihiko Hamada ,  Junya Sato ,  Toshiyuki Kobayashi ,  Shouichi Otake

IPC: G01R31/26 ,  H01L21/66 ,  H01J37/32 ,  H01L21/677 ,  H01L21/67

CPC classification number: H01J37/32009 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67276 ,  H01L21/67742

Abstract: A substrate processing apparatus includes at least one process module configured to process first substrates. A position detector is configured to detect first positions of the first substrates. A control unit is configured to control the position detector so as to measure a second position of a second substrate selected from the first substrates to be processed in a same process module depending on a measurement interval set for the same process module.