公开(公告)号：US10518986B2

公开(公告)日：2019-12-31

申请号：US16404033

申请日：2019-05-06

Applicant: Tokyo Electron Limited

Inventor： Masahiro Kobayashi ,  Tamotsu Hatakeyama ,  Harunari Hasegawa ,  Michihiro Takahashi ,  Daisuke Yamanaka

IPC: B65G49/05 ,  B01J19/24

Abstract: A method for conveying a reaction tube unit including a vertical reaction tube and a gas supply pipe provided at a distance from an inner wall of the vertical reaction tube along a longitudinal direction thereof, the method includes: arranging a buffer inside the reaction tube between the inner wall and the gas supply pipe to alleviate a collision; placing the reaction tube unit attached with the buffer on a carriage via a vibration isolator; and conveying the reaction tube unit by moving the carriage.

公开(公告)号：US11114318B2

公开(公告)日：2021-09-07

申请号：US16394140

申请日：2019-04-25

Applicant: Tokyo Electron Limited

Inventor： Hisashi Inoue ,  Masahiro Kobayashi ,  Michihiro Takahashi ,  Tamotsu Hatakeyama ,  Harunari Hasegawa ,  Hiroshi Kikuchi ,  Yoshihisa Kumagai

IPC: B23P19/10 ,  H01L21/67 ,  H01L21/673 ,  B23P19/04

Abstract: Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed inside the reaction tube through the opening while the reaction tube is held by the lift; gas supply source configured to supply a gas into the reaction tube through the gas supply pipe while the reaction tube is held by the lift; and an exhaust mechanism including a pump configured to exhaust an inside of the reaction tube through the opening, thereby performing a leakage test of the reaction tube while the reaction tube is held by the lift.

公开(公告)号：US20190333789A1

公开(公告)日：2019-10-31

申请号：US16394140

申请日：2019-04-25

Applicant: Tokyo Electron Limited

Inventor： Hisashi Inoue ,  Masahiro Kobayashi ,  Michihiro Takahashi ,  Tamotsu Hatakeyama ,  Harunari Hasegawa ,  Hiroshi Kikuchi ,  Yoshihisa Kumagai

IPC: H01L21/67 ,  H01L21/673

Abstract: Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed inside the reaction tube through the opening while the reaction tube is held by the lift; gas supply source configured to supply a gas into the reaction tube through the gas supply pipe while the reaction tube is held by the lift; and an exhaust mechanism including a pump configured to exhaust an inside of the reaction tube through the opening, thereby performing a leakage test of the reaction tube while the reaction tube is held by the lift.