公开(公告)号：US20160273836A1

公开(公告)日：2016-09-22

申请号：US15070123

申请日：2016-03-15

Applicant: Tokyo Electron Limited

Inventor： Mitsuru Obara ,  Hisashi Inoue ,  Keishi Shionaga ,  Masahiro Kobayashi ,  Norio Baba ,  Hiroshi Kikuchi

IPC: F27B5/04 ,  F16B2/02 ,  H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC classification number: F27B5/04 ,  F16B2/02 ,  F27B17/0016 ,  F27B17/0025 ,  F27D3/0084 ,  F27D2003/0012 ,  F27D2003/0046 ,  H01L21/67109 ,  H01L21/67379 ,  H01L21/67389 ,  H01L21/6773 ,  H01L21/67742 ,  H01L21/67772 ,  H01L21/67775

Abstract: The clamp apparatus of the present disclosure includes a clamp member configured to contact a substrate accommodating container from an upper side and fix the substrate accommodating container to a predetermined position when a cover provided on a front surface of the substrate accommodating container is opened/closed, a driving mechanism configured to drive the clamp member; a casing configured to cover the driving mechanism, a suction port configured to communicate with the casing, an exhaust chamber provided near the casing, and a fan provided inside the exhaust chamber.

Abstract translation: 本公开的夹紧装置包括夹持构件，其构造成当设置在基板容纳容器的前表面上的盖被打开/关闭时，从上侧接触基板容纳容器并将基板容纳容器固定到预定位置， 构造成驱动所述夹紧构件的驱动机构; 被构造成覆盖驱动机构的壳体，构造成与壳体连通的吸入口，设置在壳体附近的排气室和设置在排气室内的风扇。

公开(公告)号：US11815407B2

公开(公告)日：2023-11-14

申请号：US17007009

申请日：2020-08-31

Applicant: Tokyo Electron Limited ,  Furuya Metal Co., Ltd.

Inventor： Hisashi Inoue ,  Masahiro Kobayashi ,  Yasuaki Kikuchi ,  Tatsuya Yamaguchi ,  Koji Yoshii ,  Kensuke Morita ,  Jun Itabashi

IPC: G01K7/02 ,  G01K1/08 ,  H10N19/00

CPC classification number: G01K7/02 ,  G01K1/08 ,  H10N19/00

Abstract: A thermocouple structure according to one aspect of the present disclosure includes a first element wire, second element wires formed of a material different from the first element wire, an insulating covering member covering at least one of the first element wire and the second element wires, and a protective tube accommodating the first element wire and the second element wire. Each of the second element wires is bonded to a different position on the first element wire.

公开(公告)号：US09857124B2

公开(公告)日：2018-01-02

申请号：US15070123

申请日：2016-03-15

Applicant: Tokyo Electron Limited

Inventor： Mitsuru Obara ,  Hisashi Inoue ,  Keishi Shionaga ,  Masahiro Kobayashi ,  Norio Baba ,  Hiroshi Kikuchi

IPC: F26B5/04 ,  F27B5/04 ,  H01L21/673 ,  H01L21/677 ,  H01L21/67 ,  F16B2/02 ,  F27B17/00 ,  F27D3/00

CPC classification number: F27B5/04 ,  F16B2/02 ,  F27B17/0016 ,  F27B17/0025 ,  F27D3/0084 ,  F27D2003/0012 ,  F27D2003/0046 ,  H01L21/67109 ,  H01L21/67379 ,  H01L21/67389 ,  H01L21/6773 ,  H01L21/67742 ,  H01L21/67772 ,  H01L21/67775

Abstract: The clamp apparatus of the present disclosure includes a clamp member configured to contact a substrate accommodating container from an upper side and fix the substrate accommodating container to a predetermined position when a cover provided on a front surface of the substrate accommodating container is opened/closed, a driving mechanism configured to drive the clamp member; a casing configured to cover the driving mechanism, a suction port configured to communicate with the casing, an exhaust chamber provided near the casing, and a fan provided inside the exhaust chamber.

公开(公告)号：US09064916B2

公开(公告)日：2015-06-23

申请号：US14250131

申请日：2014-04-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hisashi Inoue ,  Shunichi Matsumoto ,  Yasushi Takeuchi

IPC: H01L21/673 ,  C21D9/00 ,  C23C16/56 ,  H01L21/67

CPC classification number: H01L21/67309 ,  C21D9/0068 ,  C23C16/56 ,  H01L21/67109

Abstract: A substrate holder has two holder constituting bodies, each having a plurality of columns arranged on an imaginary circle, and substrate holding sections that hold circumferential portions of respective substrates. The holder constituting bodies hold the substrates so that either their front surfaces or their back surfaces face upward with a substrate having an upward facing front and a substrate having an upward facing rear being alternately arranged in a vertical direction. At least one of the holder constituting bodies moves in the vertical direction to change the positions of the holder constituting bodies relative to each other. A distance between a first pair of vertically adjacent substrates with their respective front surfaces facing each other is set to ensure treatment uniformity, and to be larger than a distance between a second pair of vertically adjacent substrates with their respective back surfaces facing each other.

Abstract translation: 衬底保持器具有两个保持器构成体，每个保持器构造体具有布置在假想圆上的多个列，以及保持各个衬底周向部分的衬底保持部。 保持器构成体保持基板，使得它们的前表面或其背面朝向上方具有面向上的基板和具有面向上的后部的基板沿垂直方向交替布置。 保持构造体中的至少一个沿垂直方向移动，以改变保持器构成体相对于彼此的位置。 设置第一对垂直相邻的基板与它们各自的前表面彼此面对的距离，以确保处理均匀性，并且大于第二对垂直相邻的基板之间的距离，并且其相应的后表面彼此面对。

公开(公告)号：US11114318B2

公开(公告)日：2021-09-07

申请号：US16394140

申请日：2019-04-25

Applicant: Tokyo Electron Limited

Inventor： Hisashi Inoue ,  Masahiro Kobayashi ,  Michihiro Takahashi ,  Tamotsu Hatakeyama ,  Harunari Hasegawa ,  Hiroshi Kikuchi ,  Yoshihisa Kumagai

IPC: B23P19/10 ,  H01L21/67 ,  H01L21/673 ,  B23P19/04

Abstract: Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed inside the reaction tube through the opening while the reaction tube is held by the lift; gas supply source configured to supply a gas into the reaction tube through the gas supply pipe while the reaction tube is held by the lift; and an exhaust mechanism including a pump configured to exhaust an inside of the reaction tube through the opening, thereby performing a leakage test of the reaction tube while the reaction tube is held by the lift.

公开(公告)号：US20190333789A1

公开(公告)日：2019-10-31

申请号：US16394140

申请日：2019-04-25

Applicant: Tokyo Electron Limited

Inventor： Hisashi Inoue ,  Masahiro Kobayashi ,  Michihiro Takahashi ,  Tamotsu Hatakeyama ,  Harunari Hasegawa ,  Hiroshi Kikuchi ,  Yoshihisa Kumagai

IPC: H01L21/67 ,  H01L21/673

Abstract: Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed inside the reaction tube through the opening while the reaction tube is held by the lift; gas supply source configured to supply a gas into the reaction tube through the gas supply pipe while the reaction tube is held by the lift; and an exhaust mechanism including a pump configured to exhaust an inside of the reaction tube through the opening, thereby performing a leakage test of the reaction tube while the reaction tube is held by the lift.