公开(公告)号：US20130342952A1

公开(公告)日：2013-12-26

申请号：US13914675

申请日：2013-06-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tsutomu NAGAI

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/67126 ,  H01L21/6831

Abstract: A substrate processing apparatus includes a processing chamber and a substrate mounting table. The processing chamber defines a processing space. The substrate mounting table includes a base and an electrostatic chuck, and is disposed in the processing space. The base has a coolant path formed therein. The electrostatic chuck is provided on the upper surface of the base through an adhesive layer formed by curing a liquid adhesive, and has an electrode therein. Here, a first adhesive region is provided on the upper surface of the base, and is adhered to the electrostatic chuck through the adhesive layer. The first adhesive region has a center portion recessed compared with the end portion of the first adhesive region.

Abstract translation: 基板处理装置包括处理室和基板安装台。 处理室限定处理空间。 基板安装台包括基座和静电卡盘，并设置在处理空间中。 底座具有形成在其中的冷却剂通路。 静电卡盘通过固化液体粘合剂而形成的粘合剂层设置在基体的上表面上，并且在其中具有电极。 这里，第一粘合区域设置在基座的上表面上，并且通过粘合剂层粘附到静电卡盘。 第一粘合剂区域具有与第一粘合剂区域的端部相比凹陷的中心部分。

公开(公告)号：US20170140954A1

公开(公告)日：2017-05-18

申请号：US15308686

申请日：2015-06-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Dai KITAGAWA ,  Katsuyuki KOIZUMI ,  Tsutomu NAGAI ,  Daisuke HAYASHI ,  Satoru TERUUCHI

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/683

Abstract: A placing table on an embodiment includes a supporting member and a base. The supporting member includes a placing region provided with a heater, and an outer peripheral region surrounding the placing region. The base includes a first region supporting the placing region thereon, and a second region surrounding the first region. In the second region, through holes are formed. Wirings electrically connected to the heater passes through the through holes of the second region.

公开(公告)号：US20230268216A1

公开(公告)日：2023-08-24

申请号：US18104266

申请日：2023-01-31

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shinya ISHIKAWA ,  Daiki HARIU ,  Takahiko SATO ,  Tsutomu NAGAI ,  Takafumi TSUDA ,  Keigo TOYODA

IPC: H01L21/683 ,  H01L21/67 ,  H01J37/32

CPC classification number: H01L21/6833 ,  H01L21/67069 ,  H01J37/32724 ,  H01J2237/3341

Abstract: A substrate support is arranged in a processing container. The substrate support includes an electrostatic chuck provided with a first support surface for supporting a substrate, provided with a first electrode and a second electrode which are arranged in the electrostatic chuck sequentially from the first support surface, and made of a dielectric material, and a base configured to support the electrostatic chuck. The second electrode is arranged at a position having a distance to the first support surface that is equal to or less than a distance to the base. A voltage for attracting the substrate is applied to the first electrode and bias power is supplied to the second electrode.

公开(公告)号：US20200266081A1

公开(公告)日：2020-08-20

申请号：US16866232

申请日：2020-05-04

Applicant: Tokyo Electron Limited

Inventor： Dai KITAGAWA ,  Katsuyuki KOIZUMI ,  Tsutomu NAGAI ,  Daisuke HAYASHI ,  Satoru TERUUCHI

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/683

Abstract: A placing table on an embodiment includes a supporting member and a base. The supporting member includes a placing region provided with a heater, and an outer peripheral region surrounding the placing region. The base includes a first region supporting the placing region thereon, and a second region surrounding the first region. In the second region, through holes are formed. Wirings electrically connected to the heater passes through the through holes of the second region.