PLASMA PROCESSING APPARATUS
    1.
    发明申请

    公开(公告)号:US20180374672A1

    公开(公告)日:2018-12-27

    申请号:US16012959

    申请日:2018-06-20

    Abstract: A plasma processing apparatus includes an external circuit electrically connected through a line to an electrical component in a processing chamber and a filter provided on the line to attenuate or block noise introduced into the line from the electrical component toward the external circuit. The filter includes a coil having constant diameter and coil length; a tubular outer conductor accommodating the coil and forming a distributed constant line in which parallel resonance occurs at multiple frequencies in combination with the coil; and a movable member for changing each winding gap of the coil and provided in an effective section where a specific one or a plurality of parallel resonance frequencies is shifted to a higher frequency side or a lower frequency side in frequency-impedance characteristics of the filter by changing the winding gap of the coil in the effective section in a longitudinal direction of the coil.

    ELECTROSTATIC CHUCK, PLACING TABLE AND PLASMA PROCESSING APPARATUS
    2.
    发明申请
    ELECTROSTATIC CHUCK, PLACING TABLE AND PLASMA PROCESSING APPARATUS 审中-公开
    静电卡盘,放置台和等离子体加工设备

    公开(公告)号:US20150311106A1

    公开(公告)日:2015-10-29

    申请号:US14690802

    申请日:2015-04-20

    CPC classification number: H01J37/32715 H01J37/32697 H01L21/6831

    Abstract: Disclosed is an electrostatic chuck including a circular placing region configured to place a processing target object thereon. The placing region includes a bottom surface and a plurality of protrusions configured to protrude from the bottom surface. Further, the plurality of protrusions is formed at a plurality of positions set at a regular interval on each of a plurality of circles set concentrically and at a regular interval around a center of the placing region. Furthermore, among the plurality of positions, a plurality of positions set on each of any two adjacent circles is set not to be positioned on the same straight line extending from the center.

    Abstract translation: 公开了一种静电卡盘,其包括被配置为在其上放置加工对象物体的圆形放置区域。 放置区域包括底表面和被配置为从底表面突出的多个突起。 此外,多个突起形成在围绕放置区域的中心的同心且以规则间隔设置的多个圆圈中的每一个上以规则间隔设置的多个位置。 此外,在多个位置中,设置在任何两个相邻圆圈中的每一个上的多个位置被设置为不位于从中心延伸的同一直线上。

    SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS

    公开(公告)号:US20210305025A1

    公开(公告)日:2021-09-30

    申请号:US17190178

    申请日:2021-03-02

    Abstract: The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.

    HEATER POWER FEEDING MECHANISM
    5.
    发明申请

    公开(公告)号:US20170140958A1

    公开(公告)日:2017-05-18

    申请号:US15300349

    申请日:2015-05-08

    Abstract: A heater power feeding mechanism for independently controlling temperatures of zones of a stage on which a substrate is placed. The respective zones of the stage include heaters. The heater power feeding mechanism includes a plurality of heater terminals configured to be connected to the heaters, a plurality of heater wires connected to the heater terminals, and an offset structure that offsets the heater wires from each other. The heater terminals are disposed on the periphery of a holding plate for holding the stage.

    SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS

    公开(公告)号:US20250132136A1

    公开(公告)日:2025-04-24

    申请号:US18999446

    申请日:2024-12-23

    Abstract: The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.

    STAGE AND PLASMA PROCESSING APPARATUS

    公开(公告)号:US20210104386A1

    公开(公告)日:2021-04-08

    申请号:US17127607

    申请日:2020-12-18

    Abstract: A stage according to an exemplary embodiment has an electrostatic chuck. The electrostatic chuck has a base and a chuck main body. The chuck main body is provided on the base and configured to hold a substrate with electrostatic attractive force. The chuck main body has a plurality of first heaters and a plurality of second heaters. The number of second heaters is larger than the number of first heaters. The first heater controller drives the plurality of first heaters by an alternating current output or a direct current output from a first power source. The second heater controller drives the plurality of second heaters by an alternating current output or a direct current output from a second power source which has electric power lower than electric power of the output from the first power source.

    STAGE AND PLASMA PROCESSING APPARATUS
    9.
    发明申请

    公开(公告)号:US20180350570A1

    公开(公告)日:2018-12-06

    申请号:US15989518

    申请日:2018-05-25

    Abstract: A stage according to an exemplary embodiment has an electrostatic chuck. The electrostatic chuck has a base and a chuck main body. The chuck main body is provided on the base and configured to hold a substrate with electrostatic attractive force. The chuck main body has a plurality of first heaters and a plurality of second heaters. The number of second heaters is larger than the number of first heaters. The first heater controller drives the plurality of first heaters by an alternating current output or a direct current output from a first power source. The second heater controller drives the plurality of second heaters by an alternating current output or a direct current output from a second power source which has electric power lower than electric power of the output from the first power source.

    MOUNTING TABLE AND PLASMA PROCESSING APPARATUS

    公开(公告)号:US20170092472A1

    公开(公告)日:2017-03-30

    申请号:US15270342

    申请日:2016-09-20

    Abstract: A mounting table includes a cooling table, a power feed body, an electrostatic chuck, a first elastic member and a clamping member. The power feed body is connected to the cooling table to transmit a high frequency power. A base of the electrostatic chuck has conductivity. An attraction unit has an attraction electrode and a heater therein, and is fastened to the base by metal bonding. The first elastic member is provided between the cooling table and the base to allow the electrostatic chuck to be spaced apart from the cooling table. The first elastic member forms, along with the cooling table and the base, a heat transfer space into which a heat transfer gas is supplied. The clamping member is contacted with the cooling table and the base, and allows the base and the first elastic member to be interposed between the cooling table and the clamping member.

Patent Agency Ranking