公开(公告)号：US20140238972A1

公开(公告)日：2014-08-28

申请号：US14270524

申请日：2014-05-06

Applicant: Tokyo Electron Limited

Inventor： Koji YOSHII ,  Tatsuya YAMAGUCHI ,  Wenling WANG ,  Takanori SAITO

IPC: H01L21/67

CPC classification number: H01L21/67115 ,  F27B17/0025 ,  F27D19/00 ,  F27D21/0014 ,  H01L21/67109 ,  H01L21/67248

Abstract: A control unit can select a large-number control zone model in which the number of control zones, which are independently controlled, is large, and a small-number control zone model in which the number of control zones, which are independently controlled, is small. When a temperature is increased or decreased, the control unit can select the small-number control zone model so as to control, based on signals from temperature sensors of the respective control zones C1 . . . C5 whose number is small, heaters located on the respective control zones C1 . . . C5. When a temperature is stabilized, the control unit can select the large-number control zone model so as to control, based on signals signals from the temperature sensors of the respective control zones C1 . . . C10 whose number is large, the heaters located on the respective control zones C1 . . . C10.

Abstract translation: 控制单元可以选择其中独立控制的控制区域的数量大的大量控制区域模型，以及独立控制的控制区域的数量为少数的控制区域模型 小。 当温度升高或降低时，控制单元可以根据来自相应控制区C1的温度传感器的信号，选择小数控制区模型，以便控制。 。 。 数量少的加热器位于相应控制区C1上。 。 。 C5。 当温度稳定时，控制单元可以根据来自各个控制区C1的温度传感器的信号信号来选择大数量的控制区域模型。 。 。 C10，其数量大，位于各个控制区C1上的加热器。 。 。 C10。

公开(公告)号：US20130256293A1

公开(公告)日：2013-10-03

申请号：US13852396

申请日：2013-03-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yuichi TAKENAGA ,  Wenling WANG

IPC: H01L21/67

CPC classification number: H01L21/67098 ,  H01L21/67109 ,  H01L21/67248

Abstract: In accordance with some embodiments of the present disclosure, a heat treatment system, a heat treatment method, and a program are provided. The heat treatment system includes a heating unit configured to heat an inside of a processing chamber receiving a plurality of objects to be processed, a heat treatment condition storing unit configured to store a heat treatment condition, a power change model storing unit configured to store a model showing a relationship between a temperature change inside the processing chamber and a power change of the heating unit, a changed temperature receiving unit configured to receive information on a change of the temperature inside the processing chamber, a power calculation unit configured to calculate power of the heating unit required at a changed temperature, and a determining unit configured to determine whether the power of the heating unit calculated by the power calculation unit is saturated.

Abstract translation: 根据本公开的一些实施例，提供热处理系统，热处理方法和程序。 热处理系统包括：加热单元，其构造成加热接收多个待处理物体的处理室的内部;热处理条件存储单元，其被配置为存储热处理条件;电力变化模型存储单元，被配置为存储 示出处理室内的温度变化与加热单元的功率变化之间的关系的模型，被配置为接收关于处理室内的温度变化的信息的变化温度接收单元，被配置为计算处理室的功率的功率的功率计算单元 所述加热单元在变化的温度下需要，以及确定单元，其被配置为确定由所述功率计算单元计算的所述加热单元的功率是否饱和。

公开(公告)号：US20130260039A1

公开(公告)日：2013-10-03

申请号：US13852235

申请日：2013-03-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yuichi TAKENAGA ,  Wenling WANG

IPC: B05D3/02 ,  B05C9/14

CPC classification number: B05D3/0218 ,  B05C9/14 ,  H01L21/324

Abstract: According to an embodiment of the present invention, a heat treatment system is provided. The heat treatment system includes a heating unit, a heat treatment condition memory unit, a power change model memory unit, a heat treatment change model memory unit, a heat treatment result reception unit, and an optimal temperature calculation unit. In the heat treatment system, the optimal temperature calculation unit calculates the power of the heating unit at a corresponding temperature based on the model stored in the power change model memory unit and the calculated temperature, and an optimal temperature is a temperature at which a heat treatment result is closest to the targeted heat treatment result within a range in which the calculated power of the heating unit is not saturated.

Abstract translation: 根据本发明的实施例，提供一种热处理系统。 热处理系统包括加热单元，热处理条件存储单元，功率变化模型存储单元，热处理变化模型存储单元，热处理结果接收单元和最佳温度计算单元。 在热处理系统中，最佳温度计算单元基于存储在功率变化模型存储单元中的模型和计算出的温度来计算加热单元在相应温度下的功率，最佳温度是热量 在加热单元的计算功率不饱和的范围内，处理结果最接近目标热处理结果。

公开(公告)号：US20130204416A1

公开(公告)日：2013-08-08

申请号：US13742603

申请日：2013-01-16

Applicant: TOKYO ELECTRON LIMITED

Inventor： Goro TAKAHASHI ,  Takahito KASAI ,  Takanori SAITO ,  Wenling WANG ,  Koji YOSHII ,  Tatsuya YAMAGUCHI

IPC: G05B19/418

CPC classification number: G05B19/418 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67248

Abstract: The heat treatment apparatus that increases a temperature of a processing object and performs a heat treatment in a constant temperature, the heat treatment apparatus includes: a processing chamber which accommodates the processing object; a heating unit which heats the processing object accommodated in the processing chamber; a memory unit which stores two or more temperature control models that are previously created, a temperature controller which controls a temperature of the heating unit; and an apparatus controller which controls the temperature controller and the memory unit, wherein the apparatus controller selects a temperature control model among the two or more temperature control models according to desired heat treatment conditions, and wherein the temperature controller reads out the selected temperature control model from the memory unit to control the heating unit.

Abstract translation: 所述热处理装置具有：处理室，其容纳所述处理对象物;处理对象物， 加热单元，其加热容纳在处理室中的处理对象; 存储单元，其存储先前创建的两个或更多个温度控制模型;温度控制器，其控制所述加热单元的温度; 以及控制所述温度控制器和所述存储单元的装置控制器，其中所述装置控制器根据期望的热处理条件在所述两个或更多个温度控制模型中选择温度控制模型，并且其中所述温度控制器读出所选择的温度控制模型 从存储单元控制加热单元。

公开(公告)号：US20130186878A1

公开(公告)日：2013-07-25

申请号：US13742599

申请日：2013-01-16

Applicant: Tokyo Electron Limited

Inventor： Goro TAKAHASHI ,  Takanori SAITO ,  Wenling WANG ,  Koji YOSHII ,  Tatsuya YAMAGUCHI

IPC: F27D19/00 ,  F27D21/00

CPC classification number: F27D19/00 ,  F27B17/0025 ,  F27D21/0014 ,  H01L21/67109 ,  H01L21/67248

Abstract: The heat treatment apparatus includes: a processing chamber which accommodates a processing object; a heating unit which heats the processing object accommodated in the processing chamber; a temperature detecting unit which detects an internal temperature of the processing chamber; and a controller which sets a second setting temperature identical to as a temperature detected by the temperature detecting unit when the temperature detected by the temperature detecting unit falls below a predetermined first setting temperature due to an external disturbance; controls the heating unit so that a third setting temperature between the second setting temperature and the first setting temperature becomes identical to the temperature detected by the temperature detecting unit; and controls the heating unit so that the first setting temperature becomes identical to the temperature detected by the temperature detecting unit after the third setting temperature becomes identical to the temperature detected by the temperature detecting unit.

Abstract translation: 热处理装置包括：处理室，其容纳加工对象物; 加热单元，其加热容纳在处理室中的处理对象; 温度检测单元，其检测处理室的内部温度; 以及控制器，当由所述温度检测单元检测到的温度由于外部干扰而下降到预定的第一设定温度以下时，设定与所述温度检测单元检测到的温度相同的第二设定温度; 控制加热单元，使得第二设定温度和第一设定温度之间的第三设定温度与由温度检测单元检测到的温度相同; 并且控制加热单元，使得第一设定温度与第三设定温度与由温度检测单元检测到的温度相同后，由与温度检测单元检测到的温度相同。