公开(公告)号：US11969827B2

公开(公告)日：2024-04-30

申请号：US17627702

申请日：2020-07-09

Applicant: Tokyo Electron Limited

Inventor： Hayato Tanoue ,  Yohei Yamashita ,  Yohei Yamawaki ,  Hirotoshi Mori

IPC: B23K26/53 ,  B23K26/08 ,  B23K101/40

CPC classification number: B23K26/53 ,  B23K26/0823 ,  B23K26/083 ,  B23K2101/40

Abstract: A processing apparatus configured to process a processing target object includes a holder configured to hold the processing target object; a holder moving mechanism configured to move the holder in a horizontal direction; a modifying device configured to radiate laser light to an inside of the processing target object to form multiple internal modification layers in a spiral shape; a modifying device moving mechanism configured to move the modifying device in the horizontal direction; and a controller configured to control an operation of forming the internal modification layers. The controller controls operations of the holder and the modifying device such that a spiral processing movement according to the formation of the internal modification layers and an eccentricity follow-up movement of correcting an eccentric amount between the holder and the processing target object held by the holder are shared by the holder and the modifying device.

公开(公告)号：US12142483B2

公开(公告)日：2024-11-12

申请号：US17295480

申请日：2019-11-11

Applicant: Tokyo Electron Limited

Inventor： Yoshihiro Kawaguchi ,  Seiji Nakano ,  Munehisa Kodama ,  Hirotoshi Mori ,  Hayato Tanoue ,  Yohei Yamawaki

IPC: H01L21/304 ,  B24B7/22 ,  H01L21/683

Abstract: A substrate processing apparatus configured to process a substrate includes a substrate holder configured to hold, in a combined substrate in which a first substrate and a second substrate are bonded to each other, the second substrate; a periphery removing unit configured to remove, starting from a periphery modification layer formed on the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate, the peripheral portion from the combined substrate held by the substrate holder; and a collection unit equipped with a collection mechanism configured to collect the peripheral portion removed by the periphery removing unit.