公开(公告)号：US20100124012A1

公开(公告)日：2010-05-20

申请号：US12620742

申请日：2009-11-18

申请人： Yoshihiro KONDO ,  Tadakatsu NAKAJIMA ,  Akio IDEI ,  Shigeyasu TSUBAKI ,  Hiroyuki TOYODA ,  Tomoo HAYASHI

发明人： Yoshihiro KONDO ,  Tadakatsu NAKAJIMA ,  Akio IDEI ,  Shigeyasu TSUBAKI ,  Hiroyuki TOYODA ,  Tomoo HAYASHI

IPC分类号： G06F1/20

CPC分类号： G06F1/20 ,  H05K7/20818

摘要： A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink. The second heat transmission member is disposed in the fan module unit, and a heat radiation member provided for the pipes forms an airflow passage together with the motherboard.

摘要翻译： 一种具有冷却能力的服务器系统，其可以应对可拆卸地安装在刀片服务器上的服务器模块的CPU产生的热量的增加。 服务器模块包括容纳其中安装有CPU，存储器等的母板的壳体和用于冷却由CPU产生的热的沸腾冷却装置的一部分。 容纳在风扇模块中的风扇适于通过服务器模块外壳的开口将空气吹入服务器模块。 沸腾冷却装置包括设置在服务器模块外壳中的第一传热构件，设置在服务器模块外壳外部的第二传热构件和连接它们的多个管道。 第一传热构件是具有用于气密地密封制冷剂的内部空间的盒体，其一个外部平面被热连接到CPU，而另一个外部平面设置有散热器。 第二传热构件设置在风扇模块单元中，并且用于管道的散热构件与主板一起形成气流通道。

公开(公告)号：US20100073865A1

公开(公告)日：2010-03-25

申请号：US12544137

申请日：2009-08-19

申请人： Tomoo HAYASHI ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

发明人： Tomoo HAYASHI ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

IPC分类号： G06F1/20

CPC分类号： G06F1/185 ,  G06F1/20 ,  H05K7/20772

摘要： An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.

摘要翻译： 电子设备包括：壳体; 叶片，其每一个都可从壳体拆卸，并且至少安装有CPU和存储器; 第一冷却装置，每个冷却装置取出在叶片外部的叶片中产生的热量，所述第一冷却装置中的每一个具有固定到叶片的细长柱形式的散热部分; 第二冷却装置固定到壳体以排出从壳体外部的第一冷却装置输送的热量，每个所述第二冷却装置具有能够容纳第一冷却装置的散热部分的吸热部分; 当散热部分插入到吸热部分中时，形成在散热部和吸热部之间的间隙流体连通的中间容器; 存储在每个介质储存器中的导热介质; 用于对导热介质加压以将导热介质供应到间隙的加压装置，以及形成在散热部分和吸热部分之间的可拆卸连接部分。