公开(公告)号：US20090302450A1

公开(公告)日：2009-12-10

申请号：US12094314

申请日：2006-10-30

申请人： Tomoshi Ohde ,  Fujio Kanayama ,  Mitsuru Adachi ,  Tetsunori Nimi ,  Hidetoshi Kusano ,  Yuji Nashitani

发明人： Tomoshi Ohde ,  Fujio Kanayama ,  Mitsuru Adachi ,  Tetsunori Nimi ,  Hidetoshi Kusano ,  Yuji Nashitani

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/3737 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.

摘要翻译： 提供一种半导体器件，其中提供了安装倒装芯片的半导体芯片的散热特性。 半导体器件设置有衬底，安装在衬底上的半导体倒装芯片，用于密封半导体倒装芯片周围的密封树脂层。 在半导体芯片周围形成用于密封半导体芯片的密封树脂层。 在该半导体装置中，半导体芯片的背面露出，相对于密封树脂层的上表面凸出。