公开(公告)号：US5463667A

公开(公告)日：1995-10-31

申请号：US53240

申请日：1993-04-28

申请人： Toshiaki Ichinose ,  Takanori Ninomiya ,  Asahiro Kuni ,  Kozo Nakahata ,  Toshimitsu Hamada ,  Toshihiko Ayabe

发明人： Toshiaki Ichinose ,  Takanori Ninomiya ,  Asahiro Kuni ,  Kozo Nakahata ,  Toshimitsu Hamada ,  Toshihiko Ayabe

IPC分类号： G01N23/04 ,  H01L21/66 ,  H01L23/50 ,  H05K3/34 ,  H05K13/08

CPC分类号： H05K13/08 ,  G01N23/04

摘要： A method and an apparatus for inspecting a soldered joint with an X-ray, the soldered joint being formed by soldering a lead to a surface of a substrate. The method may include moving the substrate so as to move the surface of the substrate in an XY plane to position the soldered joint at a desired position in the XY plane, rotating the substrate so as to rotate the surface of the substrate in the XY plane to position the soldered joint at a desired orientation in the XY plane, rotating an X-ray source and a detector about the soldered joint in both of two mutually perpendicular planes perpendicular to the XY plane while maintaining the X-ray source and the detector at fixed positions relative to each other to establish a desired oblique irradiation angle between an X-ray from the X-ray source and the lead on the surface of the substrate, irradiating the soldered joint with the X-ray from the X-ray source at the desired oblique irradiation angle such that the X-ray is transmitted through the soldered joint and the substrate, detecting the X-ray transmitted through the soldered joint and the substrate with the detector, the detector producing an output signal indicative of the detected X-ray, and determining a condition of the soldered joint based on the output signal of the detector. The apparatus may operate in the same fashion.

摘要翻译： 一种用X射线检测焊接接头的方法和装置，所述焊接接头通过将引线焊接到基板的表面而形成。 该方法可以包括移动基板以使基板的表面在XY平面中移动，以将焊接接头定位在XY平面中的期望位置，旋转基板以使基板的表面在XY平面中旋转 将焊接接头定位在XY平面中所需的取向上，使X射线源和检测器围绕焊接接头在与XY平面垂直的两个相互垂直的平面中旋转，同时将X射线源和检测器保持在 固定位置，以建立来自X射线源的X射线与衬底表面上的铅之间的期望的倾斜照射角度，用X射线源的X射线照射焊接接头 所需的倾斜照射角度，使得X射线透射通过焊接接头和基板，通过检测器检测透过焊接接头和基板的X射线，检测器产品 选择表示检测到的X射线的输出信号，以及基于检测器的输出信号确定焊接接头的状态。 该装置可以以相同的方式操作。