摘要:
There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm2) of a surface area of the colloidal particles; and a silica sol that the colloidal silica particles are dispersed in an organic solvent, a silica sol that the colloidal silica particles are dispersed in a polymerizable compound, and a silica sol that the colloidal silica particles are dispersed in a dicarboxylic anhydride.
摘要:
The present invention provides an epoxy curing agent comprising colloidal silica particles, which is a liquid having low viscosity and excellent transparency and is suitable as a curing agent for a resin composition for sealing optical semiconductor elements.The epoxy curing agent comprises colloidal silica particles with an average primary particle size of from 5 to 40 nm and a fully saturated dicarboxylic anhydride which is a liquid at 30° C., and it has a light transmittance of at least 60% at a wavelength of 500 nm for a light path length of 10 mm when the concentration of the colloidal silica particles is adjusted to 10 mass %.
摘要:
A process for producing a composition of a polymerizable organic compound containing silica particles characterized by comprising: (a) a process of preparing an amine-added organic solvent-dispersed silica sol, in which an amine compound is added to an organic solvent-dispersed silica sol that contains colloidal silica particles having an average primary particle size of 5 to 100 nm and that has a pH of 2.5 to 4.0 at 20° C. as measured in a diluted solution obtained by a method in which the same mass of the organic solvent-dispersed silica sol, methanol, and pure water are mixed together, so that the diluted solution obtained by the mixing method has a pH of 4.5 to 11.0 at 20° C.; and (b) a process of mixing the amine-added organic solvent-dispersed silica sol obtained in the process (a) with a polymerizable organic compound.
摘要:
There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm2) of a surface area of the colloidal particles; and a silica sol that the colloidal silica particles are dispersed in an organic solvent, a silica sol that the colloidal silica particles are dispersed in a polymerizable compound, and a silica sol that the colloidal silica particles are dispersed in a dicarboxylic anhydride.
摘要:
There is provided a liquid preparation for forming an epoxy resin having curing properties combining high transparency and high bending strength while maintaining advantageous handling properties as in a liquid state. A liquid preparation for forming an epoxy resin comprising: an A agent; and a B agent; wherein the A agent contains a modified epoxy resin (I) formed from at least one type of compound (i) having in a molecule thereof, at least one functional group of Formula (1): (where R1 and R2 individually represent an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group or a halogenated, aminated or nitrated derivative of any of the groups) and a compound (ii) having a glycidyl group in a molecule thereof, and an inorganic particle (II); and the B agent contains a curing agent (III). A liquid preparation for forming an epoxy resin comprising: an A′ agent; and a B′ agent; wherein the A′ agent contains the modified epoxy resin (I); and the B′ agent contains the inorganic particle (II) and the curing agent (III).
摘要:
There is provided a liquid preparation for forming an epoxy resin having curing properties combining high transparency and high bending strength while maintaining advantageous handling properties as in a liquid state. A liquid preparation for forming an epoxy resin comprising: an A agent; and a B agent; wherein the A agent contains a modified epoxy resin (I) formed from at least one type of compound (i) having in a molecule thereof, at least one functional group of Formula (1): (where R1 and R2 individually represent an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group or a halogenated, aminated or nitrated derivative of any of the groups) and a compound (ii) having a glycidyl group in a molecule thereof, and an inorganic particle (II); and the B agent contains a curing agent (III). A liquid preparation for forming an epoxy resin comprising: an A′ agent; and a B′ agent; wherein the A′ agent contains the modified epoxy resin (I); and the B′ agent contains the inorganic particle (II) and the curing agent (III).
摘要:
It is an object to provide a liquid thermosetting composition that yields an epoxy resin having physical properties of the cured product such as high flexural strength along with adequate handleability as liquid, to be used in transparent sealants for optical semiconductors, such as transparent sealants for LEDs (light-emitting devices) and the like. There is provided a thermosetting composition containing an epoxy compound that a side chain between a triazinetrione ring and an epoxy group substituted on the triazinetrione ring is long (elongated).
摘要:
There is provided a curable composition having a low viscosity and high cationic curability. A curable composition including an epoxy compound of Formula (1): [in Formula (1), A is a monocyclic aliphatic hydrocarbon group optionally containing an epoxy group; R1, R2, R3 and R4 are independently a hydrogen atom or a C1-10 alkyl group; n1 and n2 are independently an integer of 2 to 6; n3 and n4 are individually an integer of 2; and n5 and n6 are individually an integer of 1], and an acid generator.
摘要:
There is provided an epoxy compound that provides properties of cured products combining high transparency with high flexural strength by being thermally cured while maintaining advantageous handling properties in a liquid state thereof; and a method for producing a composition by using the epoxy compound. A method for producing an epoxy compound of Formula (1): (in Formula (1), n1, n2, and n3 are individually any one of integers of 2 to 6; n4, n5, and n6 are individually an integer of 2; n7, n8, and n9 are individually an integer of 1; and R1, R2, R3, R4, R5, and R6 are independently a hydrogen atom or a C1-10 alkyl group), including: reacting cyanuric chloride with a C4-8 alkenol and reacting the obtained compound having an unsaturated bond with a peroxide.
摘要:
A sulfamoyl compound of the general formulae (1): wherein R1 and R2 are each independently C1-4 alkyl, or R1 and R2 together are C4-6 alkylene or C4-6 alkyleneoxy, Y is H, halogen, C1-8 alkyl, C1-8 alkoxy, C1-8 alkylthio, C1-8 haloalkyl, C1-8 haloalkoxy or C1-8 haloalkylthio, A is a predetermined heterocyclic group, B is a predetermined heterocyclic group which is identical with or different from A, W is a chemical bond or O, V is O or S, D, E, F and G are each independently N, CR7, CR8, CR9 or CR10, and R3, R4, R5, R6, R7, R8, R9, R10 and R11 are each independently predetermined group such as H, or an unsubstituted or substituted aliphatic, aromatic or heterocyclic group. The sulfamoyl compound is useful as an agricultural and horticultural fungicide.