公开(公告)号：US10607964B2

公开(公告)日：2020-03-31

申请号：US15061989

申请日：2016-03-04

申请人： TOSHIBA MEMORY CORPORATION

发明人： Shinya Fukayama ,  Yukifumi Oyama ,  Keisuke Taniguchi

IPC分类号： H01L29/49 ,  H01L25/065 ,  H01L23/00

摘要： A semiconductor device includes a semiconductor chip in which a first bump is provided on a first surface, a plurality of first adhesives are provided on the first surface of the semiconductor chip, and a second adhesive is provided on the first surface of the semiconductor chip, and of which a layout area on the first surface is smaller than a layout area of the plurality of first adhesives. In comparison to a first adhesive that is farthest from the center or a moment of inertia of the first surface of the semiconductor chip among the plurality of the first adhesives, the second adhesive is provided farther from the center or the moment of inertia of the semiconductor chip.

公开(公告)号：US10217676B2

公开(公告)日：2019-02-26

申请号：US15233914

申请日：2016-08-10

申请人： Toshiba Memory Corporation

发明人： Shinya Fukayama ,  Naoyuki Komuta ,  Hiroshi Watabe

IPC分类号： H01L25/00 ,  H01L21/66 ,  H01L23/00

摘要： A method for manufacturing a semiconductor device including a plurality of semiconductor chips includes steps of placing, on a first semiconductor chip, a second semiconductor chip, such that a plurality of bumps is located between the first semiconductor chip and the second semiconductor chip, determining a distance between the first semiconductor chip and the second semiconductor chip, and determining whether or not the distance is within a predetermined range and stopping placement of additional chips if the distance is determined to be outside the predetermined range.