Laser scribing method and apparatus
    2.
    发明授权
    Laser scribing method and apparatus 有权
    激光划线方法和装置

    公开(公告)号:US08450638B2

    公开(公告)日:2013-05-28

    申请号:US12657807

    申请日:2010-01-28

    IPC分类号: B23K26/00

    摘要: To form a deeper scribed groove with less energy or to improve the scribing speed, without making the apparatus configuration complicated is intended. The present invention relates to a laser scribing method which includes: forming on a workpiece a plurality of beam spots arranged in a state being separated from one another along the scribing direction, and forming a linear scribed groove on the workpiece by moving the plurality of beam spots in the scribing direction. The plurality of beam spots are obtained from a laser beam of a single ray bundle.

    摘要翻译: 为了形成更少的能量的较深的划线槽或提高划线速度,不需要使装置配置复杂。 本发明涉及一种激光划线方法,它包括:在工件上形成沿着划线方向彼此分离的状态布置的多个光束点,并且通过移动多个光束在工件上形成线性刻划槽 划痕方向的斑点。 多个光斑是从单根光束的激光束获得的。

    Laser machining device wherein a position reference laser beam is used
besides a machining laser beam
    3.
    发明授权
    Laser machining device wherein a position reference laser beam is used besides a machining laser beam 失效
    激光加工设备,其中使用位置参考激光束使用加工激光束

    公开(公告)号:US5191187A

    公开(公告)日:1993-03-02

    申请号:US718514

    申请日:1991-06-21

    CPC分类号: B23K26/0853 B23K26/04

    摘要: A laser machining device comprises a position reference laser beam source (16) in addition to a machining laser beam source (11). A galvanometer scanner (13) has two reflecting surfaces, one for directing a machining laser beam to an object (14) as a machining beam spot and the other for directing a position reference laser beam as a position reference beam spot to a position reference pattern displayed on a liquid crystal display panel (18). The machining beam spot scans a surface of the object to treat the surface according to a machining pattern, to which the position reference pattern is transferred. When a common table (15) is used, transfer is preferably carried out in a ratio of one to one. It is possible to make an additional table carry the panel separately from the galvanometer and the object. In either event, the machining laser beam can have a higher power than the position reference laser beam.

    LASER SCRIBE PROCESSING METHOD
    4.
    发明申请
    LASER SCRIBE PROCESSING METHOD 有权
    激光可视化处理方法

    公开(公告)号:US20120261453A1

    公开(公告)日:2012-10-18

    申请号:US13261033

    申请日:2010-06-10

    IPC分类号: B23K26/067 C03B33/09

    摘要: A laser scribe processing method of forming a crack that runs along a scribe direction of a processing target substance uses a light source that emits a laser beam, and an optical system for irradiation that leads the laser beam onto the processing target substance, the method including: an emission step of emitting a laser beam from the light source; a splitting step of splitting the laser beam into an ordinary light component and an extraordinary light component having different travel directions; a light converging step of converging the ordinary light component and the extraordinary light component to form multiple pairs of beam spots; and an irradiation step of intermittently irradiating with the laser beam having multiple pairs of beam spots in a scribe direction of the processing target substance. For splitting the ordinary light component and the extraordinary light component in the splitting step, a birefringent prism disposed in the optical system for irradiation may be used.

    摘要翻译: 形成沿着处理对象物质的划线方向延伸的裂纹的激光划片处理方法使用发射激光的光源和将激光束导向处理对象物质的照射用光学系统,该方法包括 :从光源发射激光束的发射步骤; 将激光束分割为普通光分量和具有不同行进方向的非凡光分量的分离步骤; 会聚普通光分量和非常光分量以形成多对光束点的聚光步骤; 以及照射步骤,在处理对象物质的划线方向上间隔地照射具有多对光斑的激光束。 为了在分离步骤中分割普通光分量和非凡光分量,可以使用设置在用于照射的光学系统中的双折射棱镜。

    LASER IRRADIATION DEVICE AND LASER PROCESSING METHOD
    5.
    发明申请
    LASER IRRADIATION DEVICE AND LASER PROCESSING METHOD 有权
    激光辐射器件和激光加工方法

    公开(公告)号:US20120012758A1

    公开(公告)日:2012-01-19

    申请号:US13138402

    申请日:2010-05-26

    IPC分类号: G21K5/00

    摘要: Provided is a laser irradiation device for use in laser processing, and a laser processing method performed using the same. Provided is a laser irradiation device including: a light source that emits a laser beam; and an irradiation optical system which has one or a plurality of lenses, and is provided for light-guiding and light-converging of the laser beam emitted from the light source to the target substance, in which a birefringent material is used as a material entity of at least one lens of the irradiation optical system. Also provided is a laser processing method. The irradiation optical system may have a beam expander having a first lens that is a concave lens or a convex lens, and a second lens that is a convex lens, in the order along the laser-beam travel direction, the beam expander being configured so as to make the interval between the first lens and the second lens variable, in which a birefringent material may be used as a material entity of the first lens and/or the second lens. Thus, the interval between the lenses can be changed by a convenient operation, whereby relative positions between the plurality of beam waists (interval) can be easily regulated.

    摘要翻译: 提供了一种用于激光加工的激光照射装置和使用其的激光加工方法。 提供了一种激光照射装置,包括:发射激光束的光源; 以及照射光学系统,其具有一个或多个透镜,并且被提供用于将从光源发射的激光束的光引导和聚光到目标物质,其中使用双折射材料作为材料实体 的至少一个照射光学系统的透镜。 还提供了一种激光加工方法。 照射光学系统可以具有扩束器,其具有作为凹透镜或凸透镜的第一透镜和作为凸透镜的第二透镜,沿着激光束行进方向的顺序,扩束器被配置为 为了使第一透镜和第二透镜之间的间隔可变,其中可以使用双折射材料作为第一透镜和/或第二透镜的材料实体。 因此,可以通过方便的操作来改变透镜之间的间隔,从而可以容易地调节多个横梁之间的相对位置(间隔)。

    Laser machining apparatus using focusing lens-array
    6.
    发明授权
    Laser machining apparatus using focusing lens-array 失效
    激光加工设备采用聚焦透镜阵列

    公开(公告)号:US4950862A

    公开(公告)日:1990-08-21

    申请号:US420599

    申请日:1989-10-12

    IPC分类号: B23K26/06 B23K26/04 B23K26/08

    CPC分类号: B23K26/04

    摘要: A laser beam machining apparatus for finely machining a semiconductor circuit or similar workpiece on a stage including a scanning mirror for directing the beam, scanning lens for converting the beam to a beam substantially perpendicular to the workpiece, lens array unit and mask for focusing the beam, driving means for X-Y movement of the lens array unit and control means for controlling the mirror driving means and stage.

    摘要翻译: 一种激光束加工装置,用于在包括用于引导光束的扫描反射镜的台上精细加工半导体电路或类似工件,用于将光束转换成基本上垂直于工件的光束的扫描透镜,透镜阵列单元和掩模,用于聚焦光束 ,用于透镜阵列单元的XY运动的驱动装置和用于控制镜驱动装置和台的控制装置。

    Laser irradiation device and laser processing method
    7.
    发明授权
    Laser irradiation device and laser processing method 有权
    激光照射装置和激光加工方法

    公开(公告)号:US08988777B2

    公开(公告)日:2015-03-24

    申请号:US13138402

    申请日:2010-05-26

    IPC分类号: B23K26/06 B23K26/00 B23K26/40

    摘要: Provided is a laser irradiation device for use in laser processing, and a laser processing method performed using the same. Provided is a laser irradiation device including: a light source that emits a laser beam; and an irradiation optical system which has one or a plurality of lenses, and is provided for light-guiding and light-converging of the laser beam emitted from the light source to the target substance, in which a birefringent material is used as a material entity of at least one lens of the irradiation optical system. Also provided is a laser processing method. The irradiation optical system may have a beam expander having a first lens that is a concave lens or a convex lens, and a second lens that is a convex lens, in the order along the laser-beam travel direction, the beam expander being configured so as to make the interval between the first lens and the second lens variable, in which a birefringent material may be used as a material entity of the first lens and/or the second lens. Thus, the interval between the lenses can be changed by a convenient operation, whereby relative positions between the plurality of beam waists (interval) can be easily regulated.

    摘要翻译: 提供了一种用于激光加工的激光照射装置和使用其的激光加工方法。 提供了一种激光照射装置,包括:发射激光束的光源; 以及照射光学系统,其具有一个或多个透镜,并且被提供用于将从光源发射的激光束的光引导和聚光到目标物质,其中使用双折射材料作为材料实体 的至少一个照射光学系统的透镜。 还提供了一种激光加工方法。 照射光学系统可以具有扩束器,其具有作为凹透镜或凸透镜的第一透镜和作为凸透镜的第二透镜,沿着激光束行进方向的顺序,扩束器被配置为 为了使第一透镜和第二透镜之间的间隔可变,其中可以使用双折射材料作为第一透镜和/或第二透镜的材料实体。 因此,可以通过方便的操作来改变透镜之间的间隔,从而可以容易地调节多个横梁之间的相对位置(间隔)。

    Laser scribe processing method
    8.
    发明授权
    Laser scribe processing method 有权
    激光雕刻加工方法

    公开(公告)号:US08779327B2

    公开(公告)日:2014-07-15

    申请号:US13261033

    申请日:2010-06-10

    摘要: A laser scribe processing method of forming a crack that runs along a scribe direction of a processing target substance uses a light source that emits a laser beam, and an optical system for irradiation that leads the laser beam onto the processing target substance, the method including: an emission step of emitting a laser beam from the light source; a splitting step of splitting the laser beam into an ordinary light component and an extraordinary light component having different travel directions; a light converging step of converging the ordinary light component and the extraordinary light component to form multiple pairs of beam spots; and an irradiation step of intermittently irradiating with the laser beam having multiple pairs of beam spots in a scribe direction of the processing target substance. For splitting the ordinary light component and the extraordinary light component in the splitting step, a birefringent prism disposed in the optical system for irradiation may be used.

    摘要翻译: 形成沿着处理对象物质的划线方向延伸的裂纹的激光划片处理方法使用发射激光的光源和将激光束导向处理对象物质的照射用光学系统,该方法包括 :从光源发射激光束的发射步骤; 将激光束分割为普通光分量和具有不同行进方向的非凡光分量的分离步骤; 会聚普通光分量和非常光分量以形成多对光束点的聚光步骤; 以及照射步骤,在处理对象物质的划线方向上间隔地照射具有多对光斑的激光束。 为了在分离步骤中分割普通光分量和非凡光分量,可以使用设置在用于照射的光学系统中的双折射棱镜。

    Laser scribing method and apparatus
    9.
    发明申请
    Laser scribing method and apparatus 有权
    激光划线方法和装置

    公开(公告)号:US20110180519A1

    公开(公告)日:2011-07-28

    申请号:US12657807

    申请日:2010-01-28

    IPC分类号: B23K26/00

    摘要: To form a deeper scribed groove with less energy or to improve the scribing speed, without making the apparatus configuration complicated is intended. The present invention relates to a laser scribing method which includes: forming on a workpiece a plurality of beam spots arranged in a state being separated from one another along the scribing direction, and forming a linear scribed groove on the workpiece by moving the plurality of beam spots in the scribing direction. The plurality of beam spots are obtained from a laser beam of a single ray bundle.

    摘要翻译: 为了形成更少的能量的较深的划线槽或提高划线速度,不需要使装置配置复杂。 本发明涉及一种激光划线方法,它包括:在工件上形成沿着划线方向彼此分离的状态布置的多个光束点,并且通过移动多个光束在工件上形成线性刻划槽 划痕方向的斑点。 多个光斑是从单根光束的激光束获得的。