公开(公告)号：US20120175754A1

公开(公告)日：2012-07-12

申请号：US13246933

申请日：2011-09-28

申请人： Toshiki FURUTANI ,  Daiki KOMATSU ,  Nobuya TAKAHASHI ,  Masatoshi KUNIEDA ,  Naomi FUJITA ,  Koichi TSUNODA ,  Minetaka OYAMA ,  Toshimasa YANO

发明人： Toshiki FURUTANI ,  Daiki KOMATSU ,  Nobuya TAKAHASHI ,  Masatoshi KUNIEDA ,  Naomi FUJITA ,  Koichi TSUNODA ,  Minetaka OYAMA ,  Toshimasa YANO

IPC分类号： H01L25/07 ,  H01L23/495

CPC分类号： H05K1/185 ,  H01L21/4846 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/15313 ,  H05K1/162 ,  H05K3/4602 ,  H05K2201/10674

摘要： A wiring board including a core substrate made of an insulative material and having a penetrating portion, a first interlayer insulation layer formed on the surface of the core substrate, a first conductive circuit formed on the surface of the first interlayer insulation layer, a first via conductor formed in the first interlayer insulation layer, and an electronic component accommodated in the penetrating portion of the core substrate and including a semiconductor element, a bump body mounted on the semiconductor element, a conductive circuit connected to the bump body, an interlayer resin insulation layer formed on the conductive circuit, and a via conductor formed in the interlayer resin insulation layer. The first via conductor has a tapering direction which is opposite of a tapering direction of the via conductor in the electronic component.

摘要翻译： 一种布线板，包括由绝缘材料制成并具有穿透部分的芯基板，形成在芯基板的表面上的第一层间绝缘层，形成在第一层间绝缘层的表面上的第一导电电路， 形成在第一层间绝缘层中的导体和容纳在芯基板的穿透部分中并包括半导体元件的电子部件，安装在半导体元件上的凸块体，连接到凸块体的导电电路，层间树脂绝缘体 形成在导电电路上的层，以及形成在层间树脂绝缘层中的通孔导体。 第一通孔导体具有与电子部件中的通路导体的锥形方向相反的锥形方向。