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公开(公告)号：US08411409B2
公开(公告)日：2013-04-02
申请号：US13161535
申请日：2011-06-16
申请人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Syunsuke Takeuchi , Kiyoyasu Sakurada
发明人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Syunsuke Takeuchi , Kiyoyasu Sakurada
IPC分类号： H01G4/30
摘要： When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region.
摘要翻译： 当通过电镀形成层压陶瓷电容器等陶瓷电子部件的外部端子电极时，即使在不希望的位置也可能产生电镀生长。 由组件主体提供的陶瓷表面被构造为包括例如呈现较高镀层生长的例如钛酸钡系陶瓷的高镀层生长区域和例如锆酸锆的低镀层生长区域 其具有相对较低的电镀生长。 构成用于限定外部端子电极的基底的第一层的电镀膜以这样的方式形成，使得以由内部电极的暴露端作为起点设置的导电表面沉积的镀覆沉积物的生长被限制为不交叉 在高电镀生长区域和低电镀生长区域之间的边界朝向低电镀生长区域。
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公开(公告)号：US08630080B2
公开(公告)日：2014-01-14
申请号：US13411752
申请日：2012-03-05
IPC分类号： H01G4/002
CPC分类号： H01G4/005
摘要： An electronic component that is prevented from being inclined with respect to a circuit board during and after mounting includes a laminated body that is preferably configured by stacking a plurality of insulator layers, and includes a lower surface with depressions provided thereon. The lower surface includes a series of outer edges of the insulator layers. Capacitor electrodes are defined by internal conductors incorporated in the laminated body, which respectively have exposed sections that are exposed from between the insulator layers in the depressions on the lower surface. External electrodes, which are preferably formed directly by plating, are provided in the depressions to cover the exposed sections.
摘要翻译： 防止在安装期间和之后相对于电路板倾斜的电子部件包括优选地通过堆叠多个绝缘体层而构造的层叠体，并且包括设置有凹部的下表面。 下表面包括绝缘体层的一系列外边缘。 电容器电极由结合在层叠体中的内部导体限定，分别具有从下表面上的凹部中的绝缘体层之间露出的暴露部分。 优选通过电镀直接形成的外部电极设置在凹部中以覆盖暴露部分。
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3.发明授权公开(公告)号：US08587923B2
公开(公告)日：2013-11-19
申请号：US12788340
申请日：2010-05-27
申请人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
CPC分类号： H01G4/30 , H01G4/2325
摘要： A method for manufacturing a laminated electronic component includes the steps of preparing a laminated component main body, the component main body including internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a metal layer on exposed surfaces of the internal electrodes, applying a water repellant on a surface of the metal layer and a section of the external surface of the component main body at which an end edge of the metal layer is located, and then forming a conductive resin layer on the metal layer having the water repellant applied thereon.
摘要翻译： 层叠电子部件的制造方法包括以下步骤：制备层压部件主体，所述部件主体包括形成在其中的内部电极，并且每个内部电极部分地暴露在所述部件主体的外表面上，并且形成 外部端子电极，在外部端子电极与内部电极电连接。 形成外部端子电极的步骤包括以下步骤：在内部电极的暴露的表面上形成金属层，在金属层的表面上施加防水剂，以及在组件主体的外表面的一部分上， 定位金属层的端边缘，然后在其上施加斥水剂的金属层上形成导电树脂层。
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4.发明授权Laminated ceramic electronic component with directly plated external terminal electrodes and manufacturing method therefor 有权具有直接电镀外部端子电极的层压陶瓷电子部件及其制造方法公开(公告)号：US08547683B2
公开(公告)日：2013-10-01
申请号：US12821305
申请日：2010-06-23
申请人： Masahito Saruban , Makoto Ogawa , Toshiyuki Iwanaga , Seiichi Matsumoto , Akihiro Motoki , Shunsuke Takeuchi , Seiichi Nishihara , Kenichi Kawasaki
发明人： Masahito Saruban , Makoto Ogawa , Toshiyuki Iwanaga , Seiichi Matsumoto , Akihiro Motoki , Shunsuke Takeuchi , Seiichi Nishihara , Kenichi Kawasaki
CPC分类号： H01G4/2325 , H01G4/30 , H01L41/083 , H01L41/293
摘要： In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature.
摘要翻译： 在层叠陶瓷电子部件的制造方法中，在将外部端子电极的镀覆层通过在主体的主体的多个内部电极的各端露出的部件主体的端面上进行镀铜而形成后， 为了提高外部端子电极的附着强度和耐潮湿性而在800℃以上的温度下进行热处理时，可能会在镀层中产生空隙。 在其上形成有镀层的组件主体上，在约800℃以上的温度下进行热处理的步骤不仅包括保持顶部温度为约1000℃以上的步骤，还包括步骤 在保持顶部温度的步骤之前至少保持约600℃至900℃的温度。
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公开(公告)号：US08520362B2
公开(公告)日：2013-08-27
申请号：US13359519
申请日：2012-01-27
IPC分类号： H01G4/228
摘要： In a method of forming an external electrode by growing plated depositions on exposed ends of a plurality of internal electrodes in a component main body, the component main body is polished to increase exposure of the internal electrodes. To prevent decreased external electrode fixing strength, a radius of curvature is reduced to about 0.01 mm or less for an R chamfered section formed in a ridge section of the component main body during polishing by ion milling, and exposed ends of the internal electrodes are recessed from end surfaces of the component main body with a recess length of about 1 μm or less. Plating films to serve as external electrodes are formed to extend from the end surfaces of the component main body across the R chamfered section, and include end edges located on at least one of the principal surfaces and the side surfaces.
摘要翻译： 在通过在组件主体中的多个内部电极的露出端上生长镀覆形成外部电极的方法中，抛光组件主体以增加内部电极的曝光。 为了防止外部电极固定强度的降低，在通过离子铣削抛光时，在形成于部件主体的脊部的R倒角部分的曲率半径减小到约0.01mm以下，内部电极的露出端凹入 从组件主体的具有大约1um或更小的凹槽长度的端表面。 形成为用作外部电极的电镀膜，从组件主体的端面延伸穿过R倒角部分，并且包括位于至少一个主表面和侧表面上的端边缘。
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公开(公告)号：US20120243143A1
公开(公告)日：2012-09-27
申请号：US13411752
申请日：2012-03-05
IPC分类号： H01G4/00
CPC分类号： H01G4/005
摘要： An electronic component that is prevented from being inclined with respect to a circuit board during and after mounting includes a laminated body that is preferably configured by stacking a plurality of insulator layers, and includes a lower surface with depressions provided thereon. The lower surface includes a series of outer edges of the insulator layers. Capacitor electrodes are defined by internal conductors incorporated in the laminated body, which respectively have exposed sections that are exposed from between the insulator layers in the depressions on the lower surface. External electrodes, which are preferably formed directly by plating, are provided in the depressions to cover the exposed sections.
摘要翻译： 防止在安装期间和之后相对于电路板倾斜的电子部件包括优选地通过堆叠多个绝缘体层而构造的层叠体，并且包括设置有凹部的下表面。 下表面包括绝缘体层的一系列外边缘。 电容器电极由结合在层叠体中的内部导体限定，分别具有从下表面上的凹部中的绝缘体层之间露出的暴露部分。 优选通过电镀直接形成的外部电极设置在凹部中以覆盖暴露部分。
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公开(公告)号：US08139342B2
公开(公告)日：2012-03-20
申请号：US12466393
申请日：2009-05-15
IPC分类号： H01G4/228
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
摘要翻译： 层叠电子部件被配置为包括通过直接电镀设置在电子部件主体的外表面上的基板镀膜，使得外部端子电极与内部导体（内部电极）的露出部分连接，金属粒子的平均粒径 限定衬底镀膜至少约1.0μm。 外部端子电极包括设置在基板镀膜上的至少一层上镀层。 限定衬底镀膜的金属颗粒是Cu颗粒。
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公开(公告)号：US08797711B2
公开(公告)日：2014-08-05
申请号：US12632823
申请日：2009-12-08
IPC分类号： H01G4/228
摘要： A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.
摘要翻译： 在形成外部电极的电子部件中，通过直接对构成体的表面的特定区域进行电镀，能够精确地控制形成有构成外部电极的镀膜的区域。 在构成体中，在形成有外部电极的区域被分隔的位置设置凸块。 在电镀工艺中，构成外部电极的镀膜的生长在凸块中基本上停止或延迟。 结果，可以在凸块的位置上精确地控制构成外部电极的镀膜的生长终止点。
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公开(公告)号：US08730646B2
公开(公告)日：2014-05-20
申请号：US12466435
申请日：2009-05-15
摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
摘要翻译： 层叠电子部件包括外部端子电极，其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜，下部电镀膜通过直接电镀电子部件主体的外表面而形成，使得下部电镀膜为电气 连接到内部导体的暴露部分。 外部端子电极还可以包括形成在下部镀膜上的上部镀膜，上部镀膜由一层或多层限定。 限定上镀膜的金属粒子的平均粒径可以为0.5μm以下。 限定下镀层的金属颗粒可以是Cu颗粒。
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公开(公告)号：US08717739B2
公开(公告)日：2014-05-06
申请号：US13419545
申请日：2012-03-14
摘要： A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.
摘要翻译： 陶瓷电子部件包括大致矩形的陶瓷元件组件，第一外部电极和第二外部电极。 第一外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第一镀膜。 类似地，第二外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第二镀膜。 在平面图中，第一和第二电镀膜的每单位面积的表面积等于或大于约1.02。
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