摘要:
A memory array has a plurality of memory cells, arranged in a plurality of rows and columns. Each cell has at least four terminals. The array has a plurality of column lines with each column line connected to a first terminal of a different column of cells. The array also has a plurality of first row lines, with each first row line connected to a second terminal of a different row of cells. The array also has a plurality of second row lines, with each second row line connected to a third terminal of a different row of cells. Finally, the array has a plurality of third row lines with each third row line connected to a fourth terminal of a different row of cells. A column decoder is connected to the plurality of column lines. A first row decoder is connected to the plurality of first row lines. A second row decoder is connected to the plurality of second row lines. A third row decoder is connected to the plurality of third row lines. During an operation of a selected cell, the column decoder selects one of the plurality of column lines, with the one column line selected connected to the first terminal of the selected cell. The first row decoder selects one of the plurality of first row lines with the one first row line selected connected to the second terminal of the selected cell. The second row decoder selects a first plurality of second row lines, with one of the first plurality of second row lines connected to the third terminal of the selected cell. The third row decoder selects a second plurality of third row lines, with one of the second plurality of third row lines connected to the fourth terminal of the selected cell. Finally, the first plurality of second row lines, other than the one second row line, are connected to cells arranged in rows other than rows of cells to which the second plurality of third row lines are connected. The interconnection minimizes programming disturbance.
摘要:
A memory array has a plurality of memory cells, arranged in a plurality of rows and columns. Each cell has at least four terminals. The array has a plurality of column lines with each column line connected to a first terminal of a different column of cells. The array also has a plurality of first row lines, with each first row line connected to a second terminal of a different row of cells. The array also has a plurality of second row lines, with each second row line connected to a third terminal of a different row of cells. Finally, the array has a plurality of third row lines with each third row line connected to a fourth terminal of a different row of cells. A column decoder is connected to the plurality of column lines. A first row decoder is connected to the plurality of first row lines. A second row decoder is connected to the plurality of second row lines. A third row decoder is connected to the plurality of third row lines. During an operation of a selected cell, the column decoder selects one of the plurality of column lines, with the one column line selected connected to the first terminal of the selected cell. The first row decoder selects one of the plurality of first row lines with the one first row line selected connected to the second terminal of the selected cell. The second row decoder selects a first plurality of second row lines, with one of the first plurality of second row lines connected to the third terminal of the selected cell. The third row decoder selects a second plurality of third row lines, with one of the second plurality of third row lines connected to the fourth terminal of the selected cell. Finally, the first plurality of second row lines, other than the one second row line, are connected to cells arranged in rows other than rows of cells to which the second plurality of third row lines are connected. The interconnection minimizes programming disturbance.
摘要:
A flash memory cell is of the type having a substrate of a first conductivity type having a first region of a second conductivity type at a first end, and a second region of the second conductivity type at a second end, spaced apart from the first end, with a channel region between the first end and the second end. The flash memory cell has a plurality of stacked pairs of floating gates and control gates with the floating gates positioned over portions of the channel region and are insulated therefrom, and each control gate over a floating gate and insulated therefrom. The flash memory cell further has a plurality of erase gates over the channel region which are insulated therefrom, with an erase gate between each pair of stacked pair of floating gate and control gate. In a method of erasing the flash memory cell, a pulse of a first positive voltage is applied to alternating erase gates (“first alternating gates”). In addition, a ground voltage is applied to erase gates other than the first alternating gates (“second alternating gates”). In a second method to erase the flash memory cell, a pulse of a first positive voltage is applied to the first alternating gates and a negative voltage is applied to the second alternating gates and to all control gates.
摘要:
A flash memory cell is of the type having a substrate of a first conductivity type having a first region of a second conductivity type at a first end, and a second region of the second conductivity type at a second end, spaced apart from the first end, with a channel region between the first end and the second end. The flash memory cell has a plurality of stacked pairs of floating gates and control gates with the floating gates positioned over portions of the channel region and are insulated therefrom, and each control gate over a floating gate and insulated therefrom. The flash memory cell further has a plurality of erase gates over the channel region which are insulated therefrom, with an erase gate between each pair of stacked pair of floating gate and control gate. In a method of erasing the flash memory cell, a pulse of a first positive voltage is applied to alternating erase gates (“first alternating gates”). In addition, a ground voltage is applied to erase gates other than the first alternating gates (“second alternating gates”). In a second method to erase the flash memory cell, a pulse of a first positive voltage is applied to the first alternating gates and a negative voltage is applied to the second alternating gates and to all control gates.
摘要:
A flash memory cell is of the type having a substrate of a first conductivity type having a first region of a second conductivity type at a first end, and a second region of the second conductivity type at a second end, spaced apart from the first end, with a channel region between the first end and the second end. The flash memory cell has a plurality of stacked pairs of floating gates and control gates with the floating gates positioned over portions of the channel region and are insulated therefrom, and each control gate over a floating gate and insulated therefrom. The flash memory cell further has a plurality of erase gates over the channel region which are insulated therefrom, with an erase gate between each pair of stacked pair of floating gate and control gate. In a method of erasing the flash memory cell, a pulse of a first positive voltage is applied to alternating erase gates (“first alternating gates”). In addition, a ground voltage is applied to erase gates other than the first alternating gates (“second alternating gates”). In a second method to erase the flash memory cell, a pulse of a first positive voltage is applied to the first alternating gates and a negative voltage is applied to the second alternating gates and to all control gates.
摘要:
A flash memory cell is of the type having a substrate of a first conductivity type having a first region of a second conductivity type at a first end, and a second region of the second conductivity type at a second end, spaced apart from the first end, with a channel region between the first end and the second end. The flash memory cell has a plurality of stacked pairs of floating gates and control gates with the floating gates positioned over portions of the channel region and are insulated therefrom, and each control gate over a floating gate and insulated therefrom. The flash memory cell further has a plurality of erase gates over the channel region which are insulated therefrom, with an erase gate between each pair of stacked pair of floating gate and control gate. In a method of erasing the flash memory cell, a pulse of a first positive voltage is applied to alternating erase gates (“first alternating gates”). In addition, a ground voltage is applied to erase gates other than the first alternating gates (“second alternating gates”). In a second method to erase the flash memory cell, a pulse of a first positive voltage is applied to the first alternating gates and a negative voltage is applied to the second alternating gates and to all control gates.
摘要:
Self-aligned split-gate NAND flash memory cell array and process of fabrication in which rows of self-aligned split-gate cells are formed between a bit line diffusion and a common source diffusion in the active area of a substrate. Each cell has control and floating gates which are stacked and self-aligned with each other, and erase and select gates which are split from and self-aligned with the stacked gates, with select gates at both ends of each row which partially overlap the bit line the source diffusions. The channel regions beneath the erase gates are heavily doped to reduce the resistance of the channel between the bit line and source diffusions, and the floating gates are surrounded by the other gates in a manner which provides significantly enhanced high voltage coupling to the floating gates from the other gates. The memory cells are substantially smaller than prior art cells, and the array is biased so that all of the memory cells in it can be erased simultaneously, while programming is bit selectable.
摘要:
NAND flash memory cell array and fabrication process in which control gates and floating gates are stacked in pairs arranged in rows between a bit line diffusion and a common source diffusion, with select gates on both sides of each of the pairs of stacked gates. The gates in each stacked pair are self-aligned with each other and
摘要:
Self-aligned split-gate NAND flash memory cell array and process of fabrication in which rows of self-aligned split-gate cells are formed between a bit line diffusion and a common source diffusion in the active area of a substrate. Each cell has control and floating gates which are stacked and self-aligned with each other, and erase and select gates which are split from and self-aligned with the stacked gates, with select gates at both ends of each row which partially overlap the bit line the source diffusions. The channel regions beneath the erase gates are heavily doped to reduce the resistance of the channel between the bit line and source diffusions, and the floating gates are surrounded by the other gates in a manner which provides significantly enhanced high voltage coupling to the floating gates from the other gates. The memory cells are substantially smaller than prior art cells, and the array is biased so that all of the memory cells in it can be erased simultaneously, while programming is bit selectable.
摘要:
Flash memory and process of fabrication in which memory cells are formed with select gates in trenches between stacked, self-aligned floating and control gates, with buried source and drain regions which are gated by the select gates. Erase paths are formed between projecting rounded edges of the floating gates and the select gates, and programming paths extend from the mid-channel regions between the select gates and floating gates through the gate oxide to the edges of the floating gates. Trenched select gates can be provided on one or both sides of the floating and control gates, depending upon array architecture, and the stacked gates and dielectric covering them are used as a self-aligned mask in etching the substrate and other materials to form the trenches.